• Thursday | 14 May 2026
RoboSense Unveils SPAD-SoC Breakthrough to Lead Next Phase of LiDAR Commercialisation

RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary...

22 Apr 2026 | Wednesday | NEWS
DEEPX and Hyundai Motor Group Forge Strategic Partnership to Commercialise Next-Gen Robotics AI

DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic sy...

22 Apr 2026 | Wednesday | NEWS
Roundhill Memory ETF (DRAM) Crosses $1 Billion Milestone Shortly After Launch

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced that the Roundhill Memory ETF (Cboe BZX: DRAM) has surpassed $1 billion in assets under management (AUM) only 10 trading days after its April 2, 2026, launch.² DRAM is the first U.S.-listed ETF to offer targeted exposure to global memory semiconductor companies and has emerged as the most successful ETF...

21 Apr 2026 | Tuesday | NEWS
InPHRED Expands into Data Centre Optical Interconnect Market

InPHRED, a developer of next-generation photonics solutions for consumer sensing and digital health, announced its formal expansion into the data centre optical interconnect market, extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure. As demand for AI infrastructure surges and hyperscalers push for higher bandwidth density, lower power co...

21 Apr 2026 | Tuesday | NEWS
LG Innotek Wins Major Automotive Wi-Fi 7 Deal to Accelerate Connected Car Strategy

LG Innotek (CEO Moon Hyuksoo) announced this month that it will supply its Automotive Wi-Fi 7 Communication Module, featuring cutting-edge Wi-Fi technology, to a leading European automotive parts company. The order is worth approximately USD 68M. Mass production of the module will begin in 2027. LG Innotek's Automotive Wi-Fi 7 Communication Module will be integrated into Audio, Video, and Navigat...

21 Apr 2026 | Tuesday | NEWS
SK hynix Inc. Begins Mass Production of 192GB SOCAMM2 for AI Servers

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM. SOCAMM2[1] is a module that adapts low-power memory – previously used mainly in mobile products like smartphones - for server ...

21 Apr 2026 | Tuesday | NEWS
Global AMOLED Display Market Faces 7% Contraction in 2026, Says Omdia

AMOLED smartphone display shipments are expected to decline sharply in 2026 amid rising memory prices and increasing market uncertainty, according to Omdia’s latest OLED Display Market Tracker. A surge in memory prices since the second half of 2025 has significantly increased component costs for smartphones, putting pressure on pricing for new models in 2026. Chinese smartphone brands,...

21 Apr 2026 | Tuesday | NEWS
Cirrus Logic Expands Industrial Portfolio with New Imaging IC Family

Cirrus Logic (NASDAQ: CRUS) announced the launch of a new family of industrial imaging integrated circuits (ICs) designed for high-precision scanning systems. This expands Cirrus Logic’s industrial portfolio and delivers a high-performance, highly integrated analogue front-end solution for multi-function printers, scanners, and advanced industrial imaging platforms. Designed for applic...

20 Apr 2026 | Monday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches SmartMCD Motor Control Device for Automotive Electrification

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has begun shipping engineering samples of “TB9M030FG,” the latest addition to its “SmartMCD™”[1] series of motor control devices. The new device integrates a microcontroller (MCU) and a motor driver, and incorporates sensorless control technology for low‑speed operation of threeâ€...

20 Apr 2026 | Monday | NEWS
Cadence Design Systems and NVIDIA Expand Partnership to Accelerate AI-Driven Engineering

At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories. By combining Cadence&rsquo...

20 Apr 2026 | Monday | NEWS
Cadence Design Systems and Google Cloud Partner to Advance AI-Driven Chip Design

Cadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimise the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud. This collaboration positions Cadence at the forefront of the shift toward agentic design automation, creating an agent-driven, scalable, cloud-native platfo...

20 Apr 2026 | Monday | NEWS
Nuvoton Technology Corporation Japan Advances High-Power Violet Laser Diodes for Semiconductor Packaging

Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced that it will start mass production of a "high-power violet laser diode (402 nm, 4.5 W)" that achieves industry-leading-class (*1) optical output in a 9.0 mm diameter CAN package (TO-9) in May. This product achieves 1.5 times the optical output compared to NTCJ's conventional product (*2) through its proprietary device structure an...

20 Apr 2026 | Monday | NEWS
Iceotope Expands IP Portfolio Amid Rising Demand for AI Infrastructure Cooling

Iceotope, the global pioneer in precision liquid cooling for AI infrastructure, announced it reached a significant intellectual property (IP) milestone: more than 200 patents granted and pending. The achievement underscores the company's technology leadership in solving one of the AI industry's most pressing challenges: efficiently cooling increasingly powerful computing systems to maximise perfor...

17 Apr 2026 | Friday | NEWS
ACCM Introduces Breakthrough Materials to Solve AI Accelerator Packaging Constraints

Advanced Chip and Circuit Materials announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material, and Celeritas HM001 is a near-zero CTE material. ...

17 Apr 2026 | Friday | NEWS
QuickLogic Expands Sales Network with Quantum Leap Solutions Partnership

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedised FPGAs, announced the appointment of Quantum Leap Solutions as an authorised sales representative. Quantum Leap Solutions will represent QuickLogic's portfolio of IP and chiplet-related offerings, expanding customer engagement across strategic markets. Qua...

17 Apr 2026 | Friday | NEWS
Artilux Unveils Hybrid Optoelectronic AI Architecture to Redefine Compute Efficiency

Artilux announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling. As AI workloads continue to scale rapidly across cloud, edge, and on-device computing, traditional digital process...

17 Apr 2026 | Friday | NEWS
Molex to Acquire Teramount to Accelerate Co-Packaged Optics Adoption

Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fibre-to-chip connectivity solutions optimised for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount's TeraVERSE® platform, based on its universal photonic coupler and wafer-level self-aligning optics, pr...

17 Apr 2026 | Friday | NEWS
HYFIX Secures $15M Seed Funding to Build U.S.-Made Chips for Autonomous Systems

HYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots. The round was led by Craft Ventures, with participation from Catapult Ventures, Multicoin Capital, Finality Capital, and Sky Dayton, a prominent hard-tech investor. The ha...

16 Apr 2026 | Thursday | NEWS
Tageos and Pragmatic Semiconductor Expand Partnership with Sustainable NFC Inlay Solutions

Tageos, a global leader in RFID and BLE inlays, and Pragmatic Semiconductor, a pioneer in flexible semiconductor technology, announced the expansion of their long-term strategic partnership with the launch of Tageos' latest product portfolio based on Pragmatic's flexible and sustainable NFC Connect product line. The new Tageos EOS Lite and EOS Zero Lite lines deliver innovative antenna d...

16 Apr 2026 | Thursday | NEWS
Sivers Semiconductors and Jabil Partner to Develop 1.6T Optical Transceivers for AI Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a collaboration with Jabil, a global engineering, supply chain, and manufacturing solutions provider. Through this collaboration, Jabil plans to develop a 1.6T linear receive optical (LRO) transceiver module using Sivers' high-performance Distributed Feedback (DFB) laser...

16 Apr 2026 | Thursday | NEWS

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