• Thursday | 22 October 2026
SUSS Expands into Wafer Cleaning with GreenTec Solutions and 2027 Manufacturing Roadmap

As advanced packaging and semiconductor manufacturing become increasingly complex, demand for efficient, sustainable wafer-cleaning technologies is growing. SUSS is entering this market with GreenTec Solutions, expanding its photomask cleaning expertise into wafer-level applications. Semicon Leaders Asia speaks with Yuta Nagai, Senior Vice President, Photomask Solutions at SUSS, about the company'...

22 Oct 2026 | Thursday | Interaction
Rocket One Partners with Virginia Commonwealth University to Develop Energy-Efficient Magnetic Computing Devices

Rocket One Inc. ("Rocket One" or the "Company") announced a sponsored research agreement with Virginia Commonwealth University ("VCU") to develop and demonstrate magnetic computing devices targeting a critical challenge in artificial intelligence: delivering greater computational capability while reducing energy consumption. The agreement establishes a one-year fabrication and testing progra...

21 Oct 2026 | Wednesday | NEWS
The AI Chip Supply Chain in 2026: 10 Pinch Points, Ranked by How Long They Will Last

SEMICON LEADERS ASIA ANALYSIS | OCTOBER 2026 Key takeaways HBM is the most severe shortage of 2026, but not the most durable. Record memory capex should bring meaningful relief by 2028, even if supply does not fully normalise in 2027. Wafers, CoWoS-class packaging and liquid cooling are cyclical constraints. Committed capacity with visible start dates should ease them from the second half of ...

21 Oct 2026 | Wednesday | NEWS
Saxony and Arizona Strengthen Semiconductor Industry Cooperation

Saxony and the U.S. state of Arizona intend to further expand their ties in the semiconductor industry. Saxony Trade & Invest Corp. (WFS) and the Arizona Commerce Authority (ACA) used SEMICON West, the leading US trade fair for the semiconductor industry, which took place in San Francisco to foster closer links between companies and institutions from both semiconductor regions and to explore f...

20 Oct 2026 | Tuesday | NEWS
GlobalFoundries Selected for $21 Billion US-Japan Semiconductor Fab Initiative

GlobalFoundries (Nasdaq: GFS) (GF) today announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (“fabs”) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. Enabled by President Donald J. Trump's trade and investment agreement with Japan, the initiative will accelerate trus...

19 Oct 2026 | Monday | NEWS
Global X Launches Asia Semiconductor ETF Covering Key Regional Chip Markets

-Global X Management Company LLC (“Global X”), the New York-based provider of exchange-traded funds (ETFs), announced the launch of the Global X Asia Semiconductor ETF (ticker ACHP). ACHP (“the Fund”) seeks to invest in companies that are positioned to benefit from the growth and advancement of the Asian semiconductor ecosystem. This includes companies involved in semicond...

16 Oct 2026 | Friday | NEWS
ChipAgents and NVIDIA Launch Benchmark for End-to-End Chip Design Automation

ChipAgents developed Build-A-Chip-Bench with NVIDIA to evaluate AI agents across the end-to-end digital IC design flow, from specification through physical implementation and verified Graphic Design System (GDS). Unlike point benchmarks focused primarily on RTL generation or verification, Build-A-Chip-Bench tests whether agents can meet functional, timing, power, area, and physical-verification...

16 Oct 2026 | Friday | NEWS
Great Lakes Semiconductor Launches First Great American ChipForge Project

Great Lakes Semiconductor (GLS) announced the first project on its Great American ChipForge™ platform, launched under the company's Innovation Funnel™ initiative. The project draws on multiple GLS design centers, ChipForgeTM modular wafer fabrication, and FINPAT™ packaging and test, demonstrating the company's distributed, end-to-end integration capabilit...

15 Oct 2026 | Thursday | NEWS
WPG Americas Partners with Nuvoton to Expand Semiconductor Distribution in North America

WPG Americas Inc. (WPGA), a leading distributor of electronic components and supply chain services, announced a strategic partnership with Nuvoton Technology Corporation America (NTCA), a leading provider of microcontroller, audio, cloud security, battery monitoring, component, and visual sensing IC solutions. Through the partnership, WPGA will distribute Nuvoton's portfolio of high-performance, ...

15 Oct 2026 | Thursday | NEWS
10 Policy and Trade Moves That Redrew the Global Chip Map in 2026

KEY TAKEAWAYS Governments spent 2026 managing flows rather than stopping them: licences with conditions, tariffs with carve-outs, minerals rules backed by enforcement. Industrial policy moved beyond the fab into packaging, materials, equipment, design and talent, from New Delhi to Brussels to Seoul. For buyers, available capacity and accessible capacity are no longer the same thing. Complianc...

14 Oct 2026 | Wednesday | Analysis
Applied Materials Opens $5 Billion EPIC Center for Semiconductor R&D

$5 billion investment creates the world’s largest semiconductor equipment and process technology R&D facility Purpose-built to accelerate the path from breakthrough innovation to high-volume manufacturing of next-generation chipmaking technologies Leading chipmakers, systems companies, equipment partners and research universities have committed to develop inside EPIC ...

14 Oct 2026 | Wednesday | NEWS
LG Expands Chiller Production in US and South Korea for AI Data Centres

LG Electronics is expanding chiller production across three manufacturing facilities by establishing a new factory in the United States and expanding production at its existing facilities in Changwon and Pyeongtaek, South Korea. The new U.S. facility in Virginia will enable local chiller production and help LG respond quickly to growing chiller demand across North America. Through its “O...

13 Oct 2026 | Tuesday | NEWS
Kioxia Joins Applied Materials’ EPIC Center to Advance AI Memory

Companies will collaborate to develop advanced memory structures, chip stacking technologies and materials engineering innovations to increase AI memory performance KIOXIA joins Applied Materials’ growing EPIC Center ecosystem, which includes chipmakers, chip designers, equipment partners and universities Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solut...

13 Oct 2026 | Tuesday | NEWS
Applied Materials, UCLA Partner on AI Chip R&D at EPIC Center

Applied Materials has added the UCLA Samueli School of Engineering as a research collaborator at its Equipment and Process Innovation and Commercialization, or EPIC, Center in Silicon Valley, expanding the company’s academic partnerships around next-generation semiconductor development. Researchers from UCLA will work alongside Applied Materials scientists and engineers to address semicondu...

12 Oct 2026 | Monday | NEWS
GlobalFoundries, TSMC Sign $2 Billion Deal for US AI Chip Packaging Supply

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to establish US production of silicon interposers used in advanced semiconductor packaging. Under the agreement, GlobalFoundries will expand manufacturing capacity at its facility in Malta, New York, where it will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. The companies have agreed an i...

12 Oct 2026 | Monday | NEWS
Wolfspeed Secures Conditional $1.5 Billion US Commitment for Domestic SiC Production

Wolfspeed has received a conditional commitment for up to $1.5 billion in long-term financing from the US Department of War through its Office of Strategic Capital, as the company looks to strengthen domestic production of silicon carbide and other wide-bandgap semiconductor technologies. The proposed financing carries a 30-year term and is intended to support the development and manufacture of s...

9 Oct 2026 | Friday | NEWS
The 10 Stories That Defined Semiconductors in 2026 So Far, and What the Market Got Wrong

Semiconductor headlines in 2026 have been unusually large. AI accelerator demand kept climbing. Memory prices surged. Washington rewrote parts of its China chip policy. Beijing's domestic AI hardware push gathered pace. India committed another ₹1,27,500 crore to semiconductors through Semicon 2.0, and Japan kept putting public and private capital behind Rapidus. The market numbers make the exci...

9 Oct 2026 | Friday | Analysis
EMD Electronics Opens New Wisconsin R&D Facility to Advance Semiconductor Materials

Part of $200 million multi-year investment strengthening the company's U.S. Electronics footprint, enabling further growth for the industry New 38,000-square-foot Sheboygan Falls, Wisconsin facility expands R&D capabilities for advanced materials critical to next-generation chip manufacturing Dedicated synthesis, scale-up, and technology transfer capabilities are designed to shorten the ...

8 Oct 2026 | Thursday | NEWS
Qnity Launches Kalrez 7080 Sealing Solution for High-Temperature Semiconductor Processes

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C. Designed to support increasingly demanding thermal environments, the new solution strengthens Q...

7 Oct 2026 | Wednesday | NEWS
MICROIP and AQLS Expand North American Opportunities in Edge AI, Drones and Custom Silicon

MICROIP Inc. (TPEx: 7796) and its group company, AQLS Inc., generated strong commercial traction across defense, healthcare and energy sectors during Taiwan Expo USA 2026 in Dallas. The group engaged with over 100 North American and international organizations, while U.S. state and local government officials explored local operations. Following MICROIP's recent APAC automotive wins and a 20 millio...

6 Oct 2026 | Tuesday | NEWS

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