• Monday | 19 October 2026
Wolfspeed and Infineon Expand Silicon Carbide Wafer Supply Agreement to Include 200mm Wafers

Wolfspeed, Inc (NYSE: WOLF), a global leader in silicon carbide technology, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced the expansion and extension of their existing long-term silicon carbide (SiC) wafer supply agreement. The expanded agreement adds 200 mm silicon carbide wafers to the existing 150 mm supply and builds on a supply relationship between the two companies spannin...

19 Oct 2026 | Monday | NEWS
FIC Global Opens Johor Manufacturing Facility for AI and Data Centre Technologies

PRO3C (Malaysia) Sdn. Bhd., a subsidiary of Taiwan-listed FIC Global Inc. (FICG, TWSE: 3701), officially celebrated the grand opening of its manufacturing facility located at i-Park @ Senai Airport City, Johor. The ceremony was officiated by Yang Berhormat Lee Ting Han, Johor State Executive Councillor. The event was also attended by distinguished government officials, representatives from J...

19 Oct 2026 | Monday | NEWS
Elektrobit and Microchip Partner to Simplify AUTOSAR Software Development

Elektrobit, a global expert in automotive software, and Microchip Technology Inc., a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a collaboration to simplify and accelerate AUTOSAR-based software development for automotive manufacturers and suppliers using Microchip automotive platforms. As the automotive industry move...

19 Oct 2026 | Monday | NEWS
Costa Rica Promotes Semiconductor Investment and Talent Development at SEMICON West 2026

The agency presented Costa Rica's strategy to expand the pipeline of specialized talent to international industry leaders. Eight companies from Costa Rica's business ecosystem are showcasing integrated solutions to prospective investors. As part of its ongoing efforts to attract investment in the semiconductor industry, Costa Rica is participating in SEMICON West 2026...

19 Oct 2026 | Monday | NEWS
GlobalFoundries Selected for $21 Billion US-Japan Semiconductor Fab Initiative

GlobalFoundries (Nasdaq: GFS) (GF) today announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (“fabs”) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. Enabled by President Donald J. Trump's trade and investment agreement with Japan, the initiative will accelerate trus...

19 Oct 2026 | Monday | NEWS
Great Lakes Semiconductor Launches Modular Fab and Advanced Packaging Project

Great Lakes Semiconductor (GLS) has announced the first project under its Great American ChipForge platform, bringing together semiconductor design, flexible wafer manufacturing and advanced packaging technologies to support the development of intelligent sensor systems for vehicles. The project forms part of the company's Innovation Funnel initiative, which aims to move new semiconductor technol...

19 Oct 2026 | Monday | NEWS
Mach42 Appoints David Tester as Vice President of Engineering

Mach42 appoints David Tester, a semiconductor engineering leader with more than 30 years' experience, as Vice President of Engineering. The appointment comes as Mach42's engineering team doubles in size in 2026 and the company moves from product development to industry-wide adoption. Mach42's AI technology gives analog and mixed-signal designers dramatically broader verification coverage, work...

16 Oct 2026 | Friday | NEWS
Global X Launches Asia Semiconductor ETF Covering Key Regional Chip Markets

-Global X Management Company LLC (“Global X”), the New York-based provider of exchange-traded funds (ETFs), announced the launch of the Global X Asia Semiconductor ETF (ticker ACHP). ACHP (“the Fund”) seeks to invest in companies that are positioned to benefit from the growth and advancement of the Asian semiconductor ecosystem. This includes companies involved in semicond...

16 Oct 2026 | Friday | NEWS
Salience Labs Raises $125 Million to Scale Optical Switching for AI Data Centres

Salience Labs, a leader in photonic chips targeting connectivity for AI datacenter infrastructure, announced the successful completion of an oversubscribed $125 million Series B funding round. The round is led by Bullhound Capital, with Principal Callum Stewart joining the Salience Labs Board of Directors. Additional investor participation came from AMD Ventures, Intel Capital, SBI Group, Hudson R...

16 Oct 2026 | Friday | NEWS
ModelBest Launches MiniCPM-V 4.7 for On-Device Multimodal Computing

ModelBest and the OpenBMB community announced the release of MiniCPM-V 4.7, the latest addition to their open-source on-device multimodal model series. Available in 35B-A3B and 1B versions, the release brings advanced image, document and video understanding to edge devices with about 3GB of memory. ModelBest describes MiniCPM-V 4.7 35B-A3B as the first open-source MoE multimodal model built to ru...

16 Oct 2026 | Friday | NEWS
ChipAgents and NVIDIA Launch Benchmark for End-to-End Chip Design Automation

ChipAgents developed Build-A-Chip-Bench with NVIDIA to evaluate AI agents across the end-to-end digital IC design flow, from specification through physical implementation and verified Graphic Design System (GDS). Unlike point benchmarks focused primarily on RTL generation or verification, Build-A-Chip-Bench tests whether agents can meet functional, timing, power, area, and physical-verification...

16 Oct 2026 | Friday | NEWS
IBM, Siemens Partner to Advance 3D Nanostack Transistors Beyond 7 Angstroms

IBM has joined forces with Siemens on semiconductor research aimed at moving its nanostack transistor architecture closer to scalable manufacturing, combining IBM’s device development expertise with Siemens’ capabilities in electronic design automation, process simulation and lithography optimisation. The companies will work on the design, modelling and manufacturing techniques requir...

16 Oct 2026 | Friday | NEWS
Great Lakes Semiconductor Launches First Great American ChipForge Project

Great Lakes Semiconductor (GLS) announced the first project on its Great American ChipForge™ platform, launched under the company's Innovation Funnel™ initiative. The project draws on multiple GLS design centers, ChipForgeTM modular wafer fabrication, and FINPAT™ packaging and test, demonstrating the company's distributed, end-to-end integration capabilit...

15 Oct 2026 | Thursday | NEWS
WPG Americas Partners with Nuvoton to Expand Semiconductor Distribution in North America

WPG Americas Inc. (WPGA), a leading distributor of electronic components and supply chain services, announced a strategic partnership with Nuvoton Technology Corporation America (NTCA), a leading provider of microcontroller, audio, cloud security, battery monitoring, component, and visual sensing IC solutions. Through the partnership, WPGA will distribute Nuvoton's portfolio of high-performance, ...

15 Oct 2026 | Thursday | NEWS
Rocket One and VCU Partner to Advance SKYMRAM Magnetic Memory Technology

Rocket One Inc. (Nasdaq: RKTO) ("Rocket One" or the "Company")  announced that it has executed a sponsored research agreement with Virginia Commonwealth University (VCU) to advance SKYMRAM, a skyrmion-based magnetic memory technology with potential applications in next-generation AI chips and computing systems. The agreement establishes a one-year research program scheduled to begin Nov...

15 Oct 2026 | Thursday | NEWS
eInfochips Demonstrates Integrated Custom Silicon Platform for Power Monitoring and Control

eInfochips, an Arrow Electronics company and provider of semiconductor and product engineering services, announced that it has successfully demonstrated end-to-end turnkey ASICdesign capability through the development, fabrication, packaging, and bring-up of a test chip. The architecture includes a built-in microcontroller for current and voltage monitoring, smart programable control, diagnostics...

15 Oct 2026 | Thursday | NEWS
Bolt Graphics Validates Zeus GPU Architecture with 12nm TSMC Test Chip

Bolt Graphics, Inc. (Bolt), a fabless semiconductor startup building hardware and software for high-performance computing (HPC), rendering and digital twin workloads, announced the bring-up of its Zeus test chip and the opening of its Taipei office to manage manufacturing partnerships as the company prepares for production of its first fully commercial GPU, planned for general availability in 2028...

15 Oct 2026 | Thursday | NEWS
VisIC and AVL Integrate GaN Power Modules into EV Demonstrator

The demonstrator vehicle showcases VisIC D³GaN power modules in an advanced AVL electric drivetrain, taking high-power GaN from test bench validation to a complete vehicle environment. The same D³GaN platform expends to power AI data centers and physical AI to benefit from high efficiency, compact size and reliability. The potential of the efficient evaluated D³GaN semiconductor pl...

15 Oct 2026 | Thursday | NEWS
10 Policy and Trade Moves That Redrew the Global Chip Map in 2026

KEY TAKEAWAYS Governments spent 2026 managing flows rather than stopping them: licences with conditions, tariffs with carve-outs, minerals rules backed by enforcement. Industrial policy moved beyond the fab into packaging, materials, equipment, design and talent, from New Delhi to Brussels to Seoul. For buyers, available capacity and accessible capacity are no longer the same thing. Complianc...

14 Oct 2026 | Wednesday | Analysis
Tower Semiconductor and Semtech Expand SiGe Partnership for AI Data Centre Interconnects

Tower Semiconductor (Nasdaq/TASE: TSEM), the leading foundry for high-value analogue semiconductor solutions, and Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data centre networking and intelligent, connected Internet of Things ("IoT") devices worldwide, announced an expanded multi-year agreement that builds on the companies’ 20-year p...

14 Oct 2026 | Wednesday | NEWS

Asia Pacific

Europe

United States of America