OMRON Electronic Components announced the launch of the B5T-007003 Human Vision Component (B5T HVC-P2), a module specialised for human body detection in cleanroom environments where workers wear protective garments. As robotics and autonomous mobile robots (AMRs) become more deeply integrated into semiconductor, inspection, and food processing facilities to maintain productivity an...
Polymatech Electronics, a leading innovator in semiconductor and optoelectronic technologies, will showcase its state-of-the-art Chip-on-Board (COB) LED solutions at Light + Building 2026, the world's leading trade fair for lighting and building services technology, taking place in Frankfurt, Germany. Visitors are invited to explore Polymatech's latest LED innov...
According to Mordor Intelligence, the 5G chipset market is witnessing rapid expansion, driven by increasing global 5G deployment and demand for high-speed connectivity solutions. The 5G chipset market is projected to grow from USD 33.40 billion in 2025 to USD 39.63 billion in 2026, reaching USD 93.05 billion by 2031, with a CAGR of 18.66% over the forecast period. The strong 5...
pSemi, a global leader in capacitor switching power architectures and Murata company, made two major product announcements—the PE26100 multi-level buck converter for direct charging applications and the PE25304 advanced integrated charge pump switching-capacitor power module—that promise to revolutionise the mobile battery charging industry and enable high-efficienc...
Lumotive, a pioneer in programmable optical semiconductor technology, announced a landmark breakthrough with the successful demonstration of the world's first programmable two-dimensional (2D) photonic beamforming chip based on its Light Control Metasurface (LCM™) architecture. This leapfrog advance in semiconductor-based photonics enables electronic control of light across two dimensions w...
Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed”) announced that on March 19, 2026, it entered into separate, privately negotiated subscription agreements with investors pursuant to which Wolfspeed will place (i) $379,000,000 aggregate principal amount of its 3.5% Convertible 1.5 Lien Senior Secured Notes due 2031 (the “Notes”) and (ii) 3,250,030 shares of common stock, at a purch...
APEC 2026 — In booth 2218, SimpleChips Technology Inc., a global provider of analogue and mixed-signal application-specific integrated circuits (ASICs) for automotive, medical, industrial and aerospace applications, announced the availability of the 18SCT005, the industry’s first 1200V high-voltage monitor IC. With a superior output accuracy of 0.7%, this monolithic IC is ide...
BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a leading developer of ultra-low-power, fully digital, event-based neuromorphic AI, announced a strategic collaboration with ForwardEdge ASIC, a wholly owned subsidiary of Lockheed Martin (NYSE: LMT) specialising in advanced ASIC architecture and microelectronics development. Together, the companies are combining best-in-class AI ...
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials res...
Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...
Semiconductor equipment supplier E&R Engineering Corp. (8027.TW) announced its new office in Hillsboro, Portland. Following the establishment of its Phoenix, Arizona site, this second North American hub marks a milestone in providing localized support within the U.S. semiconductor ecosystem. Closer to Key Customers, with Order Visibility Extending to 2027 Driven by surging de...
Innatera, a specialist in neuromorphic computing for ultra-low-power edge AI, has partnered with Joya Design to deliver a commercially viable consumer audio solution powered by its Pulsar chip. The collaboration marks a significant step in transitioning brain-inspired computing from development into real-world product deployment. Joya Design has successfully integrated Innatera’s Pulsar mic...
Kinaxis® Inc. (TSX: KXS), a global leader in supply chain orchestration, announced a new milestone in advancing large-scale supply chain optimisation within the Kinaxis Maestro™ platform. Maestro already delivers high-performance optimisation across complex global supply chains, and Kinaxis is now extending that leadership by leveraging GPU acceleration powered by NVIDIA cuOpt&...
At GTC 2026, Synopsys presented the outcomes of its ongoing collaboration with NVIDIA, highlighting how the integration of AI and accelerated computing is reshaping modern engineering and design processes. By combining its expertise in electronic design automation (EDA) and simulation with NVIDIA’s high-performance computing technologies, Synopsys is enabling organisations to tackle increas...
Tower Semiconductor has announced a strategic collaboration with Oriole Networks to accelerate the development of next-generation AI infrastructure, leveraging nanosecond optical circuit switching technology. The partnership brings together Oriole’s advanced networking architecture with Tower’s high-volume silicon photonics manufacturing platform. The objective is to commercialise opt...
Qualitas Semiconductor has selected a vector network analyser from Anritsu Corporation as part of its strategy to enhance signal integrity verification in high-speed interface development. As a provider of advanced PHY IP solutions, Qualitas operates in increasingly demanding semiconductor markets, including AI, data centres, automotive and mobile systems. With data transmission speeds continuing...
Recent progress in fabrication tools and processing techniques is accelerating the development of gallium oxide (Ga₂O₃) as a promising material for next-generation power semiconductors. Researchers, including teams from leading academic and industrial institutions, have reported important breakthroughs that enhance how this material is grown and adapted for practical device applications. Gall...
Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...
HyperLight Corporation (“HyperLight”) announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform. The reference module was demonstrated with engineering and manufacturing support from Suzhou TFC Optical Communication Co., Ltd. (SZSE: 300394, or "TFC"). The reference des...
HyperLight Corporation, creator of the TFLN Chiplet™ platform, announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD)...