• Thursday | 19 March 2026
Arasan Unveils Industry’s First MIPI SWI3S Manager and Peripheral IP Cores for Low-Latency Audio Applications

  Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of the industry's first MIPI SWI3S Manager IP and SWI3S Peripheral IP Cores. The SWI3S IP gate count is kept extremely low, targeting applications like the Microphones while also ensuring low latency. Arasan's SWI3S IP joins Arasan's extensive MIPI IP portfolio ...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
Axcelis and GE Aerospace Launch Joint Program to Advance High-Voltage Silicon Carbide Power Devices

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a Joint Development Program (JDP) with GE Aerospace focused on the development of production-worthy 6.5 to 10kV superjunction power devices. Processes will be developed on Axcelis' Purion XEmax™ high energy implanter, which provides the industry's highest beam cur...

28 Sep 2025 | Sunday | NEWS
Pixelworks X7 Gen 2 Powers Visual Excellence in Newly Launched realme P4 5G and P4 Pro 5G Smartphones

Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...

28 Sep 2025 | Sunday | NEWS
Hyundai Mobis Earns Top ISO 26262 Certification for Entire Semiconductor R&D Process

  Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process. It is noted that this rigorous certification was obtained not for specific products, but for the entire process ranging from semiconductor design to quality verification. This certification means that when Hyundai M...

28 Sep 2025 | Sunday | NEWS
Digital Authentication and Embedded Security Market Set for Strong Growth Amid Regulatory Push

After a few sluggish years following COVID-19, the digital authentication and embedded security market is poised for double-digit growth in the coming years, according to global technology intelligence firm ABI Research. This is despite global tariff uncertainty that continues to impact the semiconductor industry. "The relentless, onward march of E.U. regulations is not to be derailed by global...

28 Sep 2025 | Sunday | NEWS
Clarkson University Launches Open-Source Tool to Tackle Chip Overheating in AI and HPC Systems

From smartphones and gaming consoles to artificial intelligence, the powerful chips that drive modern technology generate intense heat. When temperatures rise too high, performance suffers, energy is wasted, and hardware can fail. A research team at Clarkson University is developing a new tool to combat this challenge. Thermal Analysis of Semiconductor Chips, known as TASChips, is an open-sourc...

28 Sep 2025 | Sunday | NEWS
LG Innotek Unveils Next-Generation Digital Key Solution for Smarter, Safer Vehicle Access

LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...

28 Sep 2025 | Sunday | NEWS
Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...

28 Sep 2025 | Sunday | NEWS
Aion Silicon Joins Intel Foundry’s Value Chain Alliance to Deliver Full-Stack Custom SoC Solutions

Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture partner, announced its membership in the Intel Foundry Accelerator Value Chain Alliance (VCA). As a VCA partner, Aion Silicon expands its existing turnkey service offerings to deliver full-stack custom silicon—from architecture through packaged silicon—across multiple market segments and geographies. This new allia...

28 Sep 2025 | Sunday | NEWS
Advanced Packaging Surges Past $50B as E&R Engineering Showcases Next-Gen Solutions at SEMICON Taiwan 2025

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...

28 Sep 2025 | Sunday | NEWS
iDEAL Semiconductor Begins Mass Production of Industry-Leading 200 V SuperQ™ MOSFETs

iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching and conduction. It delivers a step-change in performance and efficiency while preservin...

27 Sep 2025 | Saturday | NEWS
Axcelis Launches GSD Ovation™ ES Ion Implanter for Advanced Engineered Substrate Applications

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, has announced the launch of the Company's GSD Ovation™ ES high current ion implanter, targeted specifically for engineered substrates.  Executive Vice President Dr. Greg Redinbo, commented, "We're excited to introduce the GSD Ovation ES. The GSD Ovation ES enable...

27 Sep 2025 | Saturday | NEWS
EV Group Unveils EVG®40 D2W, First Dedicated Die-to-Wafer Overlay Metrology Platform for 300-mm Production

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With...

27 Sep 2025 | Saturday | NEWS
PCBAIR Advances High-Precision HDI PCB Manufacturing to Meet Growing Demand in Optical, Automotive, and Medical Sectors

PCBAIR, a leading provider of high-precision PCBs, has supported rapid growth in industries such as optical communications, automotive electronics and high-end medical devices by delivering large-scale, precision PCB manufacturing. These demanding sectors require more compact designs, shorter signal paths and enhanced thermal management to meet ever-increasing performance and reliability standar...

27 Sep 2025 | Saturday | NEWS
ROHM Unveils World’s Lowest Power Ultra-Compact CMOS Op Amp for Space-Constrained Sensing Applications

ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...

27 Sep 2025 | Saturday | NEWS
PI Launches Nanopositioning & Micropositioning Essentials Portfolio for Fast, Scalable Precision Motion Solutions

PI (Physik Instrumente), a global leader in precision motion control and nano-positioning technologies, offers its Nanopositioning & Micropositioning Essentials portfolio, delivering core components with reduced lead times and volume discounts tailored for OEMs in research, automation, and advanced manufacturing. This curated Essentials product line features high-precision building blo...

27 Sep 2025 | Saturday | NEWS
Samsung Partners with Valens Semiconductor to Advance MIPI A-PHY Standard for Next-Gen Automotive Connectivity

Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...

27 Sep 2025 | Saturday | NEWS
Baya Systems Announces Technical Advisory Board and Executive Team Expansion with Industry Leaders

  Baya Systems, a leader in high-performance semiconductor system technologies, announced the formation of its Technical Advisory Board and its first members: Ty Garibay, Dr. Phanindra Mannava and Kurt Shuler. The company also strengthened its executive team by adding Ian Smythe as Vice President, Product Marketing, and Kent Orthner as Principal Solutions Archite...

27 Sep 2025 | Saturday | NEWS
Kulicke & Soffa Launches ACELON™ Next-Gen Precision Dispensing Platform for Advanced Electronics Manufacturing

Kulicke and Soffa Industries, Inc. ("Kulicke & Soffa", "K&S", "we" or the "Company") announced the launch of ACELON™, a next-generation precision dispensing solution designed for a broad-range of semiconductor, SMT, and automotive assembly applications. This new advanced dispense platform leverages the Company's market-leading machine architecture in wire bonding, which is already ...

27 Sep 2025 | Saturday | NEWS

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