• Sunday | 08 February 2026
Fourier Cooling Introduces Modular, High-Density Liquid-Cooled Data Centers for AI and HPC Workloads

Fourier Cooling Solutions ("Fourier"), a next-generation company dedicated to AI and HPC data center infrastructure, announced its official launch. Fourier introduces a portfolio of prefabricated, containerized data center solutions engineered to scale in step with the rapid evolution of GPUs, CPUs, and high-computing servers, meeting the accelerating demands of artificial intelligence (AI) and ...

1 Oct 2025 | Wednesday | NEWS
Hyundai Mobis Leads First Private-Sector Automotive Semiconductor Forum in Korea

Aiming to strengthen the private-sector-led domestic automotive semiconductor ecosystem, expanding interdisciplinary cooperation across foundries, fabless companies, packaging companies, and more The company hosted the inaugural Auto Semicon Korea with the goal to localize automotive semiconductors and create a self-sustaining domestic value chain and business opportuniti...

1 Oct 2025 | Wednesday | NEWS
ShunYun Technology and NewPhotonics Forge Strategic OSAT Partnership to Accelerate High-Volume PIC Manufacturing

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...

1 Oct 2025 | Wednesday | NEWS
NEPCON ASIA 2025 Set to Ignite Innovation in Electronics Manufacturing at Shenzhen World Expo

Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities. Featuring an ever-expanding showcase of automation equipment and technologies, the ...

28 Sep 2025 | Sunday | NEWS
Microelectronics UK Exhibition Launches at Excel London to Unite Industry Leaders and Innovators

Senior engineers, company leaders, investors, researchers and students of microelectronics are to have a new opportunity to meet, discover and learn with the launch of the Microelectronics UK exhibition, to be held on 24-25 September 2025 at the Excel London. The event, the first in the UK to bring together the entire microelectronics value chain, will feature zones and content for semiconducto...

28 Sep 2025 | Sunday | NEWS
SK keyfoundry and LB Semicon Co-Develop High-Reliability Direct RDL Technology for Automotive and Next-Gen Semiconductor Packaging

SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
FICG Accelerates AI Factory Connectivity with Advanced Optical Transceiver Packaging

As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing...

28 Sep 2025 | Sunday | NEWS
InPsytech Tapes Out UCIE 2.0-Compliant Design on TSMC's SoIC F2F Technology

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...

28 Sep 2025 | Sunday | NEWS
Tekscend Photomask Installs Europe's First SLX1 Laser Writer to Boost Regional Chip Manufacturing

Tekscend Photomask (formerly Toppan Photomask), the world's largest merchant photomask supplier for the semiconductor industry, has installed a state-of-the-art photomask laser writing system, the SLX1, at its Corbeil, France facility. This marks the first European deployment of the SLX1 system, manufactured by Swedish technology leader, Mycronic AB.  The new system represents a strat...

28 Sep 2025 | Sunday | NEWS
Baya Systems Honored with 2025 Global Technology Innovation Leadership Recognition by Frost & Sullivan

Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...

28 Sep 2025 | Sunday | NEWS
Delta Opens Smart Manufacturing Innovation Center in Taiwan, Launches Joint Cyber-Physical Classroom with NVIDIA

Delta, a global leader in power management and smart green solutions, inaugurated in Taiwan its Smart Manufacturing Innovation Center, a strategic hub for equipment validation and talent training programs to support customers implementing geographically-distributed production and smart centralized management. At this one-stop platform site featuring hands-on training as well as production verifi...

28 Sep 2025 | Sunday | NEWS
Ceva Named #1 Wireless Connectivity IP Vendor by IPnest, Holding 68% Market Share

Reinforcing the company's pivotal role in enabling the intelligent, connected world, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, announced it has once again been named the #1 vendor in Wireless Connectivity IP by IPnest in its latest 2025 Design IP Report. Ceva grew its wireless connectivity IP market share to 68% in 2024 - more than 10 times la...

28 Sep 2025 | Sunday | NEWS
SuperX Launches XN9160-B200 AI Server Powered by NVIDIA Blackwell B200 GPUs

Super X AI Technology Limited (Nasdaq: SUPX) ("Company" or "SuperX") announced the launch of its latest flagship product — the SuperX XN9160-B200 AI Server. Powered by NVIDIA's Blackwell architecture GPU (B200), this next-generation AI server is engineered to meet the rising demand for scalable, high-performance computing in AI training, machine learning (ML), and high-performance com...

28 Sep 2025 | Sunday | NEWS
iDEAL Semiconductor Partners with Richardson Electronics to Expand Reach of Breakthrough SuperQ Power MOSFETs

iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF  specialist, Richardson Electronics. Under the agreement, iDEAL will gain access to Richardson Electronics' design teams and sales specialists to expand the reach of its ultra-efficient, high-performance power MOSFETs, which are based o...

28 Sep 2025 | Sunday | NEWS
Open Compute Project Advances Silicon Diversity with New Universal D2D Transaction and Link-Layer Spec Covering UCIe

The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...

28 Sep 2025 | Sunday | NEWS
Quantum Computing Inc. Secures Landmark NIST Contract and Major Fortune 500 Order for Advanced Photonic Integrated Circuits

Quantum Computing Inc. ("QCi" or the "Company"), an innovative, integrated photonics and quantum optics technology company, announced it has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs). In addition, the Comp...

28 Sep 2025 | Sunday | NEWS
NEO Semiconductor Unveils World’s First Extreme High Bandwidth Memory (X-HBM) Architecture for Next-Gen AI Chips

NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of tra...

28 Sep 2025 | Sunday | NEWS
Ceva Surpasses 20 Billion Devices Shipped, Ushering in the Next Era of Smart Edge AI

In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva's legacy as a foundational technology provider of the mobile and IoT eras, but sets the...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS

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