• Monday | 09 November 2026
Entegris Acquires Advanced Abrasives and Partners with Element Six to Develop Diamond-Based Cooling Materials for AI Chips

Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging. “Growth in AI compute, f...

4 Nov 2026 | Wednesday | NEWS
Nordic Semiconductor Unveils nRF71 Series with Wi-Fi 6, Bluetooth and Edge AI on a Single Chip

Nordic Semiconductor, a global leader in low-power wireless solutions, announces the nRF71 Series of ultra-low-power Systems-On-Chip (SoCs), bringing together ultra-low-power Wi-Fi®, Bluetooth® Low Energy (LE), Thread®, and edge AI onto a single chip. Built on the ultra-low-power design, software, and tools that have made Nordic a trusted leader in Bluetooth LE, the nRF71 Series deliv...

4 Nov 2026 | Wednesday | NEWS
Wolfspeed Launches Transparent Silicon Carbide for AR and Quantum Computing

US semiconductor manufacturer Wolfspeed has announced the commercial availability of its proprietary transparent silicon carbide (TSiC) technology, extending its materials portfolio into augmented reality (AR), quantum computing and advanced optical systems. Announced on 29 October 2026, the technology uses optical-grade silicon carbide substrates designed to minimise light absorption while maint...

3 Nov 2026 | Tuesday | NEWS
Cardiff, Swansea Partner to Develop UK Compound Semiconductor Pilot Foundry

Cardiff University and Swansea University have signed a Memorandum of Understanding (MoU) to examine the development of a coordinated national compound semiconductor pilot foundry network, strengthening the UK's capabilities in semiconductor research and manufacturing. Announced on 2 November 2026, the partnership will explore what the universities describe as the UK's first multi-institution mod...

3 Nov 2026 | Tuesday | NEWS
Applied Brain Research Launches On-Device Speech AI SDK for Alif Semiconductor’s Ensemble Processors

Applied Brain Research (ABR) announced the general availability of its speech AI software development kit (SDK) on Zephyr RTOS for the Alif Semiconductor Ensemble® family of edge AI processors. The SDK brings the most capable streaming speech recognition available, together with natural-sounding text-to-speech, running entirely on-device with no cloud connection required. The SDK combines: ...

3 Nov 2026 | Tuesday | NEWS
Alchip’s AI Chip Growth and 3D Integration Plans Keep Analysts Focused

Taiwan-based Alchip Technologies continues to attract attention from market analysts as demand for custom artificial intelligence processors increases investment in advanced semiconductor design and three-dimensional chip integration. A valuation assessment published on 30 October 2026 by Simply Wall St maintained its estimated fair value for Alchip, despite adjustments to assumptions covering re...

3 Nov 2026 | Tuesday | NEWS
Marvell to Acquire Lumentum in US$115 Billion All-Stock Deal to Expand AI Optical Connectivity

Combines two of the fastest-growing enablers of AI, bringing together complementary electrical and optical technologies to address increasingly complex connectivity requirements across next-generation AI infrastructure Expected to create a broad full-stack connectivity portfolio that is intended to enable end-to-end extreme co-design, high-volume production of fully-optimized, pre-validated opt...

3 Nov 2026 | Tuesday | NEWS
TANAKA, MEP Establish RM70 Million Precious Metal Refinery in Malaysia

Japan-based TANAKA Precious Metal Technologies has announced plans to establish a precious metal refining joint venture with Malaysian resource recovery company MEP Enviro Technology Sdn. Bhd., expanding local recycling and materials processing capabilities for the semiconductor and electronics industries. The new company, TANAKA MEP REFINERY SDN. BHD., will operate from Batu Kawan Industrial Par...

2 Nov 2026 | Monday | NEWS
Taiwan Chip Industry Backs Nuclear Power Restart Review Amid Rising Electricity Demand

Taiwan's semiconductor industry has renewed its support for examining the restart of nuclear power plants, as growing demand for advanced chips raises concerns about the island's long-term electricity supply. The Taiwan Semiconductor Industry Association (TSIA) confirmed its position at its annual meeting in Hsinchu on 29 October 2026, where its board agreed to back the government's review of nuc...

2 Nov 2026 | Monday | NEWS
KLC Corporation Introduces Thermal Testing Solutions for AI Chips, Advanced Packaging and Electric Vehicles

Taiwan King Lung Chin PTC Co., Ltd. (KLC Corporation), a Taiwan-based thermal management solutions manufacturer, highlighted its Thermal Test Vehicle (TTV) solutions for chip-wafer layout design, planning & verification, AI, and high-performance computing (HPC), alongside high-voltage coolant heaters for electric vehicles (EVs). As AI infrastructure and high-performance computing systems driv...

2 Nov 2026 | Monday | NEWS
Nordic Semiconductor Demonstrates Bluetooth High Data Throughput Technology for Faster Low-Power Wireless Connectivity

Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, proves the upcoming Bluetooth® High Data Throughput (HDT) feature in silicon through its video demonstration. Nordic, who has an established reputation as a leader in Bluetooth technology, is one of the first vendors to showcase support for Bluetooth HDT. With support for longer packe...

2 Nov 2026 | Monday | NEWS
Ceva Unveils Next-Generation NeuPro NPU Portfolio with 2X AI Throughput and 50% Better Energy Efficiency

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, unveiled its next-generation NeuPro™ NPU portfolio, featuring expanded capabilities and delivering up to 2X higher AI throughput per mm² and a 50% improvement in energy efficiency versus the first generation. Built on a common architecture and unified software stack, the new portfolio...

2 Nov 2026 | Monday | NEWS
Current Sensing As a Critical Safety Technology for AI Data Centers

As data center power levels scale from hundreds of kilowatts to multi-megawatt AI clusters, protecting the systems against electrical faults while maintaining uninterrupted operation has become a strategic priority for data center operators. This raises the requirements against electrical fault protection and for predictive maintenance. Against this background, current sensing is evolving from a m...

2 Nov 2026 | Monday | Feature
ON Semiconductor Falls 5%, NXP Drops 4% on Automotive Chip Demand Concerns

Shares in major automotive semiconductor suppliers came under pressure on 28 October 2026, after NXP Semiconductors issued a fourth-quarter revenue outlook slightly below market expectations, prompting investors to reassess demand prospects across the automotive chip sector. ON Semiconductor (onsemi) recorded the largest decline among the companies tracked in the report, falling approximately 5% ...

30 Oct 2026 | Friday | NEWS
Ceva Unveils Next-Generation NeuPro NPU Portfolio with 2X AI Throughput and 50% Higher Energy Efficiency

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, unveiled its next-generation NeuPro™ NPU portfolio, featuring expanded capabilities and delivering up to 2X higher AI throughput per mm² and a 50% improvement in energy efficiency versus the first generation. Built on a common architecture and unified software stack, the new portfolio...

30 Oct 2026 | Friday | NEWS
FuriosaAI Raises US$620 Million in Series D Funding to Expand AI Inference Chip Production

FuriosaAI, an AI semiconductor company building sustainable, high-performance inference compute for data centers, announced the completion of its $620 million (KRW 820 billion) Series D round, bringing its post-money valuation to approximately $2.9 billion. The financing marks a major milestone as FuriosaAI scales global commercial deployments of its RNGD AI inference accelerator. FuriosaAI will ...

30 Oct 2026 | Friday | NEWS
Seoul Viosys Begins Mass Production of Rare-Earth-Free White Micro LEDs Using WICOP 3 Technology

For three decades, white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip (Figure 1). Seoul Viosys Co., Ltd. (KOSDAQ: 092190) announced that it has broken that dependence. It has developed and begun mass producing a chip that emits white light without rare earths. The chip can be as small as 10 micrometers (µm). Seoul Viosys and i...

30 Oct 2026 | Friday | NEWS
AXT’s Tongmei Secures Up to US$545 Million in Private Equity Financing to Expand Indium Phosphide Wafer Production

AXT, Inc. (NasdaqGS: AXTI), a leading manufacturer of compound semiconductor substrates announced that its majority-owned subsidiary, Beijing Tongmei Xtal Technology Co., Ltd. (“Tongmei”), has entered into definitive agreements for a private equity financing to fund further expansion of its manufacturing capacity for indium phosphide semiconductor substrates, expansion of its principal...

30 Oct 2026 | Friday | NEWS
High NA EUV Lithography Benefits, Challenges, and the Path to Continued Scaling

As the semiconductor industry begins the 2nm manufacturing ramp and accelerates R&D toward the sub-2nm node, high numerical aperture (NA) extreme ultraviolet (EUV) lithography is emerging as a critical enabler of continued device scaling. By improving resolution and enhancing pattern fidelity, high NA EUV lithography is expected to play a central role in future semiconductor manufacturing. Her...

30 Oct 2026 | Friday | Feature
ChipAgents Expands AI-Powered Platform Across Digital and Analog Chip Design with NVIDIA Collaboration

ChipAgents is expanding its agentic AI platform across digital and analog chip design, bringing traditionally fragmented workflows onto a common AI-native foundation. The platform is powered by IC-star, the chip neural engine that combines persistent design knowledge, advanced reasoning and orchestration, dynamic model routing and physics-aware models. ChipAgents’ full-stack approach bui...

29 Oct 2026 | Thursday | NEWS

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