• Sunday | 10 May 2026
MIPI Alliance Launches Group to Explore AI-Driven Humanoid Robotics

The MIPI Alliance, an international organisation that develops specifications that standardise wired interfaces for mobile and other connected ecosystems, announced the formation of a Physical AI Birds of a Feather (BoF) group dedicated to exploring upcoming technologies and trends in the physical AI market, with an initial focus on humanoids. The group will examine how MIPI specifi...

30 Apr 2026 | Thursday | NEWS
Liquid Instruments Raises $50M to Scale AI-Driven Test Solutions

Liquid Instruments, a pioneer in software-defined test solutions, announced the close of its $50 million Series C funding round, co-led by Keysight Technologies, Inc. (NYSE: KEYS), a global leader in design, emulation, and test solutions, and the Australian Government’s National Reconstruction Fund Corporation (NRFC). In addition to investing, Keysight will enter into a commer...

30 Apr 2026 | Thursday | NEWS
Cadence and NVIDIA Deepen AI Engineering Partnership

Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and AI factories At CadenceLIVE Silicon Valley 2026, Cadence (Nasdaq: CDNS) announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based ...

29 Apr 2026 | Wednesday | NEWS
OpenLight Secures Fresh Capital as Demand Rises for Silicon Photonics Solutions

OpenLight, the world leader in custom Photonic Application-Specific Integrated Circuit (PASIC) design leveraging its patented heterogeneous silicon photonics process, announced it has raised an additional $50 million in a Series A-1 round, bringing the company’s total funding to $84 million. The financing reflects growing commercial momentum and accelerating customer adoption across AI infra...

29 Apr 2026 | Wednesday | NEWS
ROHM Co., Ltd. Launches NFC Wireless Power Chipset for Smart Rings and Compact Wearables

ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. The smart ring market has seen rapid growth in recent years. However, for extremely small ring-shaped devices worn on the finger, wired charging is impr...

29 Apr 2026 | Wednesday | NEWS
Artemis Acquires Optikos Corporation to Accelerate Growth in Advanced Optical Engineering

Optikos® Corporation, a provider of engineering, manufacturing, and metrology expertise in optical systems, is joining forces with Artemis, a Boston-based private equity firm focused on scaling high-impact industrial tech. Through this acquisition, Artemis will provide the strategic support necessary to supercharge the engineering and manufacturing capabilities of Optikos. Through th...

29 Apr 2026 | Wednesday | NEWS
FPT Corporation and Intel Corporation Partner to Accelerate AI-Driven Factory Optimisation

FPT and Intel, a global leader in semiconductor and AI technologies, announced a strategic relationship to deliver an end-to-end AI-driven factory optimisation solution. Powered by AI, simulation, and digital manufacturing technologies, the collaboration aims to reduce bottlenecks, accelerate decision-making and improve downtime recovery, facilitating the sector’s transition towards AI-drive...

29 Apr 2026 | Wednesday | NEWS
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
OKI Circuit Technology Develops 180-Layer PCB Technology for Next-Generation AI and HBM Testing

OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (Note 1) mounted on AI semiconductors. This represents an approximat...

29 Apr 2026 | Wednesday | NEWS
Kingston Digital, Inc. Expands DC3000ME Gen5 SSD Line with New 30.72TB Enterprise Model

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced the launch of the Kingston DC3000ME Gen5 U.2 NVMe SSD with a new high-capacity 30.72TB1 option, expanding the DC3000ME family to address the growing storage density and performance demands of modern data centres. The DC3...

28 Apr 2026 | Tuesday | NEWS
Seoul Viosys Accelerates Expansion into Next-Generation Photonics and Optical Interconnects

Seoul Viosys (KOSDAQ: 092190), a company specialising in opto-semiconductor devices, is accelerating its entry into the next-generation photonics market supported by its proprietary “No-wire” and “No-package” fundamental patents—essential technologies for micrometre (μm)-scale miniaturisation of opto-semiconductors—as well as its competitiveness in VCSEL...

28 Apr 2026 | Tuesday | NEWS
Palliser Capital Urges SMC Corporation to Unlock Shareholder Value Through ¥600 Billion Buyback

Palliser Capital (“Palliser”), a top 25 shareholder of SMC Corporation (“SMC” or the “Company”),  published a comprehensive plan (“Value Enhancement Plan”) outlining the opportunities available to unlock substantial long-term value at the Company. To promote market transparency and respond to growing interest from shareholders and other stakeho...

28 Apr 2026 | Tuesday | NEWS
Trio-Tech International Announces $10 Million Registered Direct Offering

Trio-Tech International (“Trio-Tech” or the “Company”) (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced that it has entered into securities purchase agreements with fundamental institutional investors for the purchase and sale of 1,052,632 shares of its common stock in a regist...

28 Apr 2026 | Tuesday | NEWS
Omdia Raises 2026 Semiconductor Revenue Forecast on Surging Memory Demand

Omdia has significantly raised its semiconductor revenue forecast for 2026 to 62.7%, again reflecting unprecedented growth in DRAM and NAND driven by sustained demand and ongoing supply shortages expected to persist through the year. The DRAM market is forecast to nearly double in value, while the smaller NAND segment could quadruple compared to 2025. Supply constraints in conventional memory IC ...

28 Apr 2026 | Tuesday | NEWS
Marvell Technology, Inc. Acquires Polariton to Advance Next-Generation Optical Connectivity

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced the acquisition of Polariton Technologies, a developer of high-speed, low-power plasmonics-based silicon photonics devices. The acquisition strengthens Marvell’s optical technology portfolio by adding advanced modulation capabilities that enable continued scaling in bandwidth, power ef...

28 Apr 2026 | Tuesday | NEWS
Taiwan Semiconductor Manufacturing Company Unveils A13 Process to Advance AI, HPC and Next-Generation Semiconductor Innovation

TSMC (TWSE: 2330, NYSE: TSM) debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium. TSMC’s new A13 process is a direct shrink of its industry-leading A14 node announced in 2025, enabling even more compact and efficient designs to address insatiable customer demand in computational requirements for next-generation ...

27 Apr 2026 | Monday | NEWS
JEDEC Solid State Technology Association Previews Next-Generation LPDDR6 Enhancements for AI and Data Centre Workloads

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, previewed a set of new features planned for incorporation into the next version of its JESD209‑6 LPDDR6 standard. Building on the foundational JESD209‑6 published in July 2025, JEDEC’s JC‑42.6 Subcommittee has been working to enhance the next version of th...

27 Apr 2026 | Monday | NEWS
Wolfspeed, Inc. Appoints Yasuhisa Harita as Asia Pacific Regional President

Wolfspeed, Inc. announced the appointment of Yasuhisa Harita as regional president for Asia Pacific. Harita will be based in Tokyo and lead Wolfspeed’s commercial strategy across Japan, Korea and the ASEAN region with responsibility for driving revenue growth, enhancing strategic customer relationships, and executing the company’s regional commercial and operational objectives. Harita...

27 Apr 2026 | Monday | NEWS
GigaDevice Launches GD32F5HC Microcontroller Series for HMI and IoT Edge Applications

GigaDevice, a leading global supplier of semiconductor devices, announced the official launch of the GD32F5HC series 32‑bit general‑purpose microcontrollers. Designed with compact size, high frequency operation, large memory, and strong security, while also offering ultra‑low power consumption and rich peripheral configuration, the new series expands the GD32 Arm® Cortex®â€...

27 Apr 2026 | Monday | NEWS
SK hynix Inc. Wins IEEE Corporate Innovation Award for Leadership in AI Memory

SK hynix Inc. (or "the company", www.skhynix.com) announced that it received the Corporate Innovation Award at the '2026 IEEE1 Honours Ceremony' held in New York on the 24th (local time). IEEE is the world's largest technical professional organisation dedicated to advancing technology for the benefit of humanity. Established more than a century ago, the IEEE Awards Program recognises in...

27 Apr 2026 | Monday | NEWS

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