Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, announced the industry’s leading HBM4E Memory Controller IP, extending its market leadership in HBM IP. This new solution delivers breakthrough performance with advanced reliability features, enabling designers to address the demanding memory bandwidth requirements of next-gen...
Panmnesia, a provider of advanced link solutions, announced that it has signed a Memorandum of Understanding (MOU) with Openchip, a European AI accelerator design company, at MWC26 in Barcelona. The agreement focuses on technical collaboration related to AI/HPC infrastructure. The agreement marks a step toward technical collaboration aimed at enhancing performance, scalability, and resource effic...
Noble Machines Inc., formerly Under Control Robotics, announced its emergence from stealth with its first deployment of industrial general-purpose robots shipped to a Fortune Global 500 customer within 18 months of the company's launch. Founded in 2024 by a team of engineers from Apple, SpaceX, NASA, and Caltech, Noble Machines operates on the belief that AI must prove itself in real industrial op...
indie Semiconductor, Inc. (“indie,” “we,” or “our”) (NASDAQ: INDI), an automotive solutions innovator, announced that it plans to offer, subject to market and other conditions, $150.0 million aggregate principal amount of its Convertible Senior Notes due 2031 (the “notes”) through a private offering (the “offering”) to persons reasonably ...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) ...
indie Semiconductor, Inc. (“indie,” “we,” or “our”) (NASDAQ: INDI), an automotive solutions innovator, announced the pricing of its offering of $150.0 million aggregate principal amount of its 4.00% Convertible Senior Notes due 2031 (the “notes”) through a private offering (the “offering”) to persons reasonably believed to be qualif...
BBTech Co., Ltd. ("BBTech"), a Korean provider of semiconductor hook-up and high-purity flow system engineering solutions, and ARKITEKT EQUITY ("ARKITEKT"), a technology-focused private equity firm, announced a strategic partnership to support the expansion of semiconductor infrastructure across key global markets. Founded in South Korea, BBTech has established itself as a mission-critical infras...
QuickLogic Corporation (NASDAQ: QUIK) ("QuickLogic" or the "Company"), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs, and Endpoint AI solutions, announced its financial results for the fiscal fourth quarter that ended December 28, 2025. Recent Highlights Expanded U.S. Strategic Radiation Hardened (SRH) FPGA government program, increasing total contract ceiling to approximately...
Longsys (301308.SZ), a leading branded semiconductor memory enterprise, is showcasing its latest embedded integrated storage solutions at MWC 2026. Under the theme "AI Storage for the Mobile World", the company is demonstrating how its next-generation offerings empower the shift from basic functionality to high-performance, precision-driven storage for on-device AI. The comprehensive por...
MWC26 – As satellite connectivity rapidly becomes the most strategically important and disruptive extension of the 5G network, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced PentaG-NTN™, a new 5G-NTN (Non-Terrestrial Networks) modem IP subsystem purpose-built for satellite user terminals supporting LEO and ME...
As the global mobility industry accelerates toward electrification and intelligent transformation, Taiwan is emerging as a key force shaping the next era of transportation. With world-leading capabilities in semiconductors, automotive electronics, and ICT integration, Taiwan continues to drive innovation across the global mobility value chain. The Taiwan External Trade Development Council (TAITRA...
As the global electronics manufacturing sector faces the dual challenges of capacity volatility and geoeconomic supply fragmentation, YY-IC, a leading digital ecosystem for electronic component procurement and risk management, announced the formal integration of the ISO 9001 Quality Management System into its global operations. According to YY-IC Supply Chain Intelligence Data...
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver secure, global connectivity as networks and satellite NTN evolve. "Nordic is building the next era of cellular IoT, and we are expanding our portfolio to ...
Xsensio SA, a Swiss deep-tech company pioneering near real-time continuous biochemical monitoring, announced the successful closing of a $7M oversubscribed Series A financing round. The round was led by San Francisco-based venture capital firm WI Harper, with participation from Privilège Ventures, the European Innovation Council, and private investors across the United States, Europe, and A...
MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") has announced plans to develop a compact optical module for 3D non-contact fingerprint biometrics, designed to support future smartphone integration possibilities. The project enhances the Company's existing 3D sensing technology by reducing optical stack size and incorporating elec...
MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will showcase a growing range of commercially available Open RAN Radio Units (O-RU) based on its Sierra single‑chip radio SoC at Mobile World Congress (MWC) 2026 in Barcelona. ttendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of several new Sierra-powered O-RUs, in...
Micron Technology, Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India. The state-of-the-art facility converts advanced DRAM and NAND wafers from Micron's global manufacturing network into finished memory and storage products. Once fully ramped, the first phase of Micron’s Sanand operation will feature more than 500,000 square f...
Surge Components, Inc. (“Surge” or the “Company”) (OTC Pink: SPRS), a leading supplier of capacitors, discrete semiconductors, switches, and audible/sounding devices, announced financial results for the fiscal year ended November 30, 2025. Operational Highlights Continues to strengthen its distribution sales channel, with distribution partners remaining a key growt...
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the devel...
MP Materials Corp. (NYSE: MP) today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus. Located less than 10 miles from MP’s existing Independence facility in Fort Worth, the new campus will cement North Texas as the center of gravity for the United States’ rare ea...