• Thursday | 26 March 2026
Teledyne HiRel Semiconductors Launches Ultra-Low-Power 4 GHz Wideband LNA

Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5-volt supply. With a typical gain of 29 dB and a typical noise figure of 1.5 dB across 0.3–4...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS
Draper and Northeast Microelectronics Coalition Partner to Accelerate Lab-to-Fab Transitions

Draper and the Northeast Microelectronics Coalition (NEMC) announced that Draper will provide advisory services and support to startups and small companies within NEMC's membership to de-risk and accelerate lab-to-fab technology transition. The formal introduction will be made at the 2026 Microelectronics Commons Annual Meeting in Washington, D.C. These services build upon the NEMC's Po...

23 Feb 2026 | Monday | NEWS
AI Trading Agents Post 108% Gains in Semiconductor Rally

Tickeron has reported notable outperformance from its artificial intelligence trading agents focused on the semiconductor sector, with certain strategies generating returns exceeding 100 per cent. The results reflect heightened investor interest in chipmakers and equipment suppliers amid continued momentum in AI-driven technologies. According to the company, its AI-based trading models achieved s...

23 Feb 2026 | Monday | NEWS
Datasea Inc. Announces Ultrasonic Precision Control Breakthrough for Semiconductor Manufacturing

Datasea Inc. (NASDAQ: DTSS) ("Datasea" or the "Company"), a Nevada-based technology company specializing in acoustic high-tech solutions and 5G+AI multimodal digitalization, announced that it has achieved a foundational research breakthrough in its ultrasonic-enhanced nanoscale precision control technology, representing a step-change in the Company's technical architecture and under...

20 Feb 2026 | Friday | NEWS
EV Group Launches Next-Generation EVG120 Resist Processing System

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation EVG®120 automated resist processing system — a major update to one of the company's leading coater/developer platforms. Incorporating a new compact architecture, breakthrough capabilities, and des...

20 Feb 2026 | Friday | NEWS
Valens Semiconductor and MCNEX Launch QHD Automotive Cameras Using MIPI A-PHY Connectivity

MCNEX and Valens Semiconductor (NYSE: VLN) announced the joint development and availability of a new family of high–resolution front and rear automotive cameras that deliver QHD (2560×1440) video over unshielded twisted pair (UTP) or low-cost Coax channels, powered by Valens' VA7000 A–PHY chipsets. The cameras enable OEMs to significantly reduce the cost and complexity ...

20 Feb 2026 | Friday | NEWS
Chiplet Summit Announces 2026 Best of Show Winners Highlighting Packaging and Connectivity Innovation

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consort...

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Develops Next-Gen Automotive SoC Platform for Software-Defined Vehicles

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures....

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Unveils 3nm TCAM for Automotive and High-Speed Networks

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International So...

20 Feb 2026 | Friday | NEWS
Aitech and Teledyne e2v Semiconductors Partner to Advance Space-Grade AI Computing

Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductors are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC). Designed for deployment in LEO, GEO, lunar, and deep space missions, t...

19 Feb 2026 | Thursday | NEWS
Lattice Semiconductor Launches Cyber Resilience Kit to Strengthen Industrial Edge Security

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiP...

19 Feb 2026 | Thursday | NEWS
Keysight Technologies, Inc. Launches 3D Interconnect Designer to Accelerate AI Chip and Chiplet Development

Keysight Technologies, Inc. (NYSE: KEYS) introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face compl...

19 Feb 2026 | Thursday | NEWS
Efinix, Inc. Appoints Semiconductor Veteran BC Ooi to Board to Support Edge AI Growth

Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced that Boon Chye (BC) Ooi has joined its Board of Directors. Ooi, a semiconductor industry veteran with more than 45 years of operational leadership experience, will provide strategic guidance as Efinix scales its business and expands its market presence in FPGA and edge AI applications. Ooi brings unparalleled expertise...

19 Feb 2026 | Thursday | NEWS
ChipAgents Raises $50 Million to Scale AI Platform for Semiconductor Design

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. ...

19 Feb 2026 | Thursday | NEWS
Lam Research Corp. Opens New Boise Office to Strengthen U.S. Memory Chip Manufacturing

 Lam Research Corp. (NASDAQ: LRCX) commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders. The new office will initially support approximately 150 Lam personnel from the greater Boise area focused on collaborative research, devel...

19 Feb 2026 | Thursday | NEWS
Ambiq Micro, Inc. Launches Open-Source AI Development Kit to Accelerate Edge Audio Innovation

Ambiq Micro, Inc. (“Ambiq®”)— Ambiq, a leader in ultra-low-power semiconductor solutions, announced soundKIT, its fourth open-source AI Development Kit (ADK), designed to accelerate the adoption of always-on, real-time, on-device audio and speech intelligence for power-constrained edge devices. Built for Ambiq’s ultra-low-power system-on-chips (SoCs), soundKIT ena...

18 Feb 2026 | Wednesday | NEWS
TOTO Ltd. Faces Pressure from Palliser Capital to Unlock $3.6 Billion Shareholder Value

Palliser Capital (“Palliser”), a top 20 shareholder of TOTO Ltd. (“TOTO”), today published a comprehensive presentation outlining the opportunities available to unlock significant value at TOTO. To promote market transparency and respond to growing interest from shareholders and other stakeholders, Palliser has made public a detailed presentation titled “Maximizing th...

18 Feb 2026 | Wednesday | NEWS
Wolfspeed, Inc. Appoints Stefan Steyerl to Lead EMEA Sales and Expand Market Growth

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology and manufacturing, announced the appointment of Stefan Steyerl as vice president of sales, EMEA. Effective March 1, 2026, Steyerl will develop and execute Wolfspeed’s regional sales strategy, driving adoption of silicon carbide solutions across automotive, industrial, and energy markets as Wolfspeed accelerates the a...

18 Feb 2026 | Wednesday | NEWS
GlobalFoundries and Renesas Electronics Corporation Sign Multi-Billion-Dollar Chip Manufacturing Partnership

GlobalFoundries (Nasdaq: GFS) (GF) and Renesas Electronics Corporation (TSE: 6723) (Renesas)  announced an expanded strategic collaboration through a multi‑billion-dollar manufacturing partnership that broadens Renesas' access to GF technologies including its differentiated technology platforms. This agreement reflects a shared commitment to secure, resilient supply chains and aligns with U...

18 Feb 2026 | Wednesday | NEWS

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