• Friday | 30 October 2026
Lapmaster Wolters Secures Minority Investment from Cynosure and Fernweh

Lapmaster Wolters and Precision Surfacing Solutions (“Lapmaster Wolters”), a leading global supplier of high-precision machine systems and consumables to the semiconductor, advanced materials, precision optics, and advanced packaging industries, announced the completion of a minority equity investment by affiliates of The Cynosure Group (“Cynosure”) and Fernweh Group (&ldqu...

12 Oct 2026 | Monday | NEWS
Kioxia Launches First E1.L SSD Built with BiCS FLASH Generation 8 QLC

Kioxia Corporation announced its first E1.L form factor SSD built with BiCS FLASH™ generation 8 QLC flash memory. Amid the ever-growing demand for data—including data for AI—hyperscale data centers are increasingly adopting high-density designs to achieve greater storage capacity within limited server space. The KIOXIA LD4 Series is designed for high-density 1U servers and r...

12 Oct 2026 | Monday | NEWS
IonQ Achieves 1 kHz Quantum Interconnect Between Trapped Ion and Solid-State Memory

Photonic interconnect generates more than 1,000 quantum connections per second between a trapped ion qubit and a silicon vacancy quantum memory. That entanglement rate is fast enough to support distributed quantum computing and other use cases. IonQ (NYSE: IONQ), the world’s leading full-stack quantum platform and foundry, announced the achievement of entanglement rates above...

12 Oct 2026 | Monday | NEWS
GlobalFoundries Advances €1.1 Billion Dresden Expansion and Unveils FDX Fusion Platform

GlobalFoundries (NASDAQ: GFS) (GF) celebrated the topping-out of its SPRINT expansion project in Dresden and announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips planned for development and manufacturing at the site. The platform is designed for demanding Physical AI applications. Together, the two milestones advance one of Europe's most significant semico...

12 Oct 2026 | Monday | NEWS
Applied Materials, UCLA Partner on AI Chip R&D at EPIC Center

Applied Materials has added the UCLA Samueli School of Engineering as a research collaborator at its Equipment and Process Innovation and Commercialization, or EPIC, Center in Silicon Valley, expanding the company’s academic partnerships around next-generation semiconductor development. Researchers from UCLA will work alongside Applied Materials scientists and engineers to address semicondu...

12 Oct 2026 | Monday | NEWS
GlobalFoundries, TSMC Sign $2 Billion Deal for US AI Chip Packaging Supply

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to establish US production of silicon interposers used in advanced semiconductor packaging. Under the agreement, GlobalFoundries will expand manufacturing capacity at its facility in Malta, New York, where it will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. The companies have agreed an i...

12 Oct 2026 | Monday | NEWS
Wolfspeed Secures Conditional $1.5 Billion US Commitment for Domestic SiC Production

Wolfspeed has received a conditional commitment for up to $1.5 billion in long-term financing from the US Department of War through its Office of Strategic Capital, as the company looks to strengthen domestic production of silicon carbide and other wide-bandgap semiconductor technologies. The proposed financing carries a 30-year term and is intended to support the development and manufacture of s...

9 Oct 2026 | Friday | NEWS
Aehr Secures $6 Million AI Chip Burn-In Order from Hyperscale Customer

Aehr Test Systems has secured around $6 million in additional production orders from its lead hyperscale customer for package-level burn-in of a next-generation artificial intelligence processor designed for data centre training and inference workloads. The orders cover additional Sonoma high-power package-level test and burn-in systems, turnkey burn-in modules, device-specific sockets and upgrad...

9 Oct 2026 | Friday | NEWS
AMD Plans AI Chip Capacity Up to Five Years Ahead as Lisa Su Meets TSMC

AMD Chair and CEO Dr Lisa Su has visited Taiwan to meet TSMC and other supply chain partners as the chipmaker prepares for continued growth in artificial intelligence infrastructure. During the visit, Su said AMD's previously announced plan to invest more than US$10 billion in Taiwan's industrial ecosystem remains on track, with further investment expected. The company is increasing supply during...

9 Oct 2026 | Friday | NEWS
Almatec Adds Pre-Validated UHP Data to FUTUR Semiconductor Pumps

Almatec, part of PSG, a Dover (NYSE: DOV) company, and a leader in PE and PTFE air-operated double-diaphragm (AODD) plastic pumps, announced the availability of pre-validated data supporting ultra-high purity (UHP) reliability across its FUTUR Series AODD Pumps, further strengthening its position as a trusted provider of semiconductor fluid handling solutions. To further support contami...

9 Oct 2026 | Friday | NEWS
Method Communications Expands Semiconductor Expertise with Allison DeLeo Appointment

Method Communications announced that Allison DeLeo has joined the agency as Senior Vice President to expand its expertise in semiconductor and embedded technology ecosystems. DeLeo brings nearly 20 years of experience helping technology companies define their stories, build their reputations, and connect complex innovation to the audiences that matter most. "Some of the most important technology ...

9 Oct 2026 | Friday | NEWS
The 10 Stories That Defined Semiconductors in 2026 So Far, and What the Market Got Wrong

Semiconductor headlines in 2026 have been unusually large. AI accelerator demand kept climbing. Memory prices surged. Washington rewrote parts of its China chip policy. Beijing's domestic AI hardware push gathered pace. India committed another ₹1,27,500 crore to semiconductors through Semicon 2.0, and Japan kept putting public and private capital behind Rapidus. The market numbers make the exci...

9 Oct 2026 | Friday | Analysis
Valens Semiconductor Expands A-PHY into High-Volume Automotive Camera Systems

Semicon Leaders Asia speaks with Daniel Shwartzberg, Director of System Solutions at Valens Semiconductor, about the growing role of MIPI A-PHY in automotive camera systems, Valens’ collaboration with onsemi on an integrated 3MP solution, and how reducing component count and system complexity could support wider adoption in high-volume vehicles. He also discusses the applications driving dem...

8 Oct 2026 | Thursday | Analysis
Trio-Tech Secures $4.45 Million Semiconductor Burn-In Equipment Contract in Europe

Trio-Tech International (NASDAQ: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer. The new a...

8 Oct 2026 | Thursday | NEWS
Chiplytics Raises $4.5 Million and Opens Semiconductor Inspection Lab in New York

Chiplytics, a pioneer in microelectronics verification technology, announced a $4.5 million funding round led by Scout Ventures and Waypoint Ventures and the opening of an inspection laboratory in Bellport, New York. The financing includes an Air Force Tactical Funding Increase (TACFI) award to advance Chiplytics’ inspection technology. From COVID-19 to today’s memory crunch, semicond...

8 Oct 2026 | Thursday | NEWS
Cirrus Logic Acquires INVENTVM to Expand Mixed-Signal Power and Audio Chip Capabilities

Cirrus Logic, Inc. (NASDAQ: CRUS) announced that it has acquired INVENTVM, a fabless semiconductor company based in Pavia, Italy that specializes in mixed-signal power management and audio integrated circuits. INVENTVM brings deep engineering expertise, intellectual property, and an established presence in a region where Cirrus Logic intends to expand further. This acquisition enables Cirrus Logic...

8 Oct 2026 | Thursday | NEWS
Bridge Neurotech and Butterfly Network Partner on Non-Invasive Brain-Computer Interface

Bridge Neurotech ("Bridge"), which emerged from stealth with the goal of building a completely non-invasive brain-computer interface (BCI), and Butterfly Network, Inc. ("Butterfly") (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound, programmable cloud software and AI, announced a research and development agreement through Butterfly Embedded™. Bridge was founded with a mis...

8 Oct 2026 | Thursday | NEWS
MintNeuro Raises $5 Million to Scale Semiconductor Platform for Neural Devices

MintNeuro, a semiconductor company building specialised chips for neural devices from implants to wearables, announces a $5 million investment round to drive its commercial scale-up. MintNeuro's chips give device developers better performance than generic components, with less risk, lower cost and a faster route to market than custom chip design. The funding will accelerate product launch, expand ...

8 Oct 2026 | Thursday | NEWS
Qnity Launches Kalrez 7080 Sealing Solution for High-Temperature Semiconductor Processes

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C. Designed to support increasingly demanding thermal environments, the new solution strengthens Q...

7 Oct 2026 | Wednesday | NEWS
Canon Targets India’s Growing Semiconductor Market with Lithography Equipment and Local Support

Japanese technology group Canon is looking to deepen its presence in India's emerging semiconductor manufacturing industry, holding discussions with companies behind major chip projects and preparing to establish local service infrastructure as new fabs come online. Canon India President and CEO Toshiaki Nomura said the company has been in talks with key semiconductor manufacturers involved in pr...

7 Oct 2026 | Wednesday | NEWS

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