• Monday | 24 August 2026
Chiplets Market to Reach $605 Billion by 2036 as AI and Advanced Packaging Drive Growth

The global chiplets market is projected to grow from $54 billion in 2025 to $605 billion by 2036, supported by rising AI and HPC workloads, advanced packaging adoption and demand for scalable semiconductor architectures. The semiconductor industry is increasingly turning to chiplet-based architectures as conventional monolithic chip designs become more complex and costly at advanced process nodes...

24 Aug 2026 | Monday | NEWS
Nvidia Develops New AI Chip for China as It Seeks to Rebuild Market Presence

Nvidia is reportedly developing a new artificial intelligence (AI) processor specifically for the Chinese market, as the US chipmaker looks to maintain its position in one of the world's largest technology markets amid tightening export restrictions. The reported move comes as Nvidia faces growing challenges in China. US export controls have restricted the sale of some of the company's most advan...

24 Aug 2026 | Monday | NEWS
Qualcomm Snapdragon 8 Elite Gen 6 Extreme Could Introduce New Flagship Chip Naming

Qualcomm is reportedly preparing a new naming structure for its upcoming flagship smartphone processors, with the company potentially adding an ‘Extreme’ designation to its most powerful mobile chip. According to recent leaks, Qualcomm could introduce two flagship platforms under the Snapdragon 8 Elite Gen 6 family. The standard processor is expected to retain the Snapdragon 8 Elite G...

24 Aug 2026 | Monday | NEWS
SK hynix Reviews Chongqing Packaging Operations as AI Demand Drives HBM Expansion

South Korean memory semiconductor manufacturer SK hynix is reviewing the future of its packaging operations in Chongqing, China, as the company adjusts its manufacturing strategy to meet rapidly rising demand for artificial intelligence (AI) memory. The review comes as SK hynix continues to increase its focus on high-bandwidth memory (HBM) and advanced packaging technologies, which have become in...

24 Aug 2026 | Monday | NEWS
Qnity Electronics Appoints Ken Rizvi as Chief Financial Officer

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1. Michael Goss, who has been serving as interim Chief Financial Officer, will assume the role of Qnity&rsqu...

24 Aug 2026 | Monday | NEWS
Mouser Launches Consumer Technology Resource Centre for Smarter Product Development

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, highlights its new digital resource centre for consumer technology, providing engineers with emerging technologies, reference designs, and implementation guidance to accelerate product development. This resource centre supports faster prototyping, streamlined i...

24 Aug 2026 | Monday | NEWS
TekSiC Advances Europe’s First Domestic Semi-Insulating SiC Wafer Supply for Defence and Space

Swedish semiconductor materials company TekSiC has reached several important milestones in its efforts to establish Europe’s first commercially available domestic supply of semi-insulating silicon carbide (SI-SiC) wafers for space, defence and radio-frequency (RF) applications. The company is developing a European supply base for a material that is increasingly important in high-frequency a...

21 Aug 2026 | Friday | NEWS
BrainChip Launches Open-Source Akida Bundle for AI Workload Scheduling with IBM Symphony

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, has released the Symphony Community Akida Bundle, a free, open-source software bundle that lets developers run BrainChip Akida neuromorphic processors alongside their existing compute under a workload scheduler built on IBM Spectrum Symphony Community E...

21 Aug 2026 | Friday | NEWS
Qnity Electronics Installs KLA Surfscan SP7XP to Advance Semiconductor Materials Innovation

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation. The system enhances Qnity's ability to develop and manufacture leading-...

21 Aug 2026 | Friday | NEWS
Toshiba Launches 80V eFuse IC for 48V Industrial Power Systems and Equipment

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added “TCKE1401NM,” an 80V-rated electronic fuse (eFuse IC), to its lineup of eFuse ICs with multiple built-in power line protection functions. Shipments start today. The new product adopts the VQFN24D package, an industry-leading[1] small package for 80V-rated eFuse ICs, which contributes to improved safet...

21 Aug 2026 | Friday | NEWS
SEMICON India 2026: PM Modi to Inaugurate Global Semiconductor Industry Event in New Delhi

Prime Minister Narendra Modi will inaugurate SEMICON India 2026 at Yashobhoomi, the India International Convention and Expo Centre in New Delhi. The event will bring together stakeholders from across the global semiconductor ecosystem, including manufacturers, technology companies, equipment and materials suppliers, investors, researchers and policymakers. Organised by SEMI in collaboration with ...

21 Aug 2026 | Friday | NEWS
Hanmi Semiconductor Invests $94 Million in New Incheon Plant to Expand HBM and AI Chip Equipment Capacity

South Korean semiconductor equipment maker Hanmi Semiconductor is investing approximately KRW 130 billion (around US$94 million) to establish its eighth production facility in Incheon, marking the largest manufacturing investment in the company’s history. The expansion comes as demand for equipment used in artificial intelligence (AI) semiconductor and high-bandwidth memory (HBM) production ...

21 Aug 2026 | Friday | NEWS
proteanTecs Expands Chiplet Analytics Solutions for Advanced Multi-Die Packaging

proteanTecs®, the leading provider of deep data visibility for advanced electronics, unveiled a dedicated suite of health, power and performance management solutions for multi-die systems. Based on the company’s unique on-chip monitoring technology, semiconductor and system companies can now improve yield, reduce risk and protect investments in high-value systems-in-package. AI is ...

20 Aug 2026 | Thursday | NEWS
xETFs Launches Korea AI Semiconductor ETF to Target Samsung, SK Hynix and AI Chip Ecosystem

xETFs, a New York-based ETF issuer that makes differentiated investment opportunities accessible to investors, is launching the xETFs Korea AI Semiconductor ETF (KSMH). KSMH is an actively managed ETF designed to provide targeted exposure to Korea’s semiconductor industry, including the country’s industry-leading AI chipmakers, as well as other firms across the full Korean AI sem...

20 Aug 2026 | Thursday | NEWS
KAGA FEI Develops Bluetooth LE Modules to Simplify IoT Wireless Connectivity

KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules ...

20 Aug 2026 | Thursday | NEWS
Semtech Expands LoRa Plus Portfolio with New Production-Ready IoT Transceivers

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data centre networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, announced the expansion of its LoRa Plus family with the introduction of the LR2022 and LR2012 transceivers, both now available in production. The two new devices e...

20 Aug 2026 | Thursday | NEWS
Gradiant Expands US Water Infrastructure Push as AI and Semiconductor Demand Grows

Every microchip, data centre, and megawatt of AI capacity depends on water. Gradiant, the water layer of the AI economy, announced a series of milestones reinforcing its ability to solve that constraint across the United States: a new US leadership hire, three new offices, an innovation centre, and long-term services contracts, including one with a chip major. Gradiant named Dr Nish Vora as ...

20 Aug 2026 | Thursday | NEWS
LitePoint and STMicroelectronics Validate Next-Generation UWB Chipset for IEEE 802.15.4ab

LitePoint, a leading provider of communication test solutions, announced the successful validation of physical layer (PHY) performance for STMicroelectronics’ ST64UWB chip family using LitePoint's next-generation UWB test system, IQgig-UWB+™. The joint effort confirmed that ST's silicon meets the rigorous requirements of the IEEE 802.15.4ab draft specification, giving UWB develope...

20 Aug 2026 | Thursday | NEWS
SRC Launches SPARC Consortium with $13 Million Research Portfolio for Advanced Semiconductor Technologies

Semiconductor Research Corporation (SRC) is announcing the launch of the Semiconductor and Packaging Advanced Research Consortium (SPARC), its newest industry-driven collaborative research program designed to accelerate breakthrough research in semiconductor technologies critical to the future of the global microelectronics ecosystem. SPARC represents their newest project-based research program, ...

19 Aug 2026 | Wednesday | NEWS
Avicena Begins Shipping 1Tbps LightBundle Evaluation Kits for Next-Generation AI Infrastructure

Avicena, the pioneer in microLED-based optical interconnects, announced that it has begun shipping 1 Tbps LightBundle™ evaluation kits (eKits) to customers and partners developing next-generation AI infrastructure. The shipment milestone follows the introduction and demonstration of the LightBundle eKit in March 2026 at the Optical Fibre Conference (OFC26) and advances the platform from init...

19 Aug 2026 | Wednesday | NEWS

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