• Thursday | 26 March 2026
Xsensio Raises $7M Series A to Advance Continuous Biochemical Monitoring

Xsensio SA, a Swiss deep-tech company pioneering near real-time continuous biochemical monitoring, announced the successful closing of a $7M oversubscribed Series A financing round. The round was led by San Francisco-based venture capital firm WI Harper, with participation from Privilège Ventures, the European Innovation Council, and private investors across the United States, Europe, and A...

4 Mar 2026 | Wednesday | NEWS
MetaOptics Develops Compact Tunable Metalens Module for 3D Fingerprint Biometrics

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") has announced plans to develop a compact optical module for 3D non-contact fingerprint biometrics, designed to support future smartphone integration possibilities. The project enhances the Company's existing 3D sensing technology by reducing optical stack size and incorporating elec...

3 Mar 2026 | Tuesday | NEWS
MaxLinear Showcases Expanding Sierra-Powered Open RAN Portfolio at MWC 2026

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will showcase a growing range of commercially available Open RAN Radio Units (O-RU) based on its Sierra single‑chip radio SoC at Mobile World Congress (MWC) 2026 in Barcelona. ttendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of several new Sierra-powered O-RUs, in...

3 Mar 2026 | Tuesday | NEWS
GCT Semiconductor to Showcase 5G and IoT Innovations at MWC 2026

GCT Semiconductor Holding, Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced that it will showcase its latest 5G and IoT capabilities at its exhibit at Mobile World Congress (MWC) 2026, taking place March 2-6, in Barcelona, Spain. GCT will host partners and customers at its booth to unveil its ...

3 Mar 2026 | Tuesday | NEWS
Samji Electronics Selects MaxLinear’s Sierra SoC for Next-Generation Macro Open RAN Radio

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that Samji Electronics has selected MaxLinear’s Sierra single‑chip radio system‑on‑chip (SoC) to power its next‑generation Macro Open RAN Radio Unit (O‑RU) (SNOO2‑44N28). Designed for the demanding requirements of modern macro cellular networks, Samji Electronics' new ...

3 Mar 2026 | Tuesday | NEWS
SambaNova Survey Highlights Rising Public Concern Over AI Energy Demand

SambaNova, builders of the fastest chip for agentic AI, released research highlighting the mounting concerns over the energy demands of AI data centres and the impact on households and national power grids. As AI deployment accelerates, business leaders and consumers are aware that legacy, GPU-based infrastructure is not built for the efficiency and scale required in a power‑constrained wor...

3 Mar 2026 | Tuesday | NEWS
Renesas Appoints New Presidents for India and China to Drive Regional Growth

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced new leadership appointments to accelerate its growth strategy in two of the world’s most dynamic and fast-expanding markets, India and China. Effective March 1, 2026, Malini Narayanamoorthi assumed the title of Vice President and President of Renesas Electronics India. She formerly ...

3 Mar 2026 | Tuesday | NEWS
Micron Inaugurates $2.75 Billion Semiconductor Assembly and Test Facility in Sanand, Marking India’s Entry into Commercial Chip Production

  Micron Technology, Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India. The state-of-the-art facility converts advanced DRAM and NAND wafers from Micron's global manufacturing network into finished memory and storage products. Once fully ramped, the first phase of Micron’s Sanand operation will feature more than 500,000 square f...

2 Mar 2026 | Monday | NEWS
Rapidus Secures ¥267.6 Billion to Advance 2nm Semiconductor Production

Rapidus Corporation announced that it has completed a funding round totalling 267.6 billion yen (equivalent to $1.7 billion USD) from the Japanese government and private sector companies. A total of 100 billion yen was invested from the Information-Technology Promotion Agency (IPA), Japan, an independent administrative agency under the jurisdiction of the Ministry of Economy, Trade and Indus...

2 Mar 2026 | Monday | NEWS
Surge Components Reports 16% Sales Growth and Higher Profitability in Fiscal 2025

Surge Components, Inc. (“Surge” or the “Company”) (OTC Pink: SPRS), a leading supplier of capacitors, discrete semiconductors, switches, and audible/sounding devices, announced financial results for the fiscal year ended November 30, 2025. Operational Highlights Continues to strengthen its distribution sales channel, with distribution partners remaining a key growt...

2 Mar 2026 | Monday | NEWS
DNP Invests in Rapidus to Support 2nm Semiconductor Mass Production

Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the devel...

2 Mar 2026 | Monday | NEWS
MP Materials Selects Texas Site for $1.25 Billion Rare Earth Magnet Campus

MP Materials Corp. (NYSE: MP) today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus. Located less than 10 miles from MP’s existing Independence facility in Fort Worth, the new campus will cement North Texas as the center of gravity for the United States’ rare ea...

2 Mar 2026 | Monday | NEWS
BrainChip Named Technology Sponsor for 2025–2026 Raytheon Autonomous Vehicle Competition

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, announced its role as the official Technology Sponsor for the 2025-2026 Raytheon Autonomous Vehicle Competition (AVC). The Raytheon AVC, themed “Operation Touchdown,” challenges undergraduate engineering teams from ac...

2 Mar 2026 | Monday | NEWS
MaxLinear Showcases Sierra SoC for Next-Generation Open RAN Radios at MWC 2026

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, announced that it will demonstrate its newest advancements in RAN radio technologies at MWC Barcelona 2026. Attendees visiting meeting room 2L8MR in Hall 2 will see demonstrations of how MaxLinear’s Sierra single-chip radio SoC helps OEMs develop new innovative Open RAN Radio Units (O-RUs) addressing...

2 Mar 2026 | Monday | NEWS
Magnachip Semiconductor Corporation Launches 7th-Gen 24V MOSFET for Tri-Fold Smartphones

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of its new 7th-generation 24V MXT LV MOSFET1 specifically designed for battery protection circuits in next-generation tri-fold smartphones, strengthening its presence in the premium foldable smartphone market. The product is now in mass production and is currently being supplied to a major global smar...

27 Feb 2026 | Friday | NEWS
Semtech Corporation Expands Smart Home Chip Strategy with Trident IoT Deal

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a definitive agreement with Trident IoT that positions Semtech’s LoRa Plus™ platform as the connectivity foundation for next-generation multi-protocol smart home and security solutions. With this agreeme...

27 Feb 2026 | Friday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches 135°C Photorelays for Automotive Chip Testing

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four voltage-driven photorelays, “TLP3407SRB,” “TLP3412SRB,“ ”TLP3412SRHB,“ and “TLP3412SRLB” housed in the small S-VSON4T package. The new photorelays deliver a maximum operating temperature rating of 135°C for equipment that operates at high temperatures. Volume ...

27 Feb 2026 | Friday | NEWS
First Solar, Inc. Secures Perovskite Patent License from Oxford Photovoltaics Limited

First Solar, Inc. (Nasdaq: FSLR) (“First Solar” or “the Company”) announced a patent licensing agreement that gives it access to existing issued patents and currently pending patent applications of Oxford Photovoltaics Limited (“Oxford PV”) The non-exclusive license paves the way for First Solar, the largest solar manufacturer in the Western Hemisphere and the ...

27 Feb 2026 | Friday | NEWS
MIPI Alliance Upgrades UniPro and M-PHY to Power Next-Gen UFS 5.0 Chips

The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, announced major updates to two of its foundational specifications. MIPI UniPro v3.0 and MIPI M-PHY v6.0 offer significant performance, latency and power-efficiency improvements for next-generation JEDEC Universal Flash S...

27 Feb 2026 | Friday | NEWS
Marvell Technology, Inc. Showcases AI Data Center Connectivity Innovations at DesignCon 2026

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced it will showcase its latest data center connectivity products and technologies driving the next wave of AI innovation at DesignCon 2026 The primary bottleneck in AI data center infrastructure has shifted from compute to connectivity. Data center operators require scalable, ultra-high perfor...

27 Feb 2026 | Friday | NEWS

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