Shares in major automotive semiconductor suppliers came under pressure on 28 October 2026, after NXP Semiconductors issued a fourth-quarter revenue outlook slightly below market expectations, prompting investors to reassess demand prospects across the automotive chip sector. ON Semiconductor (onsemi) recorded the largest decline among the companies tracked in the report, falling approximately 5% ...
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, unveiled its next-generation NeuPro™ NPU portfolio, featuring expanded capabilities and delivering up to 2X higher AI throughput per mm² and a 50% improvement in energy efficiency versus the first generation. Built on a common architecture and unified software stack, the new portfolio...
FuriosaAI, an AI semiconductor company building sustainable, high-performance inference compute for data centers, announced the completion of its $620 million (KRW 820 billion) Series D round, bringing its post-money valuation to approximately $2.9 billion. The financing marks a major milestone as FuriosaAI scales global commercial deployments of its RNGD AI inference accelerator. FuriosaAI will ...
For three decades, white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip (Figure 1). Seoul Viosys Co., Ltd. (KOSDAQ: 092190) announced that it has broken that dependence. It has developed and begun mass producing a chip that emits white light without rare earths. The chip can be as small as 10 micrometers (µm). Seoul Viosys and i...
AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrates announced that its majority-owned subsidiary, Beijing Tongmei Xtal Technology Co., Ltd. (“Tongmei”), has entered into definitive agreements for a private equity financing to fund further expansion of its manufacturing capacity for indium phosphide semiconductor substrates, expansion of its principal...
As the semiconductor industry begins the 2nm manufacturing ramp and accelerates R&D toward the sub-2nm node, high numerical aperture (NA) extreme ultraviolet (EUV) lithography is emerging as a critical enabler of continued device scaling. By improving resolution and enhancing pattern fidelity, high NA EUV lithography is expected to play a central role in future semiconductor manufacturing. Her...
ChipAgents is expanding its agentic AI platform across digital and analog chip design, bringing traditionally fragmented workflows onto a common AI-native foundation. The platform is powered by IC-star, the chip neural engine that combines persistent design knowledge, advanced reasoning and orchestration, dynamic model routing and physics-aware models. ChipAgents’ full-stack approach bui...
Sony Semiconductor Solutions Corporation (Sony) announced the upcoming release of the LYTIA 720, an approximately 50-effective megapixel*1 image sensor for mobile applications that delivers industry-leading*2 low-light performance and supports 4K 60 fps HDR video recording. Designed for use on the main camera of mobile devices, the new sensor inherits technologies developed for Sony's LYTIA high-...
ChipNexus™, a developer of agentic AI software for semiconductor and hardware design, announced the availability of the NEX™ Analog Agent, which brings analog design capabilities to NEX™, its multi-agent engineering platform. The Analog Agent works directly with Cadence Virtuoso, Spectre simulation and Siemens Calibre physical verification, using the EDA licenses and process desi...
Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, is honored to announce that it was presented with Outstanding Supplier Performance Awards in the Semiconductor category and the Best in Quality – Assembly and Test category at the Micron Supplier Day 2026. The event, held in Boise, Idaho, United States was attended by top-level management of Micron ...
Movandi, the semiconductor and systems innovator powering next-generation wireless communications, announced its new 60GHz connectivity platform, powered by the MV6055 60GHz transceiver, to address the growing bandwidth and latency requirements across multiple markets including physical AI, fixed wireless access (FWA), integrated sensing and communications (ISAC), and network backhaul. The platfor...
SambaNova and Oracle are collaborating to deploy SambaRack SN50 inference chips in Oracle Cloud Infrastructure (OCI) data centers. Oracle will offer the capacity to AI model builders. The plan adds high-performance inference chips to OCI’s growing range of AI infrastructure, giving customers more choice in how they run inference at scale. SambaNova, the AI chip company delivering ...
South Korea's semiconductor industry needs to strengthen its cost competitiveness and move towards higher-value products as China expands its chip manufacturing capacity, according to a new report from Samil PwC, the South Korean member firm of PricewaterhouseCoopers. Published on 26 October 2026, the report examines how China's semiconductor industry has developed beyond individual technology in...
JST, a leading provider of wet benches, wafer cleaning and processing tools for the semiconductor industry, announced Apex, its upgraded Marangoni-type, isopropyl alcohol (IPA)-based wafer dryer. The new Apex dryer enables improved device yields by delivering reduced particle defect size and density and 10% to 15% shorter drying cycle times compared to JST’s existing IPA dryer. &n...
Nagare Labs emerged from stealth with $5M led by Playground Global and a new memory technology designed to overcome the most critical hardware bottleneck in AI innovation. Combining density and speed, Nagare’s memory technology promises to make AI compute systems more fluid, responsive, and economically scalable. A spinout of Georgia Tech, Nagare Labs was co-founded by Dr Suman Datta and Dr...
Supply deals with AOP totaling 1.5 GWh, with all products to be manufactured at the SPE plant in Indiana SBB 1.7 features high-nickel NCA prismatic batteries and proven fire safety, supporting AOP projects in the WECC and ERCOT power markets Samsung SDI expands its North American ESS presence as AOP grows its U.S. storage portfolio Samsung SDI announced that its Michigan-based subsidi...
RAAAM Memory Technologies, a startup company providing an ultra-high-density, low-power on-chip memory technology, announced the appointment of Hong Hao, a former executive at Intel Foundry and Samsung Electronics, as Strategic Advisor. In this role, Mr Hao will work closely with RAAAM's executive team to support the company’s strategic growth and accelerate market engagement with customers ...
HCLTech (NSE: HCLTECH) (BSE: HCLTECH), a leading global technology company, and Rapidus Corporation, a Japanese company developing and manufacturing advanced logic semiconductors, officially inaugurated two HCLTech development centres in India dedicated to supporting Rapidus' evolving semiconductor engineering requirements. The centres, located in Bengaluru and Hubli, will leverage HCLTech's...
AlpSemi aims to transform this landscape by developing advanced power semiconductor devices specifically designed for solid-state circuit breakers (SSCBs). This approach addresses a key challenge: improving the efficiency, compactness and cost competitiveness of semiconductor-based protection. Founded in 2024 by Frédéric Dupont and Fabrice Letertre, both former executives at Soitec,...
Atomera has signed a joint development agreement with IQE plc to develop gallium nitride-on-silicon (GaN-on-Si) wafers for radio-frequency (RF) semiconductor applications, targeting improved device performance and lower manufacturing costs in high-volume markets. The collaboration will bring together Atomera's Mears Silicon Technology (MST) and IQE's compound semiconductor epitaxy capabilities to...