• Monday | 21 September 2026
Amkor Expands Arizona Advanced Packaging Campus with $12 Billion Investment

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor packaging and test services, announced phase 2 of its Arizona Advanced packaging and test campus. Driven by strong customer commitments that have surpassed the 33,000 square meters of cleanroom capacity planned for phase 1, the phase 2 expansion is expected to add 60,000 square meters and bring the campus to appr...

11 Sep 2026 | Friday | NEWS
Hanmi Semiconductor Expands 2.5D Packaging Equipment Presence in Taiwan

South Korean semiconductor equipment maker Hanmi Semiconductor has secured an important foothold in Taiwan’s advanced packaging market after its 2.5D bonding equipment passed mass-production qualification at a Taiwanese foundry. The company has subsequently begun supplying its packaging bonders to the unnamed customer, marking a significant step in Hanmi’s efforts to expand beyond its ...

8 Sep 2026 | Tuesday | NEWS
Manz Asia and SUSS Partner to Advance Inkjet Solutions for Semiconductor Packaging

A leading manufacturer of advanced semiconductor packaging equipment, Manz Asia, announced a strategic collaboration with SUSS, a leading manufacturer of equipment and process solutions for the semiconductor industry, to jointly advance next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications. As semiconductor manufacturing moves toward higher integrati...

7 Sep 2026 | Monday | NEWS
Semiconductor Packaging Services Market to Reach US$118.59 Billion by 2035

The global semiconductor packaging services market is expected to expand significantly over the coming decade as rising demand for artificial intelligence (AI), high-performance computing (HPC), high-bandwidth memory (HBM) and chiplet-based architectures increases the need for sophisticated packaging and testing capabilities. According to DataM Intelligence, the market was valued at US$44.50 billi...

3 Sep 2026 | Thursday | NEWS
Qnity Unveils Advanced Packaging Materials for AI and High-Performance Computing Chips

Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redi...

11 Jun 2026 | Thursday | NEWS
Wolfspeed, Inc. Positions 300 MM Silicon Carbide Platform for Artificial Intelligence and High Performance Computing

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...

18 Mar 2026 | Wednesday | NEWS
Micron Inaugurates $2.75 Billion Semiconductor Assembly and Test Facility in Sanand, Marking India’s Entry into Commercial Chip Production

  Micron Technology, Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India. The state-of-the-art facility converts advanced DRAM and NAND wafers from Micron's global manufacturing network into finished memory and storage products. Once fully ramped, the first phase of Micron’s Sanand operation will feature more than 500,000 square f...

2 Mar 2026 | Monday | NEWS
Micron Bets $24 Billion On Memory Expansion As AI Driven Demand Lifts Shares

Micron Technology has announced plans to invest approximately $24 billion to expand its memory chip manufacturing capacity, signalling strong confidence in sustained demand driven by artificial intelligence and data centre workloads. The announcement pushed Micron’s shares higher, reflecting investor optimism around tightening memory markets and long term growth prospects. The investment ...

3 Feb 2026 | Tuesday | NEWS
SEMIFIVE Details IPO and Growth Strategy as Demand Accelerates for Custom AI ASICs

As demand shifts from general-purpose semiconductors toward AI ASICs, SEMIFIVE provides customized chip development solutions to fabless companies and device manufacturers. New orders have increased from KRW 57.2 billion in 2022 to KRW 123.9 billion in 2024, driven by Big-Tech-Ready high-performance AI ASIC technologies, a highly efficient and scalable design platform, and turnkey services. ...

18 Dec 2025 | Thursday | NEWS
Ecolab Completes Acquisition of Ovivo Electronics to Power Water Circularity in Semiconductor Manufacturing

  Acquisition enables Ecolab’s water circularity offerings and support for customers in the rapidly growing global high tech industry Ecolab Inc. has closed on its previously announced acquisition of Ovivo’s electronics business, a leading and fast-growing global provider of breakthrough ultrapure water technologies for semiconductor manufacturing. The acquisition extends E...

18 Dec 2025 | Thursday | NEWS
BTQ Technologies Added to Defiance Quantum ETF

BTQ Technologies Corp., a global quantum technology company focused on securing mission-critical networks, is pleased to announce that it has been added to the Defiance Quantum ETF , a thematic exchange traded fund that seeks to track the performance of the BlueStar Machine Learning and Quantum Computing Index ("BQTUM"). BTQ believes inclusion in QTUM broadens institutional and retail visibilit...

17 Dec 2025 | Wednesday | NEWS
AI Boom Powers Three-Year Surge in Semiconductor Equipment Spending Through 2027

Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing 13.7% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective...

17 Dec 2025 | Wednesday | NEWS
India Broadens Chip Incentives, Targeting Compound Semiconductors and Advanced Packaging Capabilities

Government of India has approved an expanded set of incentives aimed at accelerating domestic manufacturing of compound semiconductors and advanced packaging, marking a significant step in building strategic depth across critical technology supply chains. The enhanced support framework is designed to attract investment into high value segments such as compound semiconductors, wh...

16 Dec 2025 | Tuesday | NEWS
Toppan Advances Semiconductor Packaging And Photomask Strategy

  Toppan has outlined a sharpened semiconductor strategy that places advanced packaging and next generation photomask technologies at the heart of its growth roadmap, aligning the business more closely with accelerating global demand for artificial intelligence driven computing. The company is recalibrating its semiconductor portfolio to address the increasing complexity of chip architectur...

16 Dec 2025 | Tuesday | NEWS
Xsight’s X2 Switch Selected as Networking Core for Starlink V3 Satellites

High-bandwidth, ultra-low-power chip is leveraged for Starlink V3 satellites and future next-generation communication systems. News Highlights: Xsight’s X2 switch enables Starlink V3 satellite Delivers the performance required for rapid data processing, stable telemetry, and real-time operational responsiveness for Starlink X2’s flexible, programmable architecture adapts seam...

15 Dec 2025 | Monday | NEWS
Kioxia Unveils Highly Stackable Oxide-Semiconductor Transistors to Advance 3D DRAM

-Kioxia Corporation, a world leader in memory solutions,  announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce pow...

15 Dec 2025 | Monday | NEWS
Sivers Semiconductors Partners With DigiKey To Expand Global Access To MmWave And SATCOM Solutions

Collaboration enables faster evaluation, prototyping, and integration of Sivers' mmWave and SATCOM solutions worldwide - Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies,  announced a strategic partnership with DigiKey, a leading global distributor of electronic components and automation products. This collaboration represents a signific...

9 Dec 2025 | Tuesday | NEWS
UMC Secures Imec Silicon Photonics Technology To Accelerate 12 Inch Optical Chip Platform

  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s ...

9 Dec 2025 | Tuesday | NEWS
Rapidus To Build 1.4 Nm Advanced Chip Fabrication Facility In Japan By 2027

Japanese semiconductor start up Rapidus has announced plans to construct a 1.4 nm process node fabrication facility, marking a bold step in the country ambition to re enter the front ranks of advanced global chip manufacturing. Research and development activities for the facility are expected to begin in 2026, with volume production targeted for 2029. Once operational, the plant is ...

9 Dec 2025 | Tuesday | NEWS
AWS Unveils Graviton5-Powered EC2 M9g Instances With Up to 25% Higher Performance

At AWS re:Invent, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), today announced Amazon EC2 M9g instances powered by the new Graviton5 chip.   Key takeaways New AWS Graviton5-based Amazon EC2 M9g instances deliver up to 25% higher performance than the previous generation. With 192 cores per chip and 5x larger cache, customers can scale...

8 Dec 2025 | Monday | NEWS

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