• Sunday | 08 February 2026
Open POWER Foundation Announces Winners of Microwatt Design Challenge

Open POWER Foundation, an open developer community for the POWER ISA, announces the winners of the Microwatt Design Challenge (Microwatt Momentum Hackathon), in collaboration with ChipFoundry. The challenge was open to a broad range of participants including hardware engineers, students, researchers, and developers within the Open POWER ecosystem. The Open POWER Foundation, in collaboration with ...

22 Dec 2025 | Monday | NEWS
AP Memory Advances S-SiCap™ Silicon Capacitor Portfolio for AI Servers and HPC Systems

AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories —discrete silicon capacitors and interposers with silicon...

19 Dec 2025 | Friday | NEWS
Meridian Innovation Launches Cheetah™ 50×50 LWIR Thermal Imaging Sensor for Mass-Market Adoption

Meridian Innovation, a global leader in CMOS-based thermal imaging solutions, is excited to announce the launch of Cheetah, a breakthrough 50×50 LWIR thermal imaging sensor engineered to deliver a new level of performance, compactness, and affordability for mass-market applications. Built on Meridian's proven SenXor® technology platform, Cheetah offers unrivalled price-performance, enab...

19 Dec 2025 | Friday | NEWS
SK Hynix Validates Industry-First 256GB DDR5 RDIMM with Intel Xeon 6 Platform

SK hynix 32Gb 1b die-based 256GB server DDR5 RDIMM completes compatibility validation with Intel Xeon 6 platform- Demonstrates world-leading expertise in high-capacity DDR5 module technology- SK hynix to proactively enhance customer satisfaction as a "Full-stack AI memory creator" SK hynix Inc. announced that it has become the first in the industry to complete the Intel Data Center Certified...

19 Dec 2025 | Friday | NEWS
Rigaku Introduces ONYX™ 3200 for High-Precision Semiconductor Bump and BEOL Metrology

Rigaku Corporation, a global partner in X-ray analytical systems solutions and a Rigaku Holdings Corporation company (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), announced the launch of the ONYX 3200, a new semiconductor metrology system for measuring the thickness, composition, and bump structures* in wafer-level processes. The system is designed to help m...

19 Dec 2025 | Friday | NEWS
S2C, MachineWare, and Andes Unveil Co-Emulation Platform to Accelerate Advanced RISC-V Chip Design

S2C, MachineWare, and Andes Technology announced a collaborative co-emulation solution designed to address the increasing complexity of RISC-V-based chip design. The solution integrates MachineWare's SIM-V virtual platform, S2C's Genesis Architect and Prodigy FPGA Prototyping Systems, and Andes' high-performance AX46MPV RISC-V CPU core, providing a unified environment for hardware and softw...

18 Dec 2025 | Thursday | NEWS
Advantech Partners With DEEPX to Launch First NPU-Powered Edge AI Acceleration Module

Advantech, a global leader in IoT intelligent systems and embedded platforms, announced its partnership with DEEPX, a leading Korean AI semiconductor innovator specializing in NPU (Neural Processing Unit) technology. This collaboration expands Advantech's AI chipset ecosystem and introduces the company's first AI acceleration solution powered by DEEPX technology, the EAI-1961 series Edge AI Acce...

18 Dec 2025 | Thursday | NEWS
SEMIFIVE Details IPO and Growth Strategy as Demand Accelerates for Custom AI ASICs

As demand shifts from general-purpose semiconductors toward AI ASICs, SEMIFIVE provides customized chip development solutions to fabless companies and device manufacturers. New orders have increased from KRW 57.2 billion in 2022 to KRW 123.9 billion in 2024, driven by Big-Tech-Ready high-performance AI ASIC technologies, a highly efficient and scalable design platform, and turnkey services. ...

18 Dec 2025 | Thursday | NEWS
Broadcom CEO Hock Tan Highlights Record Q4 Results With 68% EBITDA Margin and Strong Cash Flow

Revenue of $18,015 million for the fourth quarter, up 28 percent from the prior year period GAAP net income of $8,518 million for the fourth quarter; Non-GAAP net income of $9,714 million for the fourth quarter Adjusted EBITDA of $12,218 million for the fourth quarter, or 68 percent of revenue GAAP diluted EPS of $1.74 for the fourth quarter; Non-GAAP diluted EPS of $1.9...

17 Dec 2025 | Wednesday | Company results
BTQ Technologies Added to Defiance Quantum ETF

BTQ Technologies Corp., a global quantum technology company focused on securing mission-critical networks, is pleased to announce that it has been added to the Defiance Quantum ETF , a thematic exchange traded fund that seeks to track the performance of the BlueStar Machine Learning and Quantum Computing Index ("BQTUM"). BTQ believes inclusion in QTUM broadens institutional and retail visibilit...

17 Dec 2025 | Wednesday | NEWS
GIBO Holdings Partners With E Total Technology to Develop AI Compute Centers in Malaysia

GIBO Holdings Ltd. announced a strategic collaboration with Malaysia-based technology and infrastructure solutions provider E Total Technology Sdn Bhd, under which the parties will work together on the planning, site sourcing, feasibility studies, and deployment of next-generation artificial intelligence compute centers in Malaysia. The project is expected to incorporate NVIDIA's most advanced h...

17 Dec 2025 | Wednesday | NEWS
India Broadens Chip Incentives, Targeting Compound Semiconductors and Advanced Packaging Capabilities

Government of India has approved an expanded set of incentives aimed at accelerating domestic manufacturing of compound semiconductors and advanced packaging, marking a significant step in building strategic depth across critical technology supply chains. The enhanced support framework is designed to attract investment into high value segments such as compound semiconductors, wh...

16 Dec 2025 | Tuesday | NEWS
SK Hynix Reinforces Long-Term Semiconductor Strategy With Expanded Yongin Investment

SK Hynix has reaffirmed its long term commitment to semiconductor manufacturing with an expanded investment plan in the Yongin chip cluster, underlining confidence in the future trajectory of the global semiconductor industry. The move strengthens Yongin’s position as a strategic semiconductor hub, with the expanded footprint expected to support advanced memory production,...

16 Dec 2025 | Tuesday | NEWS
Singapore Doubles Down on Skills and R&D to Future-Proof Its Semiconductor Ecosystem

Singapore has set out a fresh push to strengthen its semiconductor sector through targeted workforce development and expanded research infrastructure, reinforcing its ambition to remain a key node in the global chip ecosystem. The initiative centres on building deep technical capability to support next generation semiconductor manufacturing, design and integration. New training ...

16 Dec 2025 | Tuesday | NEWS
Taiwan Strengthens Semiconductor Leadership While Opening Doors to Global Capital

  Taiwan is reinforcing its position at the centre of the global semiconductor industry, combining deep rooted technological expertise with a renewed openness to foreign investment as demand for advanced chips continues to accelerate worldwide. The island’s semiconductor ecosystem is entering a new phase of expansion, marked by sustained capital inflows, capacity upgra...

16 Dec 2025 | Tuesday | NEWS
United States Accelerates Structural Reset of Semiconductor Industry to Secure Long-Term Leadership

  United States is pressing ahead with a comprehensive restructuring of its semiconductor industry, signalling a decisive shift towards a more resilient, competitive and strategically aligned national chip ecosystem. The ongoing transformation reflects a clear policy direction to reduce structural vulnerabilities exposed by recent global disruptions. By rebalancing supply chains and strengt...

16 Dec 2025 | Tuesday | NEWS
Toppan Advances Semiconductor Packaging And Photomask Strategy

  Toppan has outlined a sharpened semiconductor strategy that places advanced packaging and next generation photomask technologies at the heart of its growth roadmap, aligning the business more closely with accelerating global demand for artificial intelligence driven computing. The company is recalibrating its semiconductor portfolio to address the increasing complexity of chip architectur...

16 Dec 2025 | Tuesday | NEWS
Littelfuse Completes Acquisition of Basler to Bolster High-Power Industrial Capabilities

Littelfuse, Inc. (NASDAQ: LFUS), a leader in developing smart solutions that enable safe and efficient electrical energy transfer,  announced the completion of its previously announced acquisition of Basler Electric Company (“Basler”), further strengthening the company’s high-power application capabilities. Basler is a leading designer and manufacturer of innovative elect...

15 Dec 2025 | Monday | NEWS
China Reconsiders Nvidia’s Flagship AI Chips as Push for Domestic Processors Accelerates

China is accelerating efforts to reduce dependence on imported high end artificial intelligence processors, with leading technology companies and research institutions reassessing the use of Nvidia’s H200 chips in favour of locally developed solutions. This transition reflects a wider national push to strengthen technological self reliance, particularly in critical areas...

15 Dec 2025 | Monday | NEWS
SEMIFIVE Secures Multiple AI Chip Design Wins in Japan, Establishes Tokyo Subsidiary

  - Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC- Establishes a subsidiary in Japan to strengthen global reach SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan. ...

15 Dec 2025 | Monday | NEWS

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