• Wednesday | 24 June 2026
Manz Asia Delivers World’s First 310mm Panel-Level Packaging ECD System for Volume Production

A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, has successfully delivered the world's first 310 mm × 310 mm panel-level packaging (PLP) Electrochemical Deposition (ECD) mass production system. The system expands Manz Asia's advanced packaging portfolio and showcases its integrated in-house expertise in process innovation, equipment engineering, and high-volume ...

16 Jun 2026 | Tuesday | NEWS
IQM Quantum Computers Strengthens Board with Technology Industry Veteran Barbara Venneman

IQM Quantum Computers, the global leader in superconducting quantum computers, announced the appointment of Barbara Venneman to its Board of Directors. Venneman deepens the Board's expertise in digital transformation, enterprise technology commercialisation, and global business scaling as IQM expands its commercial footprint worldwide. Additionally, CEO and Co-founder Jan Goetz will replace Co-fou...

15 Jun 2026 | Monday | NEWS
DDN and NVIDIA Advance Enterprise AI Infrastructure for Agentic AI Deployment

DDN, the global leader in AI and data intelligence solutions, announced new advancements to its AI data intelligence platform designed to help enterprises deploy agentic AI faster, strengthen governance and security, reduce operational complexity, and maximise GPU efficiency across enterprise-scale AI factories. The innovations deliver real-time observability, policy-based control, secure multi-te...

15 Jun 2026 | Monday | NEWS
D-Wave Unveils Fault-Tolerant Quantum Computing Roadmap Targeting 100 Logical Qubits by 2032

D-Wave Quantum Inc. (NYSE: QBTS), (“D-Wave” or the “Company”), the only dual-platform quantum computing company providing both annealing and gate-model systems, software and services, announced a new gate-model roadmap designed to accelerate the development of commercial, fault-tolerant quantum computing. Targeting 100 logical qubits capable of successfully performing ...

15 Jun 2026 | Monday | NEWS
Wiwynn and Ecosystem Partners Advance Co-Packaged Optics for Next-Generation AI Data Centres

Wiwynn, an innovative cloud IT infrastructure provider for data centres, announced it will unveil its latest Co-Packaged Optics (CPO) interconnect technologies at Computex 2026 (Nangang Exhibition Centre Hall 1, Booth #J0106). The demonstration brings together ecosystem partners including Ayar Labs, Global Unichip Corp. (GUC), Browave, Corning Incorporated, FOCI, Molex, SENKO, and TE Connectivity....

15 Jun 2026 | Monday | NEWS
Synopsys and Samsung Foundry Deepen Collaboration to Accelerate AI and Multi-Die Chip Development

Synopsys, Inc. (Nasdaq: SNPS) announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI and multi-die designs to market faster and w...

15 Jun 2026 | Monday | NEWS
Infineon Joins NVIDIA MGX Ecosystem to Advance 800V Power Architecture for AI Data Centres

Infineon Technologies (FSE: IFX) (OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA's MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centres. Infineon's power management solutions will support NVIDIA's MGX™ architecture and 800 VDC power architecture, an open, modular reference architecture designed for AI factories in t...

15 Jun 2026 | Monday | NEWS
GigaDevice Strengthens Optical Communications Strategy with New MCU Portfolio

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has introduced the new GD32E512 and GD32E252 series MCUs specifically designed for optical module applications. As a leading supplier of MCUs for optical module applications, GigaDevice has maintained a strong focus on the optical communicatio...

12 Jun 2026 | Friday | NEWS
Baya Systems Partners Openchip to Accelerate AI and HPC Chip Development in Europe

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP, and Openchip, a European leader in semiconductor and AI systems technologies, announced a strategic partnership. Openchip has licensed Baya Systems’ data-movement platform and Network-on-Chip (NoC) fabric technology to deliver best-in-class solutions optimised for the growing demands of next-generation in...

12 Jun 2026 | Friday | NEWS
Qnity Expands CMP Portfolio with New Optivision Max Polishing Pads

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to ach...

12 Jun 2026 | Friday | NEWS
QBit Expands ASIC Business with Majority Acquisition of Singapore’s SinChip

QBit Semiconductor (TWSE: 7913; hereinafter referred to as QBit), a leader long dedicated to intelligent image processing, precision motion control, post-quantum cryptography (PQC) security architectures, and high-precision SoC integration, announced a major step in expanding its global business capabilities. QBit's products are widely deployed in high-end multifunction printers (MFPs), commercial...

12 Jun 2026 | Friday | NEWS
GlobalFoundries and Qualinx Complete Europe's First End-to-End Sovereign Chip Manufacturing Project

GlobalFoundries (GF) and Qualinx announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology. The milestone demonstrates that security-critical chips for aerospace, defense and critical infrastructure can be designed, manufactured and delivered entirely within Europe. ...

12 Jun 2026 | Friday | NEWS
Applied Materials Opens S$600m Singapore Facility to Expand Semiconductor Manufacturing Capacity

Applied Materials has strengthened its manufacturing presence in Singapore with the launch of a new S$600 million facility designed to support rising global demand for advanced semiconductor technologies, particularly those powering artificial intelligence applications. The newly opened site in Tampines will serve as a key production and innovation hub for the company, expanding its ability to de...

12 Jun 2026 | Friday | NEWS
Sheba Microsystems Appoints Vincent Cruvellier as COO to Drive Manufacturing Scale-Up

Sheba Microsystems Inc., a developer of advanced MEMS actuator technology for compact camera systems, announced the appointment of Vincent Cruvellier as Chief Operating Officer. Vincent is a seasoned international semiconductor operations executive with deep experience across Europe, China, and North America. He brings extensive leadership experience in semiconductor operations, industrialisation...

11 Jun 2026 | Thursday | NEWS
BlueRock Enhances NOVA Microhypervisor with Advanced AMD AI Infrastructure Security

BlueRock announced the latest open-source release of its NOVA Microhypervisor, which introduces advanced DMA remapping support for AMD (NASDAQ: AMD) platforms with IOMMU hardware virtualisation capabilities. As AI infrastructure faces sustained concurrency, growing execution complexity, and increasing economic pressure, NOVA strengthens hardware-level isolation across workloads, de...

11 Jun 2026 | Thursday | NEWS
Qnity Unveils Advanced Packaging Materials for AI and High-Performance Computing Chips

Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redi...

11 Jun 2026 | Thursday | NEWS
Celera Semiconductor Acquires SiliconGate to Expand AI-Driven Analog Chip Business

Celera Semiconductor, the leading analog IC supplier using AI to slash the cost and time to develop and supply analog ICs, announced it has acquired SiliconGate, a global leader in analog IC design and supply with offices in Lisbon and Porto, Portugal. Celera outlined plans to grow its presence in Portugal through the acquisition, creating a worldwide centre of excellence in analogue design and d...

11 Jun 2026 | Thursday | NEWS
Kingston Strengthens Industrial Memory and Storage Portfolio for Next-Generation Infrastructure

Kingston Technology Company, Inc., a world leader in memory and storage solutions, continues to advance its “Built on Commitment” philosophy as industrial PCs, edge systems, and embedded platforms take centre stage in powering next-generation automation, intelligent services, and mission-critical applications. As advanced manufacturing, smart logistics, and global digital inf...

11 Jun 2026 | Thursday | NEWS
NextSilicon Expands RISC-V Strategy with Enterprise AI and HPC Processor Roadmap

NextSilicon, a leader in next-generation computing solutions for AI and high-performance computing (HPC), announced plans to productize its Arbel RISC-V core into a 64-core and a 128-core, enterprise-grade processor suited to deliver ultra-speed performance for agentic tools, expected to be available in early 2028. Following an October preview, the company is now sharing expanded technical de...

11 Jun 2026 | Thursday | NEWS
Park Systems Raises $72 Million to Expand Semiconductor Metrology Capacity

Park Systems Corp. (KOSDAQ: 140860), a global leader in atomic force microscopy (AFM) and nanometrology, announced the successful completion of a KRW 100 billion (approximately USD 72 million) strategic financing through the issuance of perpetual bonds with warrants, with Kiwoom Securities and Dominus Investment Management each subscribing KRW 50 billion. The proceeds will support the company's pr...

10 Jun 2026 | Wednesday | NEWS

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