• Monday | 19 October 2026
QuickLogic Secures eFPGA IP Design Win for Automotive and Industrial SoC

QuickLogic® Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, and ruggedised programmable logic solutions, announced a new eFPGA Hard IP design win for a programmable system-on-chip (SoC) targeting battery management, precision motor control, and industrial robotic applications on a 16nm automotive process technology...

14 Oct 2026 | Wednesday | NEWS
Marvell Unveils Second-Generation Structera X CXL Memory Expanders for AI Systems

Expanding memory capacity for AI: Second-generation Marvell® Structera™ X 3406 and 3506 CXL 3.2 memory expanders add six DDR4/DDR5 channels (50% more than the prior generation) and PCIe Gen 6 connectivity, supporting up to 9TB of DDR4 or 6TB of DDR5 per controller. Addresses growing memory demand: Multi-host sharing and inline LZ4 compression deliver up to 2–3x more effective ca...

14 Oct 2026 | Wednesday | NEWS
EHT Semi Integrates Bird RF Measurement Technology into Semiconductor Power Systems

EHT Semi announced the integration of Bird RF measurement technology into its semiconductor power platforms, including the Orion™ Direct RF™ System and tailored waveform generators. An embedded Bird probe, with NIST-traceable calibration, provides the primary measurement of power, voltage, current, and impedance. The integration reflects a collaborative relationship between EHT Semi an...

14 Oct 2026 | Wednesday | NEWS
Microchip Expands AI Data Centre Portfolio with PCIe 6.0 Switch and Storage Upgrades

Microchip Technology has introduced new connectivity and storage products aimed at AI, cloud and high-performance computing systems, as data centres face growing pressure to move and manage larger volumes of information between processors, accelerators and storage. The additions include a Switchtec PCIe 6.0 Low-Lane-Count switch, an enhanced version of the company’s Flashtec PCIe Gen 5 NVMe...

14 Oct 2026 | Wednesday | NEWS
Applied Materials Opens $5 Billion EPIC Center for Semiconductor R&D

$5 billion investment creates the world’s largest semiconductor equipment and process technology R&D facility Purpose-built to accelerate the path from breakthrough innovation to high-volume manufacturing of next-generation chipmaking technologies Leading chipmakers, systems companies, equipment partners and research universities have committed to develop inside EPIC ...

14 Oct 2026 | Wednesday | NEWS
GigaDevice Expands LVGL Support Across Eight GD32 MCU Families

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analogue products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providi...

13 Oct 2026 | Tuesday | NEWS
Samsung Ventures and Applied Ventures Back Flexcompute’s Physics World Model

Flexcompute, the physics company, announced a strategic investment from Samsung Ventures and Applied Ventures, LLC, the venture capital arm of Applied Materials, Inc., among other investors. The funding will accelerate Flexcompute's work on the Physics World Model: AI that predicts how any design will behave in the real world by learning the laws of physics themselves, from a chip package warping ...

13 Oct 2026 | Tuesday | NEWS
Accelsius Expands Austin Lab for Megawatt-Scale AI Cooling Tests

Accelsius, a leader in two-phase, direct-to-chip liquid cooling for AI and high-performance computing, announced that it has upgraded its Springdale lab and facility in Austin, Texas, to multi-megawatt power for two-phase liquid cooling testing. The upgraded environment allows Accelsius to validate its NeuCool® platform at the rack densities and facility water temperatures that next-generation...

13 Oct 2026 | Tuesday | NEWS
LG Expands Chiller Production in US and South Korea for AI Data Centres

LG Electronics is expanding chiller production across three manufacturing facilities by establishing a new factory in the United States and expanding production at its existing facilities in Changwon and Pyeongtaek, South Korea. The new U.S. facility in Virginia will enable local chiller production and help LG respond quickly to growing chiller demand across North America. Through its “O...

13 Oct 2026 | Tuesday | NEWS
Kioxia Joins Applied Materials’ EPIC Center to Advance AI Memory

Companies will collaborate to develop advanced memory structures, chip stacking technologies and materials engineering innovations to increase AI memory performance KIOXIA joins Applied Materials’ growing EPIC Center ecosystem, which includes chipmakers, chip designers, equipment partners and universities Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solut...

13 Oct 2026 | Tuesday | NEWS
Microchip Acquires VORAGO to Expand Radiation-Hardened Chip Portfolio

Microchip Technology has acquired VORAGO Technologies, strengthening its position in radiation-hardened semiconductors used in space, defence and other applications where electronics must operate reliably in extreme environments. VORAGO, a privately held semiconductor company based in Austin, Texas, develops radiation-hardened and radiation-tolerant microcontrollers and microprocessors. Financial...

13 Oct 2026 | Tuesday | NEWS
Lapmaster Wolters Secures Minority Investment from Cynosure and Fernweh

Lapmaster Wolters and Precision Surfacing Solutions (“Lapmaster Wolters”), a leading global supplier of high-precision machine systems and consumables to the semiconductor, advanced materials, precision optics, and advanced packaging industries, announced the completion of a minority equity investment by affiliates of The Cynosure Group (“Cynosure”) and Fernweh Group (&ldqu...

12 Oct 2026 | Monday | NEWS
Kioxia Launches First E1.L SSD Built with BiCS FLASH Generation 8 QLC

Kioxia Corporation announced its first E1.L form factor SSD built with BiCS FLASH™ generation 8 QLC flash memory. Amid the ever-growing demand for data—including data for AI—hyperscale data centers are increasingly adopting high-density designs to achieve greater storage capacity within limited server space. The KIOXIA LD4 Series is designed for high-density 1U servers and r...

12 Oct 2026 | Monday | NEWS
IonQ Achieves 1 kHz Quantum Interconnect Between Trapped Ion and Solid-State Memory

Photonic interconnect generates more than 1,000 quantum connections per second between a trapped ion qubit and a silicon vacancy quantum memory. That entanglement rate is fast enough to support distributed quantum computing and other use cases. IonQ (NYSE: IONQ), the world’s leading full-stack quantum platform and foundry, announced the achievement of entanglement rates above...

12 Oct 2026 | Monday | NEWS
GlobalFoundries Advances €1.1 Billion Dresden Expansion and Unveils FDX Fusion Platform

GlobalFoundries (NASDAQ: GFS) (GF) celebrated the topping-out of its SPRINT expansion project in Dresden and announced FDX Fusion, a next-generation platform for highly integrated, energy-efficient chips planned for development and manufacturing at the site. The platform is designed for demanding Physical AI applications. Together, the two milestones advance one of Europe's most significant semico...

12 Oct 2026 | Monday | NEWS
Applied Materials, UCLA Partner on AI Chip R&D at EPIC Center

Applied Materials has added the UCLA Samueli School of Engineering as a research collaborator at its Equipment and Process Innovation and Commercialization, or EPIC, Center in Silicon Valley, expanding the company’s academic partnerships around next-generation semiconductor development. Researchers from UCLA will work alongside Applied Materials scientists and engineers to address semicondu...

12 Oct 2026 | Monday | NEWS
GlobalFoundries, TSMC Sign $2 Billion Deal for US AI Chip Packaging Supply

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to establish US production of silicon interposers used in advanced semiconductor packaging. Under the agreement, GlobalFoundries will expand manufacturing capacity at its facility in Malta, New York, where it will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. The companies have agreed an i...

12 Oct 2026 | Monday | NEWS
Wolfspeed Secures Conditional $1.5 Billion US Commitment for Domestic SiC Production

Wolfspeed has received a conditional commitment for up to $1.5 billion in long-term financing from the US Department of War through its Office of Strategic Capital, as the company looks to strengthen domestic production of silicon carbide and other wide-bandgap semiconductor technologies. The proposed financing carries a 30-year term and is intended to support the development and manufacture of s...

9 Oct 2026 | Friday | NEWS
Aehr Secures $6 Million AI Chip Burn-In Order from Hyperscale Customer

Aehr Test Systems has secured around $6 million in additional production orders from its lead hyperscale customer for package-level burn-in of a next-generation artificial intelligence processor designed for data centre training and inference workloads. The orders cover additional Sonoma high-power package-level test and burn-in systems, turnkey burn-in modules, device-specific sockets and upgrad...

9 Oct 2026 | Friday | NEWS
AMD Plans AI Chip Capacity Up to Five Years Ahead as Lisa Su Meets TSMC

AMD Chair and CEO Dr Lisa Su has visited Taiwan to meet TSMC and other supply chain partners as the chipmaker prepares for continued growth in artificial intelligence infrastructure. During the visit, Su said AMD's previously announced plan to invest more than US$10 billion in Taiwan's industrial ecosystem remains on track, with further investment expected. The company is increasing supply during...

9 Oct 2026 | Friday | NEWS

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