DAS Environmental Experts Group, a leading global provider of environmental technologies for waste gas and water treatment, has officially opened its new Innovation & Support Center (ISC) in Glendale, Arizona. Initiated and built by DAS US, the Group's American branch, the center represents a significant milestone in the company's North American growth strategy. It strengthens the organizati...
Ansys SimAI helps engineers swiftly predict physics-based behavior — including mechanical, thermal, and chemical — across product design and manufacturing / Key Highlights Part of the Synopsys portfolio of simulation & analysis solutions, the Ansys SimAI™ platform enables Sumitomo Riko to accelerate simulation speed over 10x when compared to traditional simul...
Index Ventures backs Quilter to automate circuit board design, a trillion-dollar bottleneck found in everything from phones to fighter jets. Quilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures. The investment comes as Fortune 500 aerospace, defense, and consum...
MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, today announced that Pegatron 5G has selected Sierra, the company’s single-chip Radio SoC, for their next generation PR2850 5G Macro Open RAN Radio Unit (O-RU). Pegatron is a global technology leader focusing on O-RAN-compliant solutions. The PR2850 is Pegatron 5G’s latest carrier-grade 5G Macro ...
RealSense, a pioneer in AI-powered computer vision, has announced two major milestones: its spinout from Intel Corporation, fueled with a $50 million Series A funding round, and a strategic collaboration with NVIDIA to accelerate the adoption of physical AI across humanoids and autonomous mobile robots (AMRs). “This collaboration cements RealSense’s role as the perception platform o...
SEMICON West -- Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported in its latest 300mm Fab Outlook. This robust investment reflects fab regionalization and surging AI chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized ind...
New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...
HAP International announced that following a successful technical assessment of the quality and scope of shipment-level traceability data provided by the TRACE ID program, they are taking steps toward a formal Memorandum of Agreement with U.S. Customs and Border Protection (CBP). The initiative builds on CBP’s ongoing Global Business Identifier (GBI) test and reflects the agency&rsqu...
Omni Design Technologies, a leading provider of high-performance, low-power Wideband Signal Processing™ solutions, announced the tape out of its new ODT-ADS-7B64G-3T, an ultra-high-speed 64 GSPS SWIFT™ analog-to-digital converter (ADC) supporting 7- and 8-bit output modes, designed in TSMC’s 3nm process. This time-interleaved ADC provides the breakthrough speed and perfor...
OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced today its latest-generation automotive image sensor: the OX08D20 8-megapixel (MP) CMOS image sensor with TheiaCel™ technology. This new device is an upgrade to the popular OX08D10 sensor for exterior cameras used in advanced driver assistance syste...
Advanced Energy Industries, Inc. (Nasdaq: AEIS), a global leader in highly engineered, precision power conversion, measurement and control solutions, announces the launch of the 401M mid-infrared optical pyrometer, designed for high-precision, non-contact temperature measurement in semiconductor and industrial process environments. The 401M debuts at SEMICON® West 2025. Engineered for speed...
Altera Corporation, a global leader in FPGA-based solutions, and BigCat Wireless, specializing in advanced wireless communications solutions, today announced an expanded partnership to scale Altera’s FPGA-based radio access network technology to wireless customers. Under this agreement, BigCat Wireless becomes an official solutions integrator for Altera’s Open Radio Unit (O-RU)...
Geographic Regions Americas and EMEA Reported Double-Digit Increases Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. ...
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona. The expanded investment includes additional cleanroom space and a second green...
Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC test chip tape out. The results vaulted Alchip into a clear 3DIC technology leadership because it validated an entire, integrated 3DIC solution, as well as its various elements. The test chip provided CPU/NPU core demonstration, UCIe and PCIe ...
PINC Technologies, a Caltech spinout company developing advanced integrated nonlinear photonic devices and circuits, announced the close of its Seed+ round, bringing total funds raised to date to $6.8M. The funding will accelerate commercialization of the company’s technology, which builds on groundbreaking research from the Caltech Nonlinear Photonics Laboratory. The latest round was led ...
3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design. JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from org...
GS Microelectronics US, Inc. (GSME), a leading-edge global supplier of integrated circuit design and manufacturing solutions, announced that it has acquired Muse Semiconductor. Muse Semiconductor is a recognized provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology. This strategic acquisition will expand GSME's reach into key innovation hubs across No...
Phaidra, the company building AI agents for AI factories, announced a Series B funding round of more than $50 million led by Collaborative Fund, with participation from Helena, Index Ventures, NVIDIA, Sony Innovation Fund, and others. The funding will be used to make AI factories — the data center infrastructure purpose-built for AI workloads — radically more resource-efficient via A...
Global X Management Company LLC ("Global X"), the New York-based provider of exchange traded funds (ETFs), announced the launch of the Global X AI Semiconductor & Quantum ETF (CHPX), designed to capture innovation in the semiconductor industry. The fund is passively managed and priced at 50 bps. The semiconductor industry is evolving to cater to demands of next-gen computing, including AI a...