Global semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported in its Materials Market Data Subscription (MMDS). Growth was supported by gains in both the wafer fab materials and packaging materials segments, reflecting higher process complexity, advanced-node demand, and continued investment in high-performance computing and hig...
HYFIX Spatial Intelligence announced the immediate availability of samples and evaluation kits for the H1P Positioning, Navigation, and Open-Compute Module for small unmanned systems. The announcement will be showcased at AUVSI XPONENTIAL 2026 (Booth 34005), the leading industry event for autonomy and robotics. The H1P integrates HYFIX's H1 Autonomous Systems Chip into a compact, i...
Oracle announced that the Oracle Java SE Universal Subscription will help standardise global software development at Samsung Electronics, a world leader in advanced semiconductor technology. With the Oracle Java SE Universal Subscription, Samsung can simplify IT operations and strengthen security by consolidating its global internal application development on Oracle Java. To continue to expa...
Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; “Rigaku”), announced the expansion of its metrology technology development for next-generation semiconductors, leveraging global research environments. As part of this initiative, Rigaku is working with ime...
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million units of the Kingston A400 SATA solid-state drive. Launched in 2017, the Kingston A400 quickly gained recognition for its impressive performance in terms of booting, loading, and transferr...
indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, has announced the signing of a definitive agreement to acquire the fabless CMOS image sensor group from ams OSRAM AG for a total consideration of 40 million euros. With primary operations in Belgium and Portugal, this product line includes intelligent, high‑performance CMOS image sensors for a broad range of industrial, auto...
Macnica ATD Europe today announced the acquisition of Indesmatech, a pan-European technology and advisory company specialising in advanced semiconductor representation, design-in support and consulting, as well as point click buying services. The acquisition is a strategic move by Macnica ATD Europe to strengthen its commercial and engineering presence across Scandinavia and Northern Eu...
Cyient Semiconductors Private Limited announced the launch of seven new gallium nitride (GaN) power devices for the Indian market, developed using Navitas Semiconductor's (Nasdaq: NVTS) industry-leading GaN technology. The launch marks Cyient Semiconductors' first commercial GaN product family and a major milestone in advancing India's domestic power semiconductor ecosystem. The new p...
Infineon's Startup Challenge brings together promising founder teams and young high-tech companies from across the globe to work jointly on a highly relevant topic: humanoid robotics. The Challenge is a structured innovation program designed to develop technological concepts into market-ready applications. It is part of Infineon's global Co–Innovation Program, in which Infineon drives innova...
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution, including Ceva's internally developed RF technology, a significant commercial milestone validating the company's strategy to expand its wireless offering and deliver comprehensive, system-level solutions to it...
FotoNation Ltd., a European-based Perception-Recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE will lead turnkey development for TriSilica, FotoNation's ultra-low-power perceptual AI chip family. TriSilica is an ultra-low-power, compact-footprint perceptual AI silicon pla...
At the 2026 European Economic Congress (EEC 2026), MICROIP Chairman Dr James Yang participated in a high-level dialogue at the "Poland-Taiwan Economic Cooperation Forum." Joined by Ambassador Liu Yong-jian and HCG Vice Chairman Michael Chiu, Dr Yang advocated leveraging Taiwan's semiconductor prowess to propel Poland into a strategic hub for European Edge AI. Addressing the "Last Mile" of A...
Board-level and semiconductor test data are often analysed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partners...
Nota AI (CEO Myung-su Chae), a specialist in AI model compression and optimisation, announced that it has signed an agreement with Mobilint, a high-performance AI semiconductor (NPU) company, to supply AI optimisation technology and establish a strategic partnership. This agreement was pursued to combine Nota AI's proprietary AI model compression and optimisation software capabilities with M...
SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, announced the successful tape-out of next-generation Edge AI SoC jointly developed utilising Samsung Foundry's 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. This marks a significant milestone toward the first commercial deployment of 8...
TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio at GITEX AI Kazakhstan 2026, the company solidified its Central Asian expansion through strategic dialogues with regional industrial leaders and stakeholders...
Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, announced the appointment of Mr Guy Shechter as the Company’s President and Chief Operating Officer, reporting to the Chief Executive Officer of the Company. “I am pleased to announce that Guy Shecter will be joining...
The Health Impact Alliance (HIA) announced it has partnered with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, to develop advanced connectivity solutions for the rapidly growing senior care market. This collaboration leverages Infineon’s cutting-edge semiconductor technology to create a comprehensive ecosystem of connected healthcare devices. ...
In this interview with Semicon Leaders Asia, Charlene Wan, VP of Corporate Marketing & IR at Ambiq Micro, highlights how compressionKIT™ is extending ultra-low-power AI beyond inference to fundamentally rethink how data is captured, stored, and utilised at the edge. By enabling intelligent AI-based compression for continuous sensor streams, the platform helps developers reduce transmissi...
GCT Semiconductor Holding Inc. (“GCT” or the "Company") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced it has signed a reference platform agreement with one of the world’s largest satellite communications providers, supplementing a 5G/4G Chipset Licensing agreement executed in January. Under this new agreement, GCT will...