• Thursday | 26 March 2026
Gallium Oxide Emerges as Next-Generation Power Semiconductor Material

Recent progress in fabrication tools and processing techniques is accelerating the development of gallium oxide (Ga₂O₃) as a promising material for next-generation power semiconductors. Researchers, including teams from leading academic and industrial institutions, have reported important breakthroughs that enhance how this material is grown and adapted for practical device applications. Gall...

18 Mar 2026 | Wednesday | NEWS
Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...

17 Mar 2026 | Tuesday | NEWS
Semtech Corporation Launches 224Gbps Optical Interconnect Chipset for AI Data Centres

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications. ...

17 Mar 2026 | Tuesday | NEWS
HyperLight Corporation Demonstrates 1.6T Optical Transceiver Using TFLN Chiplet Platform

HyperLight Corporation (“HyperLight”) announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform. The reference module was demonstrated with engineering and manufacturing support from Suzhou TFC Optical Communication Co., Ltd. (SZSE: 300394, or "TFC"). The reference des...

17 Mar 2026 | Tuesday | NEWS
HyperLight Corporation Launches 145 GHz Packaged Intensity Modulator

HyperLight Corporation, creator of the TFLN Chiplet™  platform, announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD)...

17 Mar 2026 | Tuesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
Polar Semiconductor Achieves AS9100D Certification for Semiconductor Wafer Manufacturing

Polar Semiconductor is pleased to announce that its Quality Management System (QMS) has achieved certification conforming to AS9100D and ISO 9001:2015 for the manufacture of semiconductor wafers. The certification audit was conducted by BSI, a fully accredited certification body and affirms that Polar meets the stringent standards established by the International Aerospace Quality G...

16 Mar 2026 | Monday | NEWS
Allegro DVT Launches DWP300 DeWarp IP for Advanced Video Processing

Allegro DVT, the worldwide leader in Semiconductor Video IPs and Video Compliance Tools, announces the addition of its new DWP300 DeWarp IP to its Zinia Pixel Processing IPs portfolio. This latest innovation further reinforces Allegro DVT’s commitment to delivering comprehensive, high-performance solutions for next-generation imaging and video applications. The new DWP30...

16 Mar 2026 | Monday | NEWS
Qnity Electronics Opens Advanced Semiconductor Materials Facility in Newark, Delaware

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, celebrated the opening of its new 385,000-square-foot facility with a ribbon-cutting ceremony in Newark, Delaware. The new facility, part of a multi-year investment to expand advanced manufacturing, increases capacity to meet rising demand for semiconductor material...

16 Mar 2026 | Monday | NEWS
HyperLight Corporation, United Microelectronics Corporation Partner on TFLN Photonics Foundry Production

HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet™ Platform on both...

16 Mar 2026 | Monday | NEWS
Mouser Electronics Returns as Platinum Sponsor of Create the Future Design Contest

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge for engineers and innovators to design the next great thing, with a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined ag...

16 Mar 2026 | Monday | NEWS
Corning Incorporated Licenses PRIZM TMT optical ferrule technology to Boost AI Data Centre Connectivity

Corning Incorporated (NYSE: GLW) announced a collaboration with US Conec to become a licensee of PRIZM® TMT optical ferrule technology, a solution that allows for higher fibre counts in tighter spaces inside data centers. The addition of PRIZM® TMT expands Corning’s full spectrum of high‑density optical connectivity solutions for next‑generation AI networks. “AI infra...

16 Mar 2026 | Monday | NEWS
Manz Asia and Seiko Epson Corporation Partner to Advance Inkjet Technology in Semiconductor Manufacturing

 A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, announced a strategic partnership with Seiko Epson Corporation (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing.  The collaboration combines Manz Asia's expertise in semiconductor equipment engineering, process integration, and intelligent software with E...

13 Mar 2026 | Friday | NEWS
Synopsys Launches Ansys 2026 R1 with Integrated Engineering and AI Capabilities

 Synopsys, Inc. (NASDAQ: SNPS) launched Ansys 2026 R1, delivering the first wave of integrated Synopsys-Ansys capabilities built on nearly a century of combined engineering expertise. The release also expands the Ansys simulation AI portfolio with a new AI-enhanced training offering designed to make learning more effective and efficient, along with advanced AI features that help engineer...

13 Mar 2026 | Friday | NEWS
Synopsys Advances Hardware-Assisted Verification for AI Chip Development

Synopsys, Inc. (Nasdaq: SNPS) announced advancements across its leading hardware-assisted verification (HAV) portfolio, including new hardware platforms and capabilities to support the ever-expanding demand for AI chip verification from the data centre to the edge. Synopsys HAV platforms, powered by the company's unique software-defined capabilities, set new performance, scalability, and use ...

13 Mar 2026 | Friday | NEWS
New Phosphorus-Doped Diamond Semiconductor Targets High-Power Applications

"We thought there should be a way to fabricate N-type phosphorus-doped diamond semiconductors for high temperature and high power applications," said one of two inventors, from Cowan Heights, Calif., "so we invented the N-TYPE P D D SEMI CONDUCTOR. Our design would not have the same thermal and power handling limitations as existing silicon, gallium nitride and other N-type semiconductor subs...

13 Mar 2026 | Friday | NEWS
SK keyfoundry Develops SiC Planar MOSFET Process Platform

SK KeyFoundry, an 8-inch pure-play foundry in Korea, announced that it has recently completed the development of its SiC (Silicon Carbide) Planar MOSFET process platform, which is gaining traction in the next-generation compound power semiconductor market. The company also revealed that it has secured an order for the development of a 1200V SiC MOSFET product from a new customer, marking its full-...

13 Mar 2026 | Friday | NEWS
Amber Semiconductor Raises $30m Series C to Advance AI Data Centre Power Technology

Amber Semiconductor, a fabless semiconductor company pioneering the next generation power management for AI data centres, announced the initial closing of its $30 million Series C financing round from new and existing investors.   The funding will be used to scale product development, expand customer engagements, and accelerate the commercialisation of Amber's breakthrough vertical powe...

13 Mar 2026 | Friday | NEWS
IBM and Lam Research Partner on Sub-1nm Logic Scaling

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and high-NA EUV lithography processes to advance IBM's logic scaling ro...

12 Mar 2026 | Thursday | NEWS

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