yieldWerx and WATS Partner to Unify Semiconductor and PCBA Test Analytics
The collaboration connects wafer, chip, and packaged-device test data with PCB assembly test workflows, enabling manufacturers to improve yield visibility, accelerate root-cause analysis, and strengthen traceability across semiconductor and electronics production environments.
Board-level and semiconductor test data are often analysed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partnership to bridge this gap in the PCB test and semiconductor manufacturing workflows.
WATS is a test data management platform purpose-built for electronics manufacturers. It captures, standardises, and analyses high-volume test data from PCBA (printed circuit board assembly) production environments, including in-circuit test (ICT), functional test, and final test, giving engineers real-time visibility into board-level yield, anomalies, and quality metrics across the production line.
yieldWerx operates at the semiconductor level, connecting data across wafer fabrication, wafer sort, die, and packaged device test. Its enterprise analytics platform enables advanced yield analysis, traceability, and root cause investigation from design through silicon manufacturing.
Together, the platforms address the full product stack. This allows manufacturers to correlate PCBA-level signals with silicon quality data, improving visibility across test stages and enabling more effective analysis of yield and reliability issues.
Customer and industry benefits include:
- Real-time PCBA test visibility for faster identification of yield and quality issues
- Improved correlation between board-level test results and upstream chip or wafer data
- Reduced time spent reconciling data across disconnected systems
- Earlier detection of cross-stage patterns impacting yield and reliability
- Faster root cause analysis spanning silicon, assembly, and board-level test
- Better alignment between electronics manufacturing and the semiconductor supply chain
The combined solution supports open architectures, APIs, and flexible deployment models, enabling integration without large-scale system changes.
