• Sunday | 10 May 2026
Arasan Launches UFS 5.0 Host Controller IP for High-Performance Mobile and Edge AI Applications

Arasan extends its long history of support for JEDEC and MIPI standards with the immediate availability of UFS 5.0 Host controller IP. Arasan's UFS 5.0 Host Controller IP supports a maximum throughput of 46.694 Gbps with M-PHY HS-Gear 6 operation, providing very high data transfer rates with low power consumption for advanced mobile applications such as high-end smartphones and edge AI devices. A...

27 Apr 2026 | Monday | NEWS
NEO Semiconductor Validates 3D X-DRAM as Scalable Path for AI Memory

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced successful proof-of-concept (POC) results for its 3D X-DRAM™ technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems. The company also announced a new strategic investment led by Stan Shih, Founder and former Chairman and CEO of Ac...

24 Apr 2026 | Friday | NEWS
MetaOptics Ltd Secures Design Wins and Advances Commercialisation of Metalens Technology

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") is pleased to announce that it has achieved a progressive milestone in securing design/evaluation orders of its metalenses and modules from world-class customers. As announced in the Company's annual report for the financial year ended 31 December 2025, the Company noted that custo...

24 Apr 2026 | Friday | NEWS
Synopsys Expands Collaboration with TSMC to Advance AI Chip Design

Synopsys, Inc. (Nasdaq: SNPS) announced major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14. By unifying intelligent digital, analogue, and verification flows, advanced 3D multi-die design, a...

24 Apr 2026 | Friday | NEWS
MetOx International Appoints Semiconductor Veteran Richard (Rick) Gottscho to Board

MetOx International — MetOx, a leading U.S. manufacturer of high-temperature superconducting (HTS) wire, announced the appointment of Dr. Richard (Rick) Gottscho to its Board of Directors. A globally recognised leader in semiconductor manufacturing and plasma science, Rick brings decades of experience scaling the technologies that underpin the modern digital economy. His addition comes...

24 Apr 2026 | Friday | NEWS
Arasan Chip Systems Achieves ASIL-D Certification for CAN XL IP

Arasan Chip Systems, the industry's leading provider of IP for Mobile and Automobile SoCs, announced that its CAN XL IP has achieved the ASIL-D Certification. The CAN  XL IP has been independently certified by SGS-TÜV Saar as ASIL-D, the highest safety level of functional safety defined in ISO 26262, the international standard for functional safety in road vehicles.   The CAN ...

24 Apr 2026 | Friday | NEWS
Neurophos Rapidly Expands Team with Senior Hires from NVIDIA, Intel, and Qualcomm

 Neurophos, a leader in photonic AI chip technology, announced it has nearly tripled in headcount since closing its $110M Series A round in January 2026. In less than six months, the company has grown by nearly 3x — a trajectory that reflects both the importance and the opportunity for next-generation AI compute infrastructure. The latest wave of hires brings deep industry experience t...

23 Apr 2026 | Thursday | NEWS
yieldWerx Enters Taiwan Semiconductor Market via Strategic Collaboration

yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world's most concentrated semiconductor markets. The collaboration combines Enlight Technology's established role across Taiwan's semiconductor design, manufacturing, and research landscape with yieldWerx's experti...

23 Apr 2026 | Thursday | NEWS
Expedera Wins “Best Edge AI Processor IP” at 2026 Edge AI Awards

Expedera, a leading provider of AI accelerator IP for edge and data–centre systems,  announced that its Origin Evolution™ NPU IP has been named "Best Edge AI Processor IP" in the 2026 Edge AI and Vision Product of the Year Awards, presented by the Edge AI and Vision Alliance. The award recognises innovative building–block IP powering edge AI and visi...

23 Apr 2026 | Thursday | NEWS
CVD Equipment Corporation Advances Silicon Carbide Manufacturing with Successful Boule Growth

CVD Equipment Corporation (NASDAQ: CVV) announced the successful growth of single-crystal silicon carbide (SiC) boules grown on CVD Equipment (CVDE) Physical Vapour Transport (PVT) Systems and characterised by Stony Brook University (SBU) in support of their new semiconductor research centre, “onsemi Research Centre for Wide Bandgap Materials”. The SiC boule was analyzed at SBU a...

23 Apr 2026 | Thursday | NEWS
Kioxia Corporation Launches EG7 Series SSDs with Next-Gen QLC Technology

Kioxia Corporation announced KIOXIA EG7 Series solid state drives (SSDs), the first client solution to adopt Kioxia’s BiCS FLASH™ generation 8 4-bit-per-cell, quadruple-level cell (QLC) technology. The QLC-based KIOXIA EG7 Series delivers equivalent performance as TLC-based solutions(1), enabling better total cost of ownership (TCO) for value-oriented slim laptops, as well as comm...

23 Apr 2026 | Thursday | NEWS
Syenta Secures $26M to Tackle AI Chip Packaging Bottlenecks

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National Reconstruction Fund (NRF), with participation from existing investors Investible, Salus Ventures, Jelix Ventures and Wollemi Capital. This brings the company’s total funding to date to more tha...

23 Apr 2026 | Thursday | NEWS
Butterfly Network Appoints Dr. Arun Nagdev as Chief Medical Officer

Butterfly Network (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound devices, programmable cloud software and AI, announced the appointment of Arun Nagdev, MD, as Chief Medical Officer – Point-of-Care Ultrasound (POCUS). In this role, Dr Nagdev will lead the global medical strategy for the Company’s core POCUS business, advancing clinical product validation, stre...

22 Apr 2026 | Wednesday | NEWS
AXT Announces $550 Million Public Offering of Common Stock

AXT, Inc. (NasdaqGS: AXTI) (“AXT” or the “Company”), a leading manufacturer of compound semiconductor wafer substrates, announced today the pricing of an underwritten public offering of 8,560,311 shares of common stock at a price to the public of $64.25 per share. The gross proceeds to the Company from the offering are expected to be approximately $550 million, before deduc...

22 Apr 2026 | Wednesday | NEWS
Magnachip Launches New MOSFETs for Smartphone Battery Protection

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of two new 8th-generation Ultra Low-Ron 12V low-voltage (LV) MOSFETs designed for high-performance smartphone battery protection circuits (PCMs). These new products target next-generation smartphones, where ultra-fast charging and energy efficiency are increasingly critical, and represent an expansion of M...

22 Apr 2026 | Wednesday | NEWS
Teledyne e2v Launches Caiman Module to Strengthen Position in Low-Light Imaging Market

Teledyne e2v, a global innovator of imaging solutions, announced the launch of the Caiman™ imaging module, a small, lightweight, low-power solution designed for demanding low-light applications. Built around the OnyxMax™ sensor, Caiman delivers high quantum efficiency, high spatial resolution in the near-infrared spectral band, and low noise performance, prov...

22 Apr 2026 | Wednesday | NEWS
RoboSense Unveils SPAD-SoC Breakthrough to Lead Next Phase of LiDAR Commercialisation

RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary...

22 Apr 2026 | Wednesday | NEWS
DEEPX and Hyundai Motor Group Forge Strategic Partnership to Commercialise Next-Gen Robotics AI

DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic sy...

22 Apr 2026 | Wednesday | NEWS
Roundhill Memory ETF (DRAM) Crosses $1 Billion Milestone Shortly After Launch

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced that the Roundhill Memory ETF (Cboe BZX: DRAM) has surpassed $1 billion in assets under management (AUM) only 10 trading days after its April 2, 2026, launch.² DRAM is the first U.S.-listed ETF to offer targeted exposure to global memory semiconductor companies and has emerged as the most successful ETF...

21 Apr 2026 | Tuesday | NEWS
InPHRED Expands into Data Centre Optical Interconnect Market

InPHRED, a developer of next-generation photonics solutions for consumer sensing and digital health, announced its formal expansion into the data centre optical interconnect market, extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure. As demand for AI infrastructure surges and hyperscalers push for higher bandwidth density, lower power co...

21 Apr 2026 | Tuesday | NEWS

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