• Thursday | 26 March 2026
BrainChip Named Technology Sponsor for 2025–2026 Raytheon Autonomous Vehicle Competition

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, announced its role as the official Technology Sponsor for the 2025-2026 Raytheon Autonomous Vehicle Competition (AVC). The Raytheon AVC, themed “Operation Touchdown,” challenges undergraduate engineering teams from ac...

2 Mar 2026 | Monday | NEWS
MaxLinear Showcases Sierra SoC for Next-Generation Open RAN Radios at MWC 2026

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will demonstrate its newest advancements in RAN radio technologies at MWC Barcelona 2026. Attendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of how MaxLinear’s Sierra single-chip radio SoC helps OEMs develop new innovative Open RAN Radio Units (O-RUs) addressing...

2 Mar 2026 | Monday | NEWS
Magnachip Semiconductor Corporation Launches 7th-Gen 24V MOSFET for Tri-Fold Smartphones

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of its new 7th-generation 24V MXT LV MOSFET1 specifically designed for battery protection circuits in next-generation tri-fold smartphones, strengthening its presence in the premium foldable smartphone market. The product is now in mass production and is currently being supplied to a major global smar...

27 Feb 2026 | Friday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches 135°C Photorelays for Automotive Chip Testing

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four voltage-driven photorelays, “TLP3407SRB,” “TLP3412SRB,“ ”TLP3412SRHB,“ and “TLP3412SRLB” housed in the small S-VSON4T package. The new photorelays deliver a maximum operating temperature rating of 135°C for equipment that operates at high temperatures. Volume ...

27 Feb 2026 | Friday | NEWS
First Solar, Inc. Secures Perovskite Patent License from Oxford Photovoltaics Limited

First Solar, Inc. (Nasdaq: FSLR) (“First Solar” or “the Company”) announced a patent licensing agreement that gives it access to existing issued patents and currently pending patent applications of Oxford Photovoltaics Limited (“Oxford PV”) The non-exclusive license paves the way for First Solar, the largest solar manufacturer in the Western Hemisphere and the ...

27 Feb 2026 | Friday | NEWS
MIPI Alliance Upgrades UniPro and M-PHY to Power Next-Gen UFS 5.0 Chips

The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, announced major updates to two of its foundational specifications. MIPI UniPro v3.0 and MIPI M-PHY v6.0 offer significant performance, latency and power-efficiency improvements for next-generation JEDEC Universal Flash S...

27 Feb 2026 | Friday | NEWS
Findchips Launches Tariff Estimator for Semiconductor Component Sourcing

Supplyframe’s Findchips launched its Tariff Estimator across a wide range of parts in the vast Findchips catalog. This groundbreaking new feature empowers engineers and sourcing professionals to translate Harmonized Tariff Schedule (HTS) and Harmonized System (HS) codes and country-of-origin details into estimated tariff duty rates for imports into the U.S., providing a cost range for sourci...

26 Feb 2026 | Thursday | NEWS
Airspan Networks Holdings LLC Launches AirUnity Small Cells Powered by EdgeQ Chip

Airspan Networks Holdings LLC (“Airspan”), a leading global provider of wireless network solutions, announced the launch of AirUnity Small Cells, a next-generation small cell portfolio designed to help mobile network operators (MNOs) and enterprises expand 4G and 5G coverage and capacity through targeted deployments that support scalable network densification across diverse indoor and ...

26 Feb 2026 | Thursday | NEWS
The Chemours Company Executive Joins SEMI North America Advisory Board

The Chemours Company (Chemours) (NYSE: CC), a global chemistry company, announced that Gerardo Familiar, President of the company's APM business, has been appointed to the SEMI North America Advisory Board (NAAB). SEMI is a global industry association serving thousands of member companies across the semiconductor and electronics design and manufacturing supply chain. The SEMI N...

25 Feb 2026 | Wednesday | NEWS
SambaNova Systems Unveils SN50 AI Chip, Plans Strategic Collaboration with Intel

SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...

25 Feb 2026 | Wednesday | NEWS
Apple Inc. Expands U.S. Chip and Semiconductor Manufacturing in Houston

Apple® announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini® to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple’s Houston operations will create thousands...

25 Feb 2026 | Wednesday | NEWS
KIOXIA America, Inc. Begins Shipping UFS 5.0 Evaluation Samples

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2. UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equip...

25 Feb 2026 | Wednesday | NEWS
proteanTecs and Gubo Technologies Partner to Enhance AI Chip Visibility

proteanTecs®, a leading provider of deep data health and performance monitoring solutions for advanced electronics, and Gubo Technologies Co., Ltd., China’s first post silicon workflow automation solution provider, today announced a collaboration to deliver combined semiconductor analytics solutions. The collaboration is intended to provide broad, actionable insights into yield, quality,...

25 Feb 2026 | Wednesday | NEWS
Fractilia Secures First Production Deployment of FAME 300 System

Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...

25 Feb 2026 | Wednesday | NEWS
Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS
Powerchip Semiconductor Manufacturing Company Partners with Intel and SoftBank to Develop AI Memory Alternative

Powerchip Semiconductor Manufacturing Company (PSMC) has joined forces with major technology players, including Intel and SoftBank, in a collaborative effort to develop an alternative memory solution to high-bandwidth memory (HBM) for artificial intelligence applications. The initiative aims to reduce reliance on existing memory technologies and strengthen supply chain resilience for next-generati...

24 Feb 2026 | Tuesday | NEWS
SPIE and Cadence Design Systems, Inc. Establish Ya-Chieh Lai Memorial Scholarship

SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS
Draper and Northeast Microelectronics Coalition Partner to Accelerate Lab-to-Fab Transitions

Draper and the Northeast Microelectronics Coalition (NEMC) announced that Draper will provide advisory services and support to startups and small companies within NEMC's membership to de-risk and accelerate lab-to-fab technology transition. The formal introduction will be made at the 2026 Microelectronics Commons Annual Meeting in Washington, D.C. These services build upon the NEMC's Po...

23 Feb 2026 | Monday | NEWS
AI Trading Agents Post 108% Gains in Semiconductor Rally

Tickeron has reported notable outperformance from its artificial intelligence trading agents focused on the semiconductor sector, with certain strategies generating returns exceeding 100 per cent. The results reflect heightened investor interest in chipmakers and equipment suppliers amid continued momentum in AI-driven technologies. According to the company, its AI-based trading models achieved s...

23 Feb 2026 | Monday | NEWS

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