• Thursday | 12 November 2026
Toppan Advances Semiconductor Packaging And Photomask Strategy

  Toppan has outlined a sharpened semiconductor strategy that places advanced packaging and next generation photomask technologies at the heart of its growth roadmap, aligning the business more closely with accelerating global demand for artificial intelligence driven computing. The company is recalibrating its semiconductor portfolio to address the increasing complexity of chip architectur...

16 Dec 2025 | Tuesday | NEWS
Xsight’s X2 Switch Selected as Networking Core for Starlink V3 Satellites

High-bandwidth, ultra-low-power chip is leveraged for Starlink V3 satellites and future next-generation communication systems. News Highlights: Xsight’s X2 switch enables Starlink V3 satellite Delivers the performance required for rapid data processing, stable telemetry, and real-time operational responsiveness for Starlink X2’s flexible, programmable architecture adapts seam...

15 Dec 2025 | Monday | NEWS
Kioxia Unveils Highly Stackable Oxide-Semiconductor Transistors to Advance 3D DRAM

-Kioxia Corporation, a world leader in memory solutions,  announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce pow...

15 Dec 2025 | Monday | NEWS
Sivers Semiconductors Partners With DigiKey To Expand Global Access To MmWave And SATCOM Solutions

Collaboration enables faster evaluation, prototyping, and integration of Sivers' mmWave and SATCOM solutions worldwide - Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies,  announced a strategic partnership with DigiKey, a leading global distributor of electronic components and automation products. This collaboration represents a signific...

9 Dec 2025 | Tuesday | NEWS
UMC Secures Imec Silicon Photonics Technology To Accelerate 12 Inch Optical Chip Platform

  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s ...

9 Dec 2025 | Tuesday | NEWS
Rapidus To Build 1.4 Nm Advanced Chip Fabrication Facility In Japan By 2027

Japanese semiconductor start up Rapidus has announced plans to construct a 1.4 nm process node fabrication facility, marking a bold step in the country ambition to re enter the front ranks of advanced global chip manufacturing. Research and development activities for the facility are expected to begin in 2026, with volume production targeted for 2029. Once operational, the plant is ...

9 Dec 2025 | Tuesday | NEWS
AWS Unveils Graviton5-Powered EC2 M9g Instances With Up to 25% Higher Performance

At AWS re:Invent, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), today announced Amazon EC2 M9g instances powered by the new Graviton5 chip.   Key takeaways New AWS Graviton5-based Amazon EC2 M9g instances deliver up to 25% higher performance than the previous generation. With 192 cores per chip and 5x larger cache, customers can scale...

8 Dec 2025 | Monday | NEWS
Cyient Semiconductors Qualified for Key Technology IP Contract in SCL’s ₹4,500-Crore Modernization Program

Company Set to Play a Key Role in Strengthening India's Custom Silicon Capabilities  Cyient Semiconductors, a leader in custom ASIC turnkey and intelligent power solutions, announced that it has been qualified for a pivotal contract for the supply and qualification of technology IPs, including design enablement, for the ₹4,500-crore modernization initiative at the Semi-Conductor Laborato...

8 Dec 2025 | Monday | NEWS
Vinci Emerges From Stealth With $46M Funding to Launch Physics-Driven AI Platform Delivering 1,000× Faster Hardware Simulations

-Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round led by Eclipse. The company has unveiled a physics-driven AI system that operates like a team of hardware engineers, running thousands of verified simulations in hours, not weeks. Vinci was founde...

4 Dec 2025 | Thursday | NEWS
Cree LED and SANlight Partner to Launch High-Efficiency STIXX-Series Horticulture Luminaires Featuring J Series® LEDs

-Cree LED, a Penguin Solutions brand (Nasdaq: PENG), and SANlight GmbH, Schruns, Austria, announced a partnership under which SANlight will use Cree LED’s J Series® products in its new STIXX-Series luminaires. Developed for applications with limited space, the STIXX fixtures feature a slim, space-saving design with module efficiency of up to 3.1 μmol/J. Backed by LM-80 testing with...

4 Dec 2025 | Thursday | NEWS
Suchi Semicon Launches New QFN Series, Expands Power-Packaging Portfolio to Boost India’s OSAT Capabilities

Suchi Semicon, one of India’s emerging semiconductor-backend manufacturers, announced the launch of its new QFN (Quad Flat No-Lead) package series and an expanded advanced power-package portfolio, marking a significant milestone in the country’s semiconductor-packaging capabilities. The new lineup strengthens India’s domestic OSAT (Outsourced Semiconductor Assembly and Test) e...

3 Dec 2025 | Wednesday | NEWS
Izmo Microsystems Expands Into Advanced Packaging and Silicon Photonics to Serve Next-Gen AI and Cloud Markets

Izmo Microsystems, an India-based technology company,  announced its strategic expansion into semiconductor advanced packaging and silicon-photonics solutions — areas increasingly critical for next-generation AI data centres, telecom networks, and ultra-high-speed interconnects. The announcement drove Izmo’s share price up by nearly 4% in Monday trading, reflecting investor con...

2 Dec 2025 | Tuesday | NEWS
TDK Corporation and Nippon Chemical Industrial Begin Discussions on Joint Venture for Advanced Electronic Component Materials

TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...

28 Nov 2025 | Friday | NEWS
Soitec Announces Validation of Its SmartSiC Substrates for SiC Power Devices

Soitec has announced that its SmartSiC technology has successfully completed formal validation for use in next generation silicon carbide power devices, marking a major milestone for the company’s rapidly expanding power electronics business. The validation confirms that SmartSiC substrates meet strict performance, reliability and manufacturability requirements demanded by leading device m...

28 Nov 2025 | Friday | NEWS
SignOff Semiconductors Expands Global Presence with New Sales Office in Israel through Partnership with MosaIC

SignOff Semiconductors Pvt Ltd has announced the opening of its new sales office in Israel, established in partnership with MosaIC Ltd, marking a significant step in the company’s global expansion journey. The new presence positions SignOff to support one of the world’s most dynamic semiconductor ecosystems, enabling deeper engagement with customers designing for high performance app...

28 Nov 2025 | Friday | NEWS
Thermo Fisher’s Helios MX1 Brings True 3D Insight Into the Fab as Semiconductor Complexity Surges

As the semiconductor world marches into an era of extreme integration, vertically stacked designs, and unforgiving process windows, structural visibility has become nothing short of a competitive advantage. Traditional lab-bound 3D metrology, with its wafer-breaking rituals and slow feedback cycles, can no longer keep pace with the demands of high-volume manufacturing. Speaking to Se...

28 Nov 2025 | Friday | Interview
SurplusGLOBAL Marks Topping-Out of SemiMarket Parts Mall, Setting New Benchmark for Legacy Semiconductor Infrastructure

SurplusGLOBAL (CEO: Bruce Kim) announced that it has successfully held a topping-out ceremony for Building B of its Yongin Namsa Cluster, marking a symbolic milestone in the construction of what will become the world's largest offline mall and storage facility dedicated to legacy semiconductor equipment and parts, the SemiMarket Parts Mall. Rooted in a traditional Korean practice of raising the ma...

26 Nov 2025 | Wednesday | NEWS
NextVision Achieves Record Q3 Results and Strengthens Global Position With Expanded Customer Base and $414M Capital Raise

NextVision Stabilized Systems Ltd. (TASE: NXSN), a leading global provider of stabilized day- and night-vision imaging solutions for aerial and ground platforms such as micro and mini UAVs and drones, announced its financial results for the third quarter ended September 30, 2025, reflecting continued strong growth and record performance. Financial Highlights (US Dollars) Revenue: $47.2 ...

25 Nov 2025 | Tuesday | Company results
Synopsys, NVIDIA, and Microsoft Unveil Real-Time Simulation Framework to Transform Dynamic Manufacturing Processes

The framework, featuring NVIDIA Omniverse libraries, NVIDIA CUDA-X libraries, Microsoft Azure, and accelerated Synopsys physics, has demonstrated the ability to optimize bottle filling assembly lines in near real time and expand the accessibility of simulation-driven insight  Key Highlights  A blueprint for realizing the promise of digital transformation, the open-source framework ...

25 Nov 2025 | Tuesday | NEWS
Smartkem and JEV Advance Talks on Semiconductor–Energy Merger to Power Future AI Data Centers

Proposed all-stock transaction aims to align JEV's scalable energy platform with Smartkem's semiconductor innovations to power next generation AI data centers Smartkem, Inc. (Nasdaq: SMTK), ("Smartkem"), a company developing a new class of organic semiconductor technology, announced that it has agreed to a 60-day extension of its non-binding Letter of Intent ("LOI") for a proposed all-stock bus...

24 Nov 2025 | Monday | NEWS

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