• Thursday | 26 March 2026
Datasea Inc. Announces Ultrasonic Precision Control Breakthrough for Semiconductor Manufacturing

Datasea Inc. (NASDAQ: DTSS) ("Datasea" or the "Company"), a Nevada-based technology company specializing in acoustic high-tech solutions and 5G+AI multimodal digitalization, announced that it has achieved a foundational research breakthrough in its ultrasonic-enhanced nanoscale precision control technology, representing a step-change in the Company's technical architecture and under...

20 Feb 2026 | Friday | NEWS
EV Group Launches Next-Generation EVG120 Resist Processing System

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation EVG®120 automated resist processing system — a major update to one of the company's leading coater/developer platforms. Incorporating a new compact architecture, breakthrough capabilities, and des...

20 Feb 2026 | Friday | NEWS
Valens Semiconductor and MCNEX Launch QHD Automotive Cameras Using MIPI A-PHY Connectivity

MCNEX and Valens Semiconductor (NYSE: VLN) announced the joint development and availability of a new family of high–resolution front and rear automotive cameras that deliver QHD (2560×1440) video over unshielded twisted pair (UTP) or low-cost Coax channels, powered by Valens' VA7000 A–PHY chipsets. The cameras enable OEMs to significantly reduce the cost and complexity ...

20 Feb 2026 | Friday | NEWS
Chiplet Summit Announces 2026 Best of Show Winners Highlighting Packaging and Connectivity Innovation

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consort...

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Develops Next-Gen Automotive SoC Platform for Software-Defined Vehicles

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures....

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Unveils 3nm TCAM for Automotive and High-Speed Networks

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International So...

20 Feb 2026 | Friday | NEWS
Lattice Semiconductor Launches Cyber Resilience Kit to Strengthen Industrial Edge Security

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiP...

19 Feb 2026 | Thursday | NEWS
Keysight Technologies, Inc. Launches 3D Interconnect Designer to Accelerate AI Chip and Chiplet Development

Keysight Technologies, Inc. (NYSE: KEYS) introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face compl...

19 Feb 2026 | Thursday | NEWS
Efinix, Inc. Appoints Semiconductor Veteran BC Ooi to Board to Support Edge AI Growth

Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced that Boon Chye (BC) Ooi has joined its Board of Directors. Ooi, a semiconductor industry veteran with more than 45 years of operational leadership experience, will provide strategic guidance as Efinix scales its business and expands its market presence in FPGA and edge AI applications. Ooi brings unparalleled expertise...

19 Feb 2026 | Thursday | NEWS
ChipAgents Raises $50 Million to Scale AI Platform for Semiconductor Design

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. ...

19 Feb 2026 | Thursday | NEWS
Lam Research Corp. Opens New Boise Office to Strengthen U.S. Memory Chip Manufacturing

 Lam Research Corp. (NASDAQ: LRCX) commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders. The new office will initially support approximately 150 Lam personnel from the greater Boise area focused on collaborative research, devel...

19 Feb 2026 | Thursday | NEWS
Mouser Electronics Showcases Latest Semiconductor Solutions at DesignCon 2026

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, invites electronic design engineers to visit its exhibit at DesignCon 2026, February 24 – 26, at the Santa Clara Convention Center in Santa Clara, California. Mouser representatives will be at Booth 1139 in the exhibit hall to present the newest and widest selection of semiconductors and t...

18 Feb 2026 | Wednesday | NEWS
Ceva, Inc. Reports Breakthrough Year as AI Licensing Surpasses 20% of Revenue

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the smart edge, announced that 2025 marked a breakthrough year for its artificial intelligence ("AI") licensing business, with 10 NeuPro™ neural processing unit ("NPU") agreements signed and with AI contributing more than 20% of annual licensing revenue in 2025. As AI expands beyond the cloud into real-...

18 Feb 2026 | Wednesday | NEWS
European Union Invests €700 Million in NanoIC Pilot Line to Strengthen Semiconductor Independence

The European Union has committed €700 million to support a new pilot line dedicated to nano-integrated circuit (NanoIC) technologies, marking a major step in strengthening Europe’s semiconductor capabilities. The investment forms part of the EU’s wider Chips Act initiative, which seeks to reinforce the region’s technological independence and competitiveness in the global chi...

17 Feb 2026 | Tuesday | NEWS
Texas Instruments Launches New Automotive Chips to Support Autonomous Driving and Vehicle Safety

Texas Instruments has introduced a new range of automotive semiconductor solutions designed to enhance vehicle safety and enable higher levels of driving automation. The latest portfolio reflects the company’s ongoing efforts to support the automotive industry’s transition towards more intelligent, connected and software-defined vehicles. A key component of the annou...

17 Feb 2026 | Tuesday | NEWS
SkyWater Technology Appoints Christine Dunbar to Lead Sales and Drive Foundry Expansion

SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based pure-play semiconductor foundry, announced the appointment of Christine Dunbar as senior vice president of sales and solutions engineering, reporting directly to President and COO John Sakamoto. In her role, Dunbar will focus on accelerating customer acquisition and scaling growth across the company’s core platforms....

17 Feb 2026 | Tuesday | NEWS
Taiwan Breaks Ground on Advanced Semiconductor R&D Center to Accelerate AI and Next-Generation Chip Innovation

The Advanced Semiconductor R&D Center has officially broken ground at the headquarters campus of the Industrial Technology Research Institute (ITRI) in Hsinchu. Jointly developed by Taiwan's Ministry of Economic Affairs, the National Development Council, and the National Science and Technology Council, the center is designed to lower verification barriers for small and mid-sized IC design firm...

16 Feb 2026 | Monday | NEWS
MIPS to Showcase RISC-V Innovation and Physical AI Advances at Chiplet Summit 2026

Chiplet Summit, the industry’s largest chiplet event, today announced that MIPS, a GlobalFoundries company, will participate in Chiplet Summit 2026, February 17-19 at the Santa Clara Convention Center. Drew Barbier, VP Products at MIPS, will deliver a presentation titled “Safety-Critical Physical AI Applications Using RISC-V.” He will also be on the panel “S...

16 Feb 2026 | Monday | NEWS
ITRI Starts Work on New Semiconductor Research Centre

The Industrial Technology Research Institute (ITRI) has commenced construction of a new advanced semiconductor research and development facility in Hsinchu County, Taiwan. The project represents a total investment of NT$3.772 billion and is scheduled for completion by December 2027, with phased operations expected to begin in the first quarter of 2028. The ground-breaking ceremony was attended by...

13 Feb 2026 | Friday | NEWS
GigaDevice Partners with SEMITRON to Expand in DACH Region

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, has entered into a distribution agreement with SEMITRON, a leading electronic component distributor with a focus on the DACH region. Under the terms of the deal, SEMITRON is set to supply both GigaDevice's leading Flash, MCU, power and senso...

13 Feb 2026 | Friday | NEWS

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