Skyworks Solutions and MediaTek Demonstrate Early 6G RF Front-End Technology
Semiconductor partners unveil FR3 power amplifier module supporting next-generation wireless connectivity.
Skyworks Solutions, a semiconductor manufacturer based in Irvine, California, specialising in analogue and mixed-signal technologies, has unveiled an early-stage 6G RF front-end (RFFE) power amplifier designed for the new FR3 frequency range at Mobile World Congress 2026 in Barcelona, Spain (2–5 March). The demonstration has been developed in collaboration with Taiwanese fabless semiconductor company MediaTek, which designs system-on-chip platforms for mobile devices, home entertainment systems, connectivity solutions and IoT products.
The live demonstration highlights the companies’ continued collaboration to support the development of next-generation wireless technologies and accelerate progress towards future 6G connectivity.
At MediaTek’s stand in Hall 3, the company is presenting a reference design that incorporates the SKYR60002 advanced 6G FR3 low-noise amplifier (LNA) and power amplifier module with integrated filters. The module is designed to support the 6.425GHz to above 7GHz spectrum introduced in the latest 3GPP standard.
The SKYR60002 module provides the high linearity, wide bandwidth capability and strong thermal performance required to meet the demanding technical specifications set by the standard.
Skyworks is also showcasing the SKY58287-11 power amplifier module, a highly efficient ultra-high-band (UHB) PC1 RFFE module optimised for MediaTek platforms. The solution addresses the growing demand among network operators to extend both the reach and performance of their network infrastructure.
The module incorporates advanced packaging technology that reduces thermal resistance, eliminating the need for a heat sink and simplifying system integration for high-performance fixed wireless and broadband applications. Support for Power Class 1 (PC1) further improves 5G cell-edge coverage, particularly for wireless home internet services.
Evan Su, General Manager of MediaTek’s Wireless Communications Business Unit, said that 6G will introduce new performance requirements, including wider bandwidths, higher frequencies and more advanced air-interface technologies. He added that working closely with Skyworks on early power amplifier development and reference platforms helps align chipset and RF development roadmaps, enabling improved performance and earlier access to validated end-to-end solutions. This collaboration is expected to accelerate innovation and support the development of future 6G applications.
Joel King, Senior Vice-President and General Manager of Mobile Solutions at Skyworks, noted that the partnership with MediaTek is driving meaningful progress in next-generation wireless front-end technology. By demonstrating both an early 6G FR3 power amplifier and a high-efficiency UHB PC1 solution, the companies are highlighting how strong integration between chipsets and RF front-end components can support innovation, enhance system performance and simplify design processes for customers preparing for the next stage of wireless connectivity.
Engineering samples of the SKYR60002 6G FR3 LNA power amplifier module, covering the 6.425GHz to above 7GHz spectrum, and the SKY58287-11 UHB PC1 front-end module will be made available to early-access partners in line with MediaTek’s chipset evaluation schedule.
