• Thursday | 12 November 2026
Japan Plans Additional ¥400 Billion Investment in Rapidus to Advance 2nm Chip Production

Japan's Ministry of Economy, Trade and Industry (METI) plans to seek an additional ¥400 billion (around US$2.5 billion) in government investment in chipmaker Rapidus over three fiscal years starting in 2027. The plan was disclosed on 19 October in documents submitted to a subcommittee of the Fiscal System Council, which advises Japan's Finance Minister. METI is seeking ¥150 billion in its...

28 Oct 2026 | Wednesday | NEWS
Nexperia Targets Doubling of India Revenue and Tripling of Local Footprint

Netherlands-based semiconductor maker Nexperia expects to double its revenue in India over the next few years and has committed to tripling its existing footprint in the country within five years, according to Interim CEO Stefan Tilgner. Tilgner made the remarks to ANI in The Hague during Union Commerce and Industry Minister Piyush Goyal's visit to the Netherlands. He said Nexperia has signed a j...

28 Oct 2026 | Wednesday | NEWS
SK hynix and Samsung Electronics Set for Earnings Updates as AI Memory Demand Surges

SK hynix will announce its third-quarter 2026 results on 28 October, with Samsung Electronics set to follow on 29 October. Market consensus compiled by FnGuide projects SK hynix's third-quarter consolidated revenue at KRW 98.23 trillion and operating profit at KRW 76.96 trillion, increases of 301.76% and 576.11% year on year respectively. South Korean media expect the company's operating margin t...

28 Oct 2026 | Wednesday | NEWS
TSMC Reportedly Plans 10–20% CoWoS Advanced Packaging Price Increase

Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to raise prices for its chip-on-wafer-on-substrate (CoWoS) advanced packaging service by 10 to 20%, according to a report published by Taiwan's Commercial Times on 27 October 2026. Third-party outsourced assembly and test (OSAT) suppliers are also said to be preparing similar price adjustments. CoWoS integrates AI processors and high-...

28 Oct 2026 | Wednesday | NEWS
China's Chip Manufacturing Expansion Threatens South Korean Memory Margins, PwC Says

South Korea's semiconductor industry needs to strengthen its cost competitiveness and move towards higher-value products as China expands its chip manufacturing capacity, according to a new report from Samil PwC, the South Korean member firm of PricewaterhouseCoopers. Published on 26 October 2026, the report examines how China's semiconductor industry has developed beyond individual technology in...

27 Oct 2026 | Tuesday | NEWS
JST Launches Apex Wafer Dryer with Faster Processing and Improved Defect Control

 JST, a leading provider of wet benches, wafer cleaning and processing tools for the semiconductor industry, announced Apex, its upgraded Marangoni-type, isopropyl alcohol (IPA)-based wafer dryer. The new Apex dryer enables improved device yields by delivering reduced particle defect size and density and 10% to 15% shorter drying cycle times compared to JST’s existing IPA dryer. &n...

27 Oct 2026 | Tuesday | NEWS
Nagare Labs Introduces Z2RAM Memory Technology to Address AI Chip Performance Bottlenecks

Nagare Labs emerged from stealth with $5M led by Playground Global and a new memory technology designed to overcome the most critical hardware bottleneck in AI innovation. Combining density and speed, Nagare’s memory technology promises to make AI compute systems more fluid, responsive, and economically scalable. A spinout of Georgia Tech, Nagare Labs was co-founded by Dr Suman Datta and Dr...

27 Oct 2026 | Tuesday | NEWS
Samsung SDI Secures 1.5 GWh Battery Storage Supply Agreements with Alpha Omega Power in the US

Supply deals with AOP totaling 1.5 GWh, with all products to be manufactured at the SPE plant in Indiana SBB 1.7 features high-nickel NCA prismatic batteries and proven fire safety, supporting AOP projects in the WECC and ERCOT power markets Samsung SDI expands its North American ESS presence as AOP grows its U.S. storage portfolio Samsung SDI announced that its Michigan-based subsidi...

27 Oct 2026 | Tuesday | NEWS
RAAAM Memory Technologies Appoints Former Intel Foundry and Samsung Executive Hong Hao as Strategic Advisor

RAAAM Memory Technologies, a startup company providing an ultra-high-density, low-power on-chip memory technology, announced the appointment of Hong Hao, a former executive at Intel Foundry and Samsung Electronics, as Strategic Advisor. In this role, Mr Hao will work closely with RAAAM's executive team to support the company’s strategic growth and accelerate market engagement with customers ...

27 Oct 2026 | Tuesday | NEWS
HCLTech and Rapidus Open Two Semiconductor Engineering Centres in India

HCLTech (NSE: HCLTECH) (BSE: HCLTECH), a leading global technology company, and Rapidus Corporation, a Japanese company developing and manufacturing advanced logic semiconductors, officially inaugurated two HCLTech development centres in India dedicated to supporting Rapidus' evolving semiconductor engineering requirements. The centres, located in Bengaluru and Hubli, will leverage HCLTech's...

27 Oct 2026 | Tuesday | NEWS
How AlpSemi Is Reinventing Power Semiconductors for Solid-State Circuit Breakers

AlpSemi aims to transform this landscape by developing advanced power semiconductor devices specifically designed for solid-state circuit breakers (SSCBs). This approach addresses a key challenge: improving the efficiency, compactness and cost competitiveness of semiconductor-based protection. Founded in 2024 by Frédéric Dupont and Fabrice Letertre, both former executives at Soitec,...

26 Oct 2026 | Monday | Feature
Atomera, IQE Partner to Develop RF GaN-on-Silicon for Volume Manufacturing

Atomera has signed a joint development agreement with IQE plc to develop gallium nitride-on-silicon (GaN-on-Si) wafers for radio-frequency (RF) semiconductor applications, targeting improved device performance and lower manufacturing costs in high-volume markets. The collaboration will bring together Atomera's Mears Silicon Technology (MST) and IQE's compound semiconductor epitaxy capabilities to...

26 Oct 2026 | Monday | NEWS
Helion Secures Agreement for Up to $175 Million in US CHIPS Funding for Fusion Semiconductor Development

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington State. The project will also support research and development for domestic next-generation semiconductor tooling. Helion, a Washington-based fusion energy company, announced it has signed a letter of intent with the U.S. De...

26 Oct 2026 | Monday | NEWS
TASKING and NXP Introduce Unified Software Development Toolchain for S32K5 Automotive Microcontrollers

TASKING, a leading provider of embedded software development tools, announced the first and only single-vendor unified toolchain for NXP® Semiconductors’ S32K5 microcontroller family. Developed in close collaboration with NXP, this toolchain brings compilation, debugging, and verification together in one workflow, accelerating development of next-generation zonal architectures and electr...

26 Oct 2026 | Monday | NEWS
Rambus Partners with ChipAgents to Accelerate Semiconductor Chip Design and Verification

Rambus adopts ChipAgents agentic AI platform to accelerate its own chip and IP design and verification workflows The partnership brings together tailored Rambus silicon IP and ChipAgents’ agentic AI capabilities to speed up chip design and IP integration across customer-preferred design environments Rambus becomes a strategic investor in ChipAgents, reflecting shared commitment to advanc...

26 Oct 2026 | Monday | NEWS
Infinity Appoints Former Meta Engineer Aditya Om and CUDA Expert Elliot Arledge to Strengthen AI Chip Software Development

Infinity (Infinity Artificial Intelligence Institute), an automated AI research company building the software layer that makes any AI chip inference-ready, announced two key hires to its engineering team. Aditya Om, a former senior software engineer at Meta Superintelligence Labs (MSL), joins Infinity as Staff Inference Optimisation Engineer, and Elliot Arledge, whose CUDA and LLM coding courses h...

26 Oct 2026 | Monday | NEWS
Renesas Launches 600 MHz RX74M and RX74N Microcontrollers with 22nm Technology and Embedded MRAM

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, launched the RX74M and RX74N, new flagship 32-bit microcontrollers (MCUs) that deliver up to 600 MHz performance and are the first in the RX Family to be built on a 22nm process and incorporate embedded MRAM. Both devices deliver more than twice the performance of their 240 MHz predecessors, the RX7...

23 Oct 2026 | Friday | NEWS
SEEQC and NVIDIA Demonstrate 50% Improvement in Quantum Error Correction Performance

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced results demonstrating significant performance improvements in quantum error correction decoding through a digital interface optimized multi-stage decoding architecture combining SEEQC’s chip-based pre-decoder technology with the NVIDIA Ising open family of AI models. SEEQC&rsquo...

23 Oct 2026 | Friday | NEWS
Atomera and IQE Partner to Develop High-Performance RF GaN-on-Silicon Wafers

Atomera, a semiconductor transistor materials and technology licensing company, announced it has entered into a Joint Development Agreement (JDA) with IQE plc, the leading global supplier of compound semiconductor wafer products and advanced material solutions, to bring high-performance, cost-effective RF GaN to market. The collaboration leverages Atomera’s recently announced application of ...

23 Oct 2026 | Friday | NEWS
Intelligence per Microjoule: Why the Next Era of AI Will Be Decided at the Edge

For most of the past three years, the semiconductor industry has measured AI progress in one direction. Models have grown larger, clusters have grown denser, and accelerators have been paired with more high-bandwidth memory with each generation. That build-out has been remarkable, and it will continue. As we look toward 2027, though, the constraints shaping our industry are becoming as important a...

23 Oct 2026 | Friday | Feature

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