• Thursday | 16 October 2025
Malema Launches M-3100 Series Clamp-On Ultrasonic Flow Meter for High-Precision Semiconductor Applications

Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, today announced the global launch of the new Malema M-3100 Series Clamp-On Ultrasonic Flow Meter. Engineered for precise fluid velocity measurement in liquid-filled closed conduits, the M-3100 Series is a high-performance, non-invasive ultr...

16 Oct 2025 | Thursday | NEWS
SemiQon and VTT Win EARTO Award for Cryogenic CMOS Chip Innovation Unlocking Quantum Computing and Space Potential

EARTO, the organisation of the European Research and Technology Organisations, awarded SemiQon and VTT first prize in the "Impact Expected" category on 14 October 2025 in Brussels for a pioneering cryogenic CMOS (complementary metal-oxide semiconductor) chip innovation. The solution enables the full capacity of advanced CMOS functionalities at cryogenic temperatures, thereby unlocking new possib...

16 Oct 2025 | Thursday | NEWS
Silicon Box Reaches 100-Million-Unit Milestone at Singapore Facility, Setting New Benchmark for Advanced Semiconductor Packaging Yield and Scale

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications  Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, announced it has shipped 100-million-units from its flagship factory in Singapore's Tampines Wafer Park. The state-of-the-art facility, which...

16 Oct 2025 | Thursday | NEWS
Ceva Expands Semiconductor Leadership with Bluetooth 6.0 Channel Sounding to Power Secure Spatial Awareness and Physical AI at the Smart Edge

Ceva strengthens its leadership as a trusted single source for advancing the smart edge, with Bluetooth® 6.0 Channel Sounding for secure spatial awareness enabling on-device intelligence and Physical AI  As industries demand greater positioning accuracy, security, and reliability for wireless connectivity, Bluetooth® 6.0 emerges as a critical enabler for next-generation high perfor...

16 Oct 2025 | Thursday | NEWS
MediaTek and NVIDIA Extend Partnership to Power a New Era of Personal AI Supercomputing

Continues MediaTek's long history of collaboration with NVIDIA to advance AI innovation from supercomputers to vehicles, IoT devices, data center solutions, and beyond  MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the ...

16 Oct 2025 | Thursday | NEWS
Pixelworks to Sell Controlling Stake in Semiconductor Subsidiary to VeriSilicon-Led Group in $133 Million Deal

  Pixelworks, Inc. , a leading provider of innovative video and display processing solutions, announced that it has signed a definitive agreement to sell its shares in Pixelworks Semiconductor Technology (Shanghai) Co., Ltd., a company organized under the laws of the People's Republic of China and a subsidiary of Pixelworks ("Pixelworks Shanghai"), to a special purpose entity ("Buyer") led b...

16 Oct 2025 | Thursday | NEWS
Analog Devices Launches ADI Power Studio to Transform Semiconductor Power System Design with Unified Modelling and Simulation Tools

Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella: ADI Po...

15 Oct 2025 | Wednesday | NEWS
Semiconductor Research Corporation Unveils MAPT Roadmap 2.0 to Accelerate U.S. Semiconductor Innovation and Workforce Growth

Semiconductor Research Corporation (SRC) is proud to announce the release of the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0, a comprehensive update to the industry’s first 3D semiconductor roadmap. This second edition reflects the contributions of over 370 experts from 132 organizations across industry, academia, and government, and builds upon the momentum of ...

15 Oct 2025 | Wednesday | NEWS
Getac Launches S510AD Rugged Copilot+ PC Powered by AMD Ryzen™ AI for Next-Generation Edge Intelligence

The new S510AD joins the B360 Plus, F120 and next generation UX10 in Getac's rapidly growing lineup of Copilot+ PCs. Powered by AMD Ryzen™ AI technology, the S510AD delivers strong on-device AI performance, supporting faster insights and reducing reliance on cloud connectivity where applications allow. The S510AD is ideally suited to professionals working in industries including a...

14 Oct 2025 | Tuesday | NEWS
Smartkem, Inc. Signs LOI with Jericho Energy Ventures to Build U.S. AI Infrastructure Using Organic Semiconductor Technology

Smartkem, Inc. (Nasdaq: SMTK), ("Smartkem"), a company developing a new class of organic semiconductor technology, announced that it has signed a non-binding Letter of Intent ("LOI") with Jericho Energy Ventures Inc. (TSX-V: JEV, OTC: JROOF) ("Jericho" or "JEV"), an energy innovation company, for a proposed all-stock business combination (the "Proposed Transaction"). If completed, the Proposed T...

10 Oct 2025 | Friday | NEWS
MetaOptics Expands Capability and Launches New Products to Drive Revenue Growth

Expanding Capability and New Products to Drive Revenue Growth MetaOptics Ltd made a strong market debut on the Catalist Board of the SGX-ST following its successful listing on 9 September 2025, with its share price surging by up to 25% on the first day of trading, closing at S$0.24 per share, significantly above the issue price of S$0.20 per share. During the first month since its successful ...

10 Oct 2025 | Friday | NEWS
NTT Research, Cornell, and Stanford Unveil World’s First Programmable Nonlinear Photonic Waveguide

Demonstration enables new applications for tunable light sources, optical and quantum computations, and communication infrastructure Highlights: New paper published in Nature details NTT Research’s development of the world’s first programmable nonlinear photonic waveguide in collaboration with Cornell University and Stanford University. A single chip of the developed device su...

9 Oct 2025 | Thursday | NEWS
Semtech Launches Next-Generation 5G AirLink® Routers with Network Slicing for Mission-Critical Public Safety Operations

New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...

8 Oct 2025 | Wednesday | NEWS
Omni Design Technologies Tapes Out 64 GSPS SWIFT™ ADC in TSMC 3nm to Power Next-Gen Data Connectivity

Omni Design Technologies, a leading provider of high-performance, low-power Wideband Signal Processing™ solutions,  announced the tape out of its new ODT-ADS-7B64G-3T, an ultra-high-speed 64 GSPS SWIFT™ analog-to-digital converter (ADC) supporting 7- and 8-bit output modes, designed in TSMC’s 3nm process. This time-interleaved ADC provides the breakthrough speed and perfor...

8 Oct 2025 | Wednesday | NEWS
OMNIVISION Expands TheiaCel™ Portfolio with OX08D20 for Advanced Driver Assistance and AD Systems

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced today its latest-generation automotive image sensor: the OX08D20 8-megapixel (MP) CMOS image sensor with TheiaCel™ technology. This new device is an upgrade to the popular OX08D10 sensor for exterior cameras used in advanced driver assistance syste...

8 Oct 2025 | Wednesday | NEWS
JEDEC Unveils UFS 5.0 Standard for AI, Mobile, and Edge Devices

Flash Optimized for AI, Mobile, and Edge Devices with Enhanced Speed, Security, and Signal Integrity JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry,  announced it is nearing completion of the next version of its highly anticipated Universal Flash Storage (UFS) standard: UFS 5.0. Designed for mobile app...

7 Oct 2025 | Tuesday | NEWS
SmartSoC Solutions and France’s Cortus Forge Strategic Partnership to Build India’s Secure Chip Ecosystem

SmartSoC Solutions Private Limited, an Indian semiconductor design and product engineering company, today announced a strategic partnership with Cortus S.A.S., a French semiconductor company renowned for its cutting-edge Intellectual Property (IP) solutions in secure identification technologies. This partnership aims to drive innovation and accelerate the development and manufacturing of SIM car...

6 Oct 2025 | Monday | NEWS
3M Joins JOINT3 Consortium to Advance Next-Generation Semiconductor Packaging

3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.  JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from org...

2 Oct 2025 | Thursday | NEWS
Sony Unveils IMX775: Industry’s Smallest 2.1 µm Pixel RGB-IR Image Sensor for In-Cabin Monitoring

Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1  Among CMOS image sensor...

2 Oct 2025 | Thursday | NEWS
Kioxia and Sandisk Begin Operations at State-of-the-Art Fab2 3D Flash Memory Facility in Japan

-Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation  announced the start of operation at the Fab2 (K2), a state-of-the-art semiconductor fabrication facility, at the Kitakami Plant in Iwate Prefecture, Japan. Fab2 has the capability to produce eighth-generation, 218-layer 3D flash memory, featuring the companies’ revolutionary CBA (CM...

1 Oct 2025 | Wednesday | NEWS

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