• Sunday | 08 February 2026
Nobody 2" to Hit Premium Screens with Pixelworks' TrueCut Motion for Unmatched Action Clarity

Pixelworks, Inc., announced that Universal Pictures' Nobody 2will be presented with TrueCut Motion™ technology on selected premium screens worldwide.  Under the direction of the filmmakers, the Pixelworks motion grading team utilized advanced TrueCut Motion technology to bring stunning motion clarity to the new chapter from the bare-knuckle action-thriller, Nobody, which opened at num...

28 Sep 2025 | Sunday | NEWS
SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...

28 Sep 2025 | Sunday | NEWS
Pixelworks X7 Gen 2 Powers Visual Excellence in Newly Launched realme P4 5G and P4 Pro 5G Smartphones

Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...

28 Sep 2025 | Sunday | NEWS
SK hynix Begins Mass Production of World’s First 321-Layer 2Tb QLC NAND Flash

SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...

28 Sep 2025 | Sunday | NEWS
Sony Showcases Real-World Edge AI Traffic Solutions at ITS World Congress 2025

ITS WORLD (Booth #1605) – Sony Semiconductor Solutions announced its participation at the upcoming ITS World Congress, where it will highlight two groundbreaking municipal deployments of its advanced edge AI sensing technologies a road safety initiative in Lakewood, Colorado, and a comprehensive traffic management pilot with the City of San José, California. These real-world e...

28 Sep 2025 | Sunday | NEWS
OpenLight Closes $34M Series A to Accelerate Photonic Chip Innovation for AI-Driven Data Centers

OpenLight, a leader in custom Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing based on heterogeneous integration, today announced the close of its oversubscribed $34MSeries A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture ...

28 Sep 2025 | Sunday | NEWS
Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...

28 Sep 2025 | Sunday | NEWS
Aion Silicon Joins Intel Foundry’s Value Chain Alliance to Deliver Full-Stack Custom SoC Solutions

Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture partner, announced its membership in the Intel Foundry Accelerator Value Chain Alliance (VCA). As a VCA partner, Aion Silicon expands its existing turnkey service offerings to deliver full-stack custom silicon—from architecture through packaged silicon—across multiple market segments and geographies. This new allia...

28 Sep 2025 | Sunday | NEWS
Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications

Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...

28 Sep 2025 | Sunday | NEWS
Advanced Packaging Surges Past $50B as E&R Engineering Showcases Next-Gen Solutions at SEMICON Taiwan 2025

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...

28 Sep 2025 | Sunday | NEWS
AI Boom Reshapes Global Tech and Semiconductor Supply Chains

Semiconductor and electronics supply chains are undergoing a major transformation, driven by the rapid growth of artificial intelligence (AI), changing market leadership, and global supply chain relocation, according to DIGITIMES. DIGITIMES vice president Eric Huang highlighted the shift in global industry power before and after the generative AI boom. In 2018, five technology companies ranked ...

28 Sep 2025 | Sunday | NEWS
iDEAL Semiconductor Begins Mass Production of Industry-Leading 200 V SuperQ™ MOSFETs

iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching and conduction. It delivers a step-change in performance and efficiency while preservin...

27 Sep 2025 | Saturday | NEWS
Axcelis Launches GSD Ovation™ ES Ion Implanter for Advanced Engineered Substrate Applications

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's GSD Ovation™ ES high current ion implanter, targeted specifically for engineered substrates.  Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enable...

27 Sep 2025 | Saturday | NEWS
EV Group Unveils EVG®40 D2W, First Dedicated Die-to-Wafer Overlay Metrology Platform for 300-mm Production

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With...

27 Sep 2025 | Saturday | NEWS
d-Matrix Unveils JetStream™ I/O Card to Power Ultra-Low Latency, Scalable AI Inference at Data Center Scale

d-Matrix® announced the expansion of its AI product portfolio with d-Matrix JetStream™, a custom I/O card designed from the ground up to deliver industry-leading, data center–scale AI inference. With millions of people now using AI services – and the rise of agentic AI, reasoning, and multi-modal interactive content – the industry's focus is quickly shifting fro...

27 Sep 2025 | Saturday | NEWS
ROHM Unveils World’s Lowest Power Ultra-Compact CMOS Op Amp for Space-Constrained Sensing Applications

ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...

27 Sep 2025 | Saturday | NEWS
PI Launches Nanopositioning & Micropositioning Essentials Portfolio for Fast, Scalable Precision Motion Solutions

PI (Physik Instrumente), a global leader in precision motion control and nano-positioning technologies, offers its Nanopositioning & Micropositioning Essentials portfolio, delivering core components with reduced lead times and volume discounts tailored for OEMs in research, automation, and advanced manufacturing. This curated Essentials product line features high-precision building blo...

27 Sep 2025 | Saturday | NEWS
Samsung Partners with Valens Semiconductor to Advance MIPI A-PHY Standard for Next-Gen Automotive Connectivity

Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...

27 Sep 2025 | Saturday | NEWS
AP Memory Introduces ApSRAM™ for Edge AI and IoT, with Mass Production Set for Year-End

AP Memory, a leading global design company providing customized memory solutions, announced that its next-generation PSRAM—ApSRAMTM (Attached-pSRAM)—has successfully passed customer validation and is scheduled to begin mass production by the end of the year. ApSRAMTM is an advanced version of AP Memory's PSRAM (Pseudo Static Random Access Memory), featuring a new architecture optimiz...

27 Sep 2025 | Saturday | NEWS
Lam Research Debuts VECTOR® TEOS 3D to Power Advanced Chip Packaging for AI and HPC

Lam Research Corp.  unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, ...

27 Sep 2025 | Saturday | NEWS

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