• Thursday | 14 May 2026
Data Centre Chip Market Set to Reach $687bn by 2032

According to MarketsandMarkets™, the Data Centre Chip Market is expected to reach USD 687.65 billion by 2032 from USD 283.16 billion in 2026, registering a CAGR of 15.9% during the forecast period. Browse 170 market data Tables and 70 Figures spread through 280 Pages and an in-depth TOC on 'Data Centre Chip Market - Global Forecast to 2032' Data Centre Chip Market Size ...

7 Apr 2026 | Tuesday | NEWS
Roundhill Launches DRAM ETF to Capitalise on AI Memory Demand

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced the launch of the Roundhill Memory ETF (Ticker: DRAM). DRAM seeks to provide investors with targeted exposure to global companies operating within the memory segment of the semiconductor industry, including manufacturers of DRAM, High-Bandwidth Memory (HBM), NAND flash, and solid-state storage devices (SSD)....

7 Apr 2026 | Tuesday | NEWS
OMNIVISION and ATL Medical Partner to Advance Arthroscopy Imaging

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analogue, and display solutions, and ATL Medical, Inc., a designer, developer and manufacturer of innovative medical devices, today announced that ATL is using the OVMed® OH0131 image signal processor (ISP) in its PREVOYANCE® Complete Imaging System with Chip-on-Tip® t...

7 Apr 2026 | Tuesday | NEWS
ACCM Launches Zero-Skew Laminate for Next-Generation High-Speed Designs

Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material that eliminates fiber weave skew at its root. Fiber weave skew is a materials problem, not a routing one. Woven glass creates a spatially periodic dielectric in which differential pairs travel alternately through resin-rich and glass-rich regions. In a differential pair, the two conducto...

7 Apr 2026 | Tuesday | NEWS
Lattice Semiconductor Recognised for Cybersecurity Leadership at 2026 Awards

Lattice Semiconductor (NASDAQ: LSCC), the low-power programmable leader, announced it was named a multi-award winner at the 2026 Cybersecurity Excellence Awards for its security leadership. The Lattice MachXO5™-NX TDQ FPGA family was recognised in the Post-Quantum Cryptography (PQC) category for being the industry’s first FPGA family to deliver CNSA-2.0 compli...

6 Apr 2026 | Monday | NEWS
Cohu Secures $30m in Follow-On Orders for HPC Test Platform

Cohu, Inc. (NASDAQ: COHU), a global supplier of equipment and services optimising semiconductor manufacturing yield and productivity, announced that two customers have placed follow-on orders totalling $30 million for the Eclipse platform configured with active thermal control for testing of next-generation high-performance computing (HPC) processors. The orders, which are expected to be delivere...

6 Apr 2026 | Monday | NEWS
Parade Technologies Launches DP 2.1a MST Hub for Automotive and Display Expansion

Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, announces the availability of PS8651V DP 2.1a/HBR3 1:2 MST hub controller for automotive, accessories and video display designs that need DP/eDP port expansion. It adds to Parade’s DP MST Hub solutions, which include the PS8650 DP 2.1a/UHBR20 1:4 MST hub controll...

6 Apr 2026 | Monday | NEWS
Renesas Powers NASA’s Artemis II Mission with Radiation-Hardened ICs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced its radiation-hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in NASA’s plans to re...

6 Apr 2026 | Monday | NEWS
NUBURU Secures Initial Counter-Drone Deployment in Asia-Pacific

NUBURU, Inc. (NYSE American: BURU – the “Company”), a dual-use Defense & Security platform company focused on non-kinetic effects, directed-energy technologies, electronic warfare and software-orchestrated defense systems,  announced that its wholly owned subsidiary, Lyocon S.r.l. (“Lyocon”), has secured an initial deployment order for its portable directed-e...

6 Apr 2026 | Monday | NEWS
Cognichip Secures $60m Series A to Advance AI-Driven Chip Design

Cognichip, the company pioneering ACI® – Artificial Chip Intelligence – for semiconductor design, announced an oversubscribed $60 million Series A financing led by Seligman Ventures, with participation from SBI Investment and additional semiconductor-focused investors. All seed investors, including Mayfield, Lux Capital, FPV, and Candou Ventures, participated above pro rata allocat...

6 Apr 2026 | Monday | NEWS
Intel to Reclaim Full Ownership of Ireland Fab in $14.2bn Deal

Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) announced a definitive agreement for Intel to repurchase the 49% equity interest in the joint venture related to Intel’s Fab 34 in Ireland not held by Intel for $14.2 billion. The agreement reflects Intel’s continued business momentum underpinned by the growing and essential role CPUs play in the era of AI, a significantly strengt...

3 Apr 2026 | Friday | NEWS
L Squared Launches Continuation Fund to Accelerate BTX Precision Growth

L Squared Capital Partners (“L Squared”) is pleased to announce the successful closing of a single-asset continuation fund for BTX Precision (“BTX” or the “Company”), a leading high-precision manufacturer of mission-critical components and assemblies. The platform’s unmatched breadth of additive and subtractive manufacturing capabilities – including ...

3 Apr 2026 | Friday | NEWS
Penguin Solutions Completes Strategic Divestment of Zilia Technologies

Penguin Solutions, Inc. (“Penguin Solutions” or the “Company”) (Nasdaq: PENG) announced that SMART Modular Technologies (LX) S.à r.l. (“Seller”), a wholly owned indirect subsidiary of the Company, closed the transaction contemplated by that certain Stock Transfer Agreement (the “Stock Transfer Agreement”) entered into on December 29,...

3 Apr 2026 | Friday | NEWS
InTest Appoints Rich Rogoff as CEO to Drive Next Phase of Growth

InTest Corporation (NYSE American: INTT), a global supplier of innovative test and process technology solutions for use in manufacturing and testing in key target markets which include Semiconductor, Auto/EV, Defense/Aerospace, Industrial, Life Sciences, and Safety/Security, announced that Rich Rogoff, Division President of InTest’s Environmental Technologies Division, has also been named Pr...

3 Apr 2026 | Friday | NEWS
Tower Semiconductor Targets Capacity Growth with Japan Fab Expansion

Tower Semiconductor has announced plans to increase its 300mm wafer production capacity in Japan as part of a broader strategy to meet rising customer demand and strengthen its position in specialised semiconductor technologies. The initiative forms part of a restructuring of the company’s Japanese operations, currently organised under TPSCo, a joint venture with Nuvoton Technology Corporat...

3 Apr 2026 | Friday | NEWS
Innofiber, Acrolite and PAVE Merge to Form Connexis Group

Innofiber, Acrolite, and PAVE Technology Co. announced the completion of their merger to form Connexis Group Inc., a new interconnect solutions platform bringing together decades of specialised engineering expertise across three complementary businesses. Each company will continue to operate under its established brand, maintaining customer relationships, capabilities, and market focus that d...

2 Apr 2026 | Thursday | NEWS
AMD Foundation Backs Semiconductor Talent Pipeline with New Investment

As the United States races to secure its semiconductor future, Last Mile Education Fund announces that the AMD Foundation has joined its Semiconductor Pathways Fund with a $500,000 philanthropic investment over the next three years. The Semiconductor Pathways Fund is a national industry coalition ensuring that the engineers and technicians already enrolled in STEM programs...

2 Apr 2026 | Thursday | NEWS
Molex Completes Landmark Acquisition of Smiths Interconnect

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in Molex's vision to enable technology that is transforming the future and improving people's lives. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities ...

2 Apr 2026 | Thursday | NEWS
IOWN Global Forum Showcases Open AI Networking Vision at OFC 2026

At OFC 2026, the Innovative Optical and Wireless Network Global Forum (IOWN Global Forum), comprised of over 180 member organisations, highlighted its vision for the future of open AI networking through an interactive booth and dedicated panel session. These platforms enabled the Forum to demonstrate the power of interoperable technologies and engage industry leaders on how collabor...

2 Apr 2026 | Thursday | NEWS
Arrow Electronics Unifies Digital Platforms with New Omnichannel Experience

This month, Arrow Electronics completed a broad shift of the customer-facing digital platforms for its global components business to a single user experience on a redesigned arrow.com. The now omnichannel platform is intended to provide a unified interface for existing procurement and engineering customers while introducing a more intuitive online option for customers who have traditionally ...

2 Apr 2026 | Thursday | NEWS

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