• Sunday | 08 February 2026
BrainChip Secures $25M to Advance Akida Neuromorphic AI Platform and Scale Product Portfolio

-BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, secured a capital raise of $25 million to fuel the development and commercialization of its neuromorphic AI technology and expansion of its product offerings in chips and modules. BrainChip is expanding its product portfolio t...

12 Dec 2025 | Friday | NEWS
Nordic Semiconductor Launches nRF9151 SMA Development Kit for Next-Gen Cellular IoT and Satellite Connectivity

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces the launch of the nRF9151 SMA Development Kit (DK), a specialized DK for RF engineers developing cellular IoT, DECT NR+, and Non-Terrestrial Network (NTN) applications. Alongside the hardware release, Nordic has launched new modem firmware that adds NTN (satellite) support to the nRF9151 module – ...

12 Dec 2025 | Friday | NEWS
ESA Taps Sivers Semiconductors to Tackle Power and Complexity Challenges in SATCOM Phased Arrays

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced it has been awarded a new development program by the European Space Agency (ESA). The contract, valued at approximately USD $900,000, will span 18 months and support the development of next-generation satellite communication (SATCOM) beamforming integrated circuits (BFICs). "As the only ...

12 Dec 2025 | Friday | NEWS
VisIC Technologies Secures $26M in Round B Funding to Accelerate GaN Power Innovation for Next-Gen EVs

VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility,  announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, with HKMC joining as a strategic investor. This milestone reinforces VisIC's position at the forefront of GaN innovation for EV traction inverters and...

12 Dec 2025 | Friday | NEWS
Virtusa Acquires SmartSoC to Accelerate AI-Driven Chip Design Innovation

Strategic acquisition positions Virtusa at the forefront of AI and chip design innovation to meet surging demand for advanced silicon Virtusa Corporation, a global product and platform engineering services company, announced the strategic acquisition of SmartSoC Solutions (SmartSoC), a leader in semiconductor engineering and integrated circuit (IC) design services. This acquisition marks a pivo...

11 Dec 2025 | Thursday | NEWS
Lumotive Accelerates Global Expansion as Demand Surges for Its Programmable Optics Platform

  Lumotive, a pioneer in programmable optical semiconductor,  announced major global expansion and key leadership hires to meet the surging demand for its Light Control Metasurfaces (LCM™) platform across robotics, industrial automation, and smart-infrastructure markets. The company expanded its workforce by 50% in 2025 and opened new sites in Oman and Taiwan to advance adoption...

11 Dec 2025 | Thursday | NEWS
EMASS–Semtech Alliance Accelerates Autonomous Edge AI with Long-Range, Ultra-Low-Power Connectivity

  EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology,  announced a strategic collaboration with Semtech to bring low-power edge AI solutions integrated with LoRaWAN® connectivity to market. EMASS's ECS-DoT AI-enabled system-on-chips (SoCs) integrate Semtech's LoRa® transceivers, enabling long-range, battery-efficient intelligence for industrial,...

11 Dec 2025 | Thursday | NEWS
SoftBank Arm To Establish Chip Design Training Centre In South Korea

Arm Holdings, the global chip design powerhouse owned by SoftBank Group, has announced plans to establish a dedicated chip design training facility in South Korea under an agreement with the country national industry ministry. The new centre will focus on developing advanced semiconductor design capabilities by training around 1400 specialist engineers. The initiative is aligned wit...

9 Dec 2025 | Tuesday | NEWS
 Tata Electronics Secures Intel As First Major Customer For India Chip Manufacturing Ambition

  Tata Electronics has signed Intel as the first major customer for its ambitious semiconductor manufacturing programme, marking a decisive milestone in India’s journey to become a global chipmaking hub. The agreement underpins Tata Group’s planned investment of USD 14 billion to build India’s first advanced semiconductor fabrication facility in Gujarat, alongsid...

9 Dec 2025 | Tuesday | NEWS
TSMC Lifts Full Year Revenue Forecast As Global AI Spending Accelerates

Taiwan Semiconductor Manufacturing Company, the world’s largest advanced semiconductor foundry, has revised its full year revenue outlook upwards, citing sustained momentum in artificial intelligence driven investments across the global technology landscape. The company highlighted robust demand for high performance computing, advanced logic chips and AI centric workloads as the primary d...

9 Dec 2025 | Tuesday | NEWS
Rigaku Launches XTRAIA MF-3400 to Enable Nanoscale Film Measurement for Next-Generation Semiconductor Manufacturing

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhan...

8 Dec 2025 | Monday | NEWS
Cyient Semiconductors Qualified for Key Technology IP Contract in SCL’s ₹4,500-Crore Modernization Program

Company Set to Play a Key Role in Strengthening India's Custom Silicon Capabilities  Cyient Semiconductors, a leader in custom ASIC turnkey and intelligent power solutions, announced that it has been qualified for a pivotal contract for the supply and qualification of technology IPs, including design enablement, for the ₹4,500-crore modernization initiative at the Semi-Conductor Laborato...

8 Dec 2025 | Monday | NEWS
UMC and Polar Semiconductor Sign MOU to Boost U.S. Chip Manufacturing

United Microelectronics Corporation (NYSE: UMC: TWSE: 2303)(“UMC”), a leading global semiconductor foundry, and Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, announced they have signed a Memorandum of Understanding (MOU) to explore collaboration on delivering scalable U.S.-based 8-inch p...

5 Dec 2025 | Friday | NEWS
Cognite Opens New Global Headquarters in Tempe Arizona Marking Major Expansion in North America

Cognite, the global leader in Industrial AI,  announced the official grand opening of its new global headquarters in Tempe, Arizona. The relocation from Oslo, Norway marks a milestone in the company's growth strategy and underscores its commitment to the North American market. "Establishing our global headquarters in Arizona represents an exciting new chapter for Cognite as this positions ...

5 Dec 2025 | Friday | NEWS
Wizerr AI Launches Agentic BOM Engine Powered by Its Patent-Pending Component Intelligence Engine ELX

Wizerr AI today introduced the Agentic BOM Engine, powered by Wizerr’s patent-pending component intelligence engine (ELX). ELX reads and interprets complex component datasheets with engineer-level precision and scales that capability to millions of components, turning unstructured documents into AI-transformed, reasoning-ready data for multi-agent workflows across the electronics manufactu...

5 Dec 2025 | Friday | NEWS
Vinci Emerges From Stealth With $46M Funding to Launch Physics-Driven AI Platform Delivering 1,000× Faster Hardware Simulations

-Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round led by Eclipse. The company has unveiled a physics-driven AI system that operates like a team of hardware engineers, running thousands of verified simulations in hours, not weeks. Vinci was founde...

4 Dec 2025 | Thursday | NEWS
Alpha and Omega Semiconductor Launches AOLV66935 High-SOA 100V MOSFET for 48V Hot-Swap in Next-Generation AI Servers

-Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOLV66935 a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8x8 package. AOS’ latest MOSFET is designed as an ideal solution for 48V Hot Swap architectur...

4 Dec 2025 | Thursday | NEWS
Marvell Technology to Acquire Celestial AI in $3.25 Billion Deal to Accelerate Optical Scale-Up Connectivity for Next-Generation AI Data Centers

Celestial AI’s breakthrough Photonic FabricTM technology platform enables optical I/O for package, system and rack-level connectivity for the next-generation of data center infrastructure Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions,  announced it has entered into a definitive agreement to acquire Celestial AI, a pioneer of a disruptive ...

4 Dec 2025 | Thursday | NEWS
SEEQC Partners With Taiwan’s ITRI to Build Dedicated Manufacturing Line for Superconducting Quantum Control Chips

SEEQC, the digital quantum computing company developing a fully digital, chip-based quantum computing platform,  announced a manufacturing partnership with Taiwan's Industrial Technology Research Institute (ITRI). Together, SEEQC and ITRI will construct a state-of-the-art process line dedicated to manufacturing SEEQC's proprietary Single Flux Quantum (SFQ) superconducting control chips, fur...

3 Dec 2025 | Wednesday | NEWS
Murata Launches 1.25kV C0G MLCC in Compact 1210 Size for SiC-Based Power Systems

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making ...

3 Dec 2025 | Wednesday | NEWS

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