• Thursday | 14 May 2026
Rigaku Introduces ONYX™ 3200 for High-Precision Semiconductor Bump and BEOL Metrology

Rigaku Corporation, a global partner in X-ray analytical systems solutions and a Rigaku Holdings Corporation company (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), announced the launch of the ONYX 3200, a new semiconductor metrology system for measuring the thickness, composition, and bump structures* in wafer-level processes. The system is designed to help m...

19 Dec 2025 | Friday | NEWS
Advantech Partners With DEEPX to Launch First NPU-Powered Edge AI Acceleration Module

Advantech, a global leader in IoT intelligent systems and embedded platforms, announced its partnership with DEEPX, a leading Korean AI semiconductor innovator specializing in NPU (Neural Processing Unit) technology. This collaboration expands Advantech's AI chipset ecosystem and introduces the company's first AI acceleration solution powered by DEEPX technology, the EAI-1961 series Edge AI Acce...

18 Dec 2025 | Thursday | NEWS
Ecolab Completes Acquisition of Ovivo Electronics to Power Water Circularity in Semiconductor Manufacturing

  Acquisition enables Ecolab’s water circularity offerings and support for customers in the rapidly growing global high tech industry Ecolab Inc. has closed on its previously announced acquisition of Ovivo’s electronics business, a leading and fast-growing global provider of breakthrough ultrapure water technologies for semiconductor manufacturing. The acquisition extends E...

18 Dec 2025 | Thursday | NEWS
Broadcom CEO Hock Tan Highlights Record Q4 Results With 68% EBITDA Margin and Strong Cash Flow

Revenue of $18,015 million for the fourth quarter, up 28 percent from the prior year period GAAP net income of $8,518 million for the fourth quarter; Non-GAAP net income of $9,714 million for the fourth quarter Adjusted EBITDA of $12,218 million for the fourth quarter, or 68 percent of revenue GAAP diluted EPS of $1.74 for the fourth quarter; Non-GAAP diluted EPS of $1.9...

17 Dec 2025 | Wednesday | Company results
GIBO Holdings Partners With E Total Technology to Develop AI Compute Centers in Malaysia

GIBO Holdings Ltd. announced a strategic collaboration with Malaysia-based technology and infrastructure solutions provider E Total Technology Sdn Bhd, under which the parties will work together on the planning, site sourcing, feasibility studies, and deployment of next-generation artificial intelligence compute centers in Malaysia. The project is expected to incorporate NVIDIA's most advanced h...

17 Dec 2025 | Wednesday | NEWS
AI Boom Powers Three-Year Surge in Semiconductor Equipment Spending Through 2027

Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing 13.7% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective...

17 Dec 2025 | Wednesday | NEWS
Quantum Computing Inc. to Acquire Luminar Semiconductor Unit for $110M in Cash

Luminar Technologies, Inc. a leading global technology company, announced that it has entered into an agreement with Quantum Computing Inc. (“QCi”) pursuant to which QCi will acquire Luminar Semiconductor, Inc. (“LSI”), a wholly owned subsidiary of Luminar, in an all-cash transaction valued at $110 million. QCi is an integrated photonics and quantum optics technology com...

17 Dec 2025 | Wednesday | NEWS
Semiconductors Enter Industry-Wide Expansion as 3Q25 Revenue Breaks $200B Barrier

-New research from Omdia shows that the semiconductor market delivered a record breaking performance in 3Q25 with industry revenue reaching $216.3bn, up 14.5% quarter-over-quarter (QoQ). This marks the first time the global semiconductor market has exceeded $200bn in a single quarter, following an already strong 2Q25, which saw 8% QoQ growth. At this pace, the industry is on track to exceed $800...

17 Dec 2025 | Wednesday | NEWS
India Broadens Chip Incentives, Targeting Compound Semiconductors and Advanced Packaging Capabilities

Government of India has approved an expanded set of incentives aimed at accelerating domestic manufacturing of compound semiconductors and advanced packaging, marking a significant step in building strategic depth across critical technology supply chains. The enhanced support framework is designed to attract investment into high value segments such as compound semiconductors, wh...

16 Dec 2025 | Tuesday | NEWS
Singapore Doubles Down on Skills and R&D to Future-Proof Its Semiconductor Ecosystem

Singapore has set out a fresh push to strengthen its semiconductor sector through targeted workforce development and expanded research infrastructure, reinforcing its ambition to remain a key node in the global chip ecosystem. The initiative centres on building deep technical capability to support next generation semiconductor manufacturing, design and integration. New training ...

16 Dec 2025 | Tuesday | NEWS
Taiwan Strengthens Semiconductor Leadership While Opening Doors to Global Capital

  Taiwan is reinforcing its position at the centre of the global semiconductor industry, combining deep rooted technological expertise with a renewed openness to foreign investment as demand for advanced chips continues to accelerate worldwide. The island’s semiconductor ecosystem is entering a new phase of expansion, marked by sustained capital inflows, capacity upgra...

16 Dec 2025 | Tuesday | NEWS
Toppan Advances Semiconductor Packaging And Photomask Strategy

  Toppan has outlined a sharpened semiconductor strategy that places advanced packaging and next generation photomask technologies at the heart of its growth roadmap, aligning the business more closely with accelerating global demand for artificial intelligence driven computing. The company is recalibrating its semiconductor portfolio to address the increasing complexity of chip architectur...

16 Dec 2025 | Tuesday | NEWS
Kioxia Unveils Highly Stackable Oxide-Semiconductor Transistors to Advance 3D DRAM

-Kioxia Corporation, a world leader in memory solutions,  announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce pow...

15 Dec 2025 | Monday | NEWS
Quilter Breaks Hardware Barriers With World’s First AI-Designed Computer

Quilter, the physics-driven AI for electronics design,  announced the world’s first computer designed by artificial intelligence. A single engineer completed the layout taking a schematic to manufacturing-ready files in less than a week, a process that traditionally takes an entire engineering team months and requires multiple rounds of redesign. This initiative, called Project Speedr...

12 Dec 2025 | Friday | NEWS
Nordic Semiconductor Launches nRF9151 SMA Development Kit for Next-Gen Cellular IoT and Satellite Connectivity

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces the launch of the nRF9151 SMA Development Kit (DK), a specialized DK for RF engineers developing cellular IoT, DECT NR+, and Non-Terrestrial Network (NTN) applications. Alongside the hardware release, Nordic has launched new modem firmware that adds NTN (satellite) support to the nRF9151 module – ...

12 Dec 2025 | Friday | NEWS
VisIC Technologies Secures $26M in Round B Funding to Accelerate GaN Power Innovation for Next-Gen EVs

VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility,  announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, with HKMC joining as a strategic investor. This milestone reinforces VisIC's position at the forefront of GaN innovation for EV traction inverters and...

12 Dec 2025 | Friday | NEWS
EMASS–Semtech Alliance Accelerates Autonomous Edge AI with Long-Range, Ultra-Low-Power Connectivity

  EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology,  announced a strategic collaboration with Semtech to bring low-power edge AI solutions integrated with LoRaWAN® connectivity to market. EMASS's ECS-DoT AI-enabled system-on-chips (SoCs) integrate Semtech's LoRa® transceivers, enabling long-range, battery-efficient intelligence for industrial,...

11 Dec 2025 | Thursday | NEWS
Cirrus Logic Introduces High Definition Haptics Platform for Vehicles

-Cirrus Logic (NASDAQ: CRUS), a leading provider of high-performance audio and mixed-signal semiconductor solutions, today announced the launch of its new family of closed-loop haptic drivers CS40L51, CS40L52 and CS40L53, marking the company’s first haptic driver solutions reliability qualified in accordance with the AEC-Q100 automotive standard. The new family of products brings Cirrus Lo...

10 Dec 2025 | Wednesday | NEWS
Dai Nippon Printing unveils 10nm NIL template for 1.4nm generation logic semiconductors

-Dai Nippon Printing Co., Ltd. announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4nm generation and meets the miniaturization needs of cutting-edge logic semiconductors. Background and Aims In line with the shift to more sophisti...

10 Dec 2025 | Wednesday | NEWS
Toshiba adds 40V TCKE6 series eFuse ICs with advanced protection features

-Toshiba Electronic Devices & Storage Corporation (”Toshiba”) has added the 40V "TCKE6 series" products to its range of electronic fuses (eFuse ICs) that support multiple functions required for power line circuit protection. The five new products joining the lineup are “TCKE601RA,” “TCKE601RL,” “TCKE602RM,” “TCKE603RA,” and “T...

10 Dec 2025 | Wednesday | NEWS

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