• Sunday | 26 July 2026
Pacer Advisors More Than Doubles Stake in Cirrus Logic

Investment management firm Pacer Advisors substantially increased its position in semiconductor company Cirrus Logic during the latest reporting period, signalling continued institutional confidence in the chip designer's growth prospects. According to a recent regulatory filing, the asset manager more than doubled its stake in Cirrus Logic during the fourth quarter, acquiring an additional 236,5...

22 Jun 2026 | Monday | NEWS
Global Semiconductor Market to Surpass USD 1 Trillion by 2031, Driven by AI, EVs and Advanced Packaging

Mordor Intelligence has published its latest analysis of the semiconductor industry, highlighting sustained expansion driven by artificial intelligence infrastructure, electric vehicle adoption, advanced packaging technologies, and increasing investments in domestic chip manufacturing ecosystems.  According to the industry analysis, the semiconductor industry size stood at USD...

19 Jun 2026 | Friday | NEWS
SandboxAQ Secures $500 Million CHIPS Award to Advance Domestic Semiconductor Materials Innovation

SandboxAQ announced a definitive agreement with the U.S. Department of Commerce's CHIPS Research and Development Office for a $500 million award to address one of the most urgent challenges in American manufacturing: the foreign control of critical materials and chemistries that are essential to semiconductor manufacturing. The award provides funding to develop novel molecules and formulatio...

18 Jun 2026 | Thursday | NEWS
TSMC and Amkor Forge Decade-Long Partnership to Strengthen US Semiconductor Ecosystem

Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem. The agreement establishes a collaboration framework for TSMC to procure f...

17 Jun 2026 | Wednesday | NEWS
SEEQC Joins NORDTECH Initiative to Advance Scalable Quantum Chip Manufacturing in the US

SEEQC, Inc. (“SEEQC” or the “Company”), a developer and manufacturer of scalable, energy-efficient digital chips for quantum computing systems, announced its participation in a four-year Microelectronics Commons Northeast Regional Defense Technology Hub (NORDTECH) program. As one of eight U.S. Microelectronics Commons hubs, NORDTECH collaborates with regional part...

17 Jun 2026 | Wednesday | NEWS
Rapidus Secures Additional ¥150 Billion to Advance 2nm Semiconductor Production

Rapidus Corporation announced that it has completed an additional funding round of 150 billion yen (equivalent to about $943 million USD) from the Information-Technology Promotion Agency (IPA), Japan, an independent administrative agency under the jurisdiction of the Ministry of Economy, Trade and Industry (METI) based on the "Act on Facilitation of Information Processing." Earlier this year...

10 Jun 2026 | Wednesday | NEWS
Olivier Blachier of Entegris on Accelerating Next-Generation EUV Adoption Through Materials Innovation and Industry Collaboration

In this interview with Semicon Leaders Asia, Olivier Blachier, President, Materials Solutions, and SVP, Chief Innovation Officer at Entegris, shares insights into how strategic collaboration across the lithography ecosystem is accelerating the adoption of next-generation EUV technologies. He highlights the importance of Metal Oxide Resists, ultra-high-purity materials handling, a...

10 Jun 2026 | Wednesday | NEWS
Amtech Raises $60 Million to Expand Semiconductor Packaging and Wafer Substrate Business

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication, announced the closing of its oversubscribed underwritten public offering of 2,926,829 shares of common stock, at a public offering price of $20.50 per share, for total gross proceeds of $60 million before deducting underw...

5 Jun 2026 | Friday | NEWS
SEMIFIVE Showcases 3D-IC and Big Die AI Chip Innovations at SAFE Forum 2026

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE, will deliver a presentation titled "Leading 3D-IC/Big Die Solution for AI Innovation." He will share SEMIFIVE's advanced design expertise in AI and Hi...

4 Jun 2026 | Thursday | NEWS
Emtar Technologies Named Semiconductor Startup of the Year at CHIPS NORTH Summit

Emtar Technologies Inc., a Canadian semiconductor company developing next-generation wireless SoCs and RF front-end solutions for satellite communications and non-terrestrial networks, announced it has received the “Semiconductor Achievement Award: Startup of the Year” at the CHIPS NORTH Executive Summit, hosted by Canada’s Semiconductor Council. The award recognises emergi...

2 Jun 2026 | Tuesday | NEWS
Polar Semiconductor, LLC and Nexperia B.V. Partner to Expand US Power MOSFET Manufacturing Capacity

Polar Semiconductor, LLC and Nexperia B.V. announced a strategic collaboration to manufacture next‑generation power MOSFET devices at Polar Semiconductor’s U.S.-- based wafer foundry. The partnership supports an expanded power MOSFET portfolio while strengthening supply for customers worldwide. By combining Polar’s deep expertise in power semiconductor manufacturing and ongoing capa...

29 May 2026 | Friday | NEWS
SEMI Foundation Launches First Regional Workforce Hubs to Strengthen US Semiconductor Talent Pipeline

The SEMI Foundation, serving as the Hub Operator for the National Network for Microelectronics Education (NNME), announced the launch of the first four Regional Nodes of the NNME, marking a major national milestone in the effort to build America's microelectronics and semiconductor workforce at unprecedented scale. Funded by the U.S. National Science Foundation Directorate for Tech...

28 May 2026 | Thursday | NEWS
SiTime Expands Convertible Notes Offering to US$1.2 Billion Amid AI Infrastructure Growth

SiTime has expanded its convertible senior notes offering to US$1.2 billion as the semiconductor timing technology company strengthens its financial position amid continued growth in demand for advanced chip infrastructure. The enlarged fundraising reflects strong investor interest and is expected to provide additional flexibility to support the company’s long-term expansion strategy, inclu...

26 May 2026 | Tuesday | NEWS
Cyient Semiconductors Secures USD 30 Million Financing to Expand Power Semiconductor and Custom Silicon Platform

Cyient Semiconductors announced a strategic financing transaction with funds managed by EAAA India Alternatives Ltd ("Edelweiss") and affiliated co-investors. The transaction includes an equity investment of approximately USD 10 Mn (INR 100 Crores) at a post-money equity valuation of USD ~500 Mn (INR 4600 Crores), alongside structured debt capital, enabling the company to strengthen its capital s...

26 May 2026 | Tuesday | NEWS
Adam J Morgan of NoMIS Power on Advancing High-Voltage SiC Technologies for Next-Generation HVDC Infrastructure

In this interview with Semicon Leaders Asia, Adam J Morgan, Co-founder, CEO, & Technical Lead for Packaging Design at NoMIS Power, highlights how the company is positioning its high-voltage SiC portfolio at the centre of next-generation HVDC and grid modernisation initiatives. Through participation in the ARPA-E DC-GRIDS programme and collaboration with leading industry and researc...

25 May 2026 | Monday | Interaction
Quantinuum Signs CHIPS R&D LOI to Advance U.S. Fault-Tolerant Quantum Computing Infrastructure

Quantinuum, a leading quantum computing company, announced a letter of intent with the U.S. Department of Commerce's CHIPS Research and Development Office. The letter of intent proposes that Quantinuum would receive federal funding to enable the development of large-scale, fault-tolerant trapped-ion quantum computers that are of national strategic importance. "With today's CHIPS Research and Deve...

25 May 2026 | Monday | NEWS
IBM and U.S. Department of Commerce Plan $2 Billion Quantum Foundry Initiative to Strengthen American Semiconductor Leadership

IBM (NYSE: IBM) and the U.S. Department of Commerce (DoC) announced a Letter of Intent (LOI) to build an American quantum chip foundry, securing the nation's global quantum leadership and fueling the country's growing quantum ecosystem. The CHIPS incentive from the DoC will support the research and development efforts of a new IBM company: Anderon, which will be America's first pure-play quan...

22 May 2026 | Friday | NEWS
PsiQuantum Secures Proposed $100 Million CHIPS Act Incentives to Accelerate U.S. Quantum and Semiconductor Manufacturing

PsiQuantum announced that the company has signed a Letter of Intent with the U.S. Department of Commerce for $100 million in proposed federal incentives under the CHIPS and Science Act to advance American quantum computing and semiconductor leadership. With these potential incentives, combined with co-investment by the company, PsiQuantum will accelerate the domestic manufacturability and per...

22 May 2026 | Friday | NEWS
Amkor Technology Expands Arizona Semiconductor Packaging Footprint to Support U.S. Advanced Manufacturing Growth

Amkor Technology, Inc. (Nasdaq: AMKR) reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment in its Arizona manufacturing footprint. Located within Peoria’s Innovation Core, Amkor’s campus is being developed on a 104-acre site designed to support large-scale, leading-edge semiconductor packaging a...

21 May 2026 | Thursday | NEWS
Metallium Limited Secures U.S. Defense Contract to Advance Gallium and Germanium Recovery from Semiconductor E-Waste

Metallium Limited (ASX: MTM, OTCQX: MTMCF; OTCQX ADR: MTLMY) announced its  U.S.-based affiliate, Flash Metals Texas, Inc., has been awarded a million-dollar Phase II Small Business Innovation Research (SBIR) contract with the U.S. Department of War through the Defence Logistics Agency to continue to pursue the recovery of gallium and germanium from electronic waste streams. The Ph...

21 May 2026 | Thursday | NEWS

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