• Tuesday | 12 May 2026
Neurophos Rapidly Expands Team with Senior Hires from NVIDIA, Intel, and Qualcomm

 Neurophos, a leader in photonic AI chip technology, announced it has nearly tripled in headcount since closing its $110M Series A round in January 2026. In less than six months, the company has grown by nearly 3x — a trajectory that reflects both the importance and the opportunity for next-generation AI compute infrastructure. The latest wave of hires brings deep industry experience t...

23 Apr 2026 | Thursday | NEWS
yieldWerx Enters Taiwan Semiconductor Market via Strategic Collaboration

yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world's most concentrated semiconductor markets. The collaboration combines Enlight Technology's established role across Taiwan's semiconductor design, manufacturing, and research landscape with yieldWerx's experti...

23 Apr 2026 | Thursday | NEWS
Expedera Wins “Best Edge AI Processor IP” at 2026 Edge AI Awards

Expedera, a leading provider of AI accelerator IP for edge and data–centre systems,  announced that its Origin Evolution™ NPU IP has been named "Best Edge AI Processor IP" in the 2026 Edge AI and Vision Product of the Year Awards, presented by the Edge AI and Vision Alliance. The award recognises innovative building–block IP powering edge AI and visi...

23 Apr 2026 | Thursday | NEWS
CVD Equipment Corporation Advances Silicon Carbide Manufacturing with Successful Boule Growth

CVD Equipment Corporation (NASDAQ: CVV) announced the successful growth of single-crystal silicon carbide (SiC) boules grown on CVD Equipment (CVDE) Physical Vapour Transport (PVT) Systems and characterised by Stony Brook University (SBU) in support of their new semiconductor research centre, “onsemi Research Centre for Wide Bandgap Materials”. The SiC boule was analyzed at SBU a...

23 Apr 2026 | Thursday | NEWS
Kioxia Corporation Launches EG7 Series SSDs with Next-Gen QLC Technology

Kioxia Corporation announced KIOXIA EG7 Series solid state drives (SSDs), the first client solution to adopt Kioxia’s BiCS FLASH™ generation 8 4-bit-per-cell, quadruple-level cell (QLC) technology. The QLC-based KIOXIA EG7 Series delivers equivalent performance as TLC-based solutions(1), enabling better total cost of ownership (TCO) for value-oriented slim laptops, as well as comm...

23 Apr 2026 | Thursday | NEWS
Syenta Secures $26M to Tackle AI Chip Packaging Bottlenecks

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National Reconstruction Fund (NRF), with participation from existing investors Investible, Salus Ventures, Jelix Ventures and Wollemi Capital. This brings the company’s total funding to date to more tha...

23 Apr 2026 | Thursday | NEWS
Butterfly Network Appoints Dr. Arun Nagdev as Chief Medical Officer

Butterfly Network (NYSE: BFLY), a pioneer and leader in semiconductor-based ultrasound devices, programmable cloud software and AI, announced the appointment of Arun Nagdev, MD, as Chief Medical Officer – Point-of-Care Ultrasound (POCUS). In this role, Dr Nagdev will lead the global medical strategy for the Company’s core POCUS business, advancing clinical product validation, stre...

22 Apr 2026 | Wednesday | NEWS
AXT Announces $550 Million Public Offering of Common Stock

AXT, Inc. (NasdaqGS: AXTI) (“AXT” or the “Company”), a leading manufacturer of compound semiconductor wafer substrates, announced today the pricing of an underwritten public offering of 8,560,311 shares of common stock at a price to the public of $64.25 per share. The gross proceeds to the Company from the offering are expected to be approximately $550 million, before deduc...

22 Apr 2026 | Wednesday | NEWS
Magnachip Launches New MOSFETs for Smartphone Battery Protection

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of two new 8th-generation Ultra Low-Ron 12V low-voltage (LV) MOSFETs designed for high-performance smartphone battery protection circuits (PCMs). These new products target next-generation smartphones, where ultra-fast charging and energy efficiency are increasingly critical, and represent an expansion of M...

22 Apr 2026 | Wednesday | NEWS
Teledyne e2v Launches Caiman Module to Strengthen Position in Low-Light Imaging Market

Teledyne e2v, a global innovator of imaging solutions, announced the launch of the Caiman™ imaging module, a small, lightweight, low-power solution designed for demanding low-light applications. Built around the OnyxMax™ sensor, Caiman delivers high quantum efficiency, high spatial resolution in the near-infrared spectral band, and low noise performance, prov...

22 Apr 2026 | Wednesday | NEWS
RoboSense Unveils SPAD-SoC Breakthrough to Lead Next Phase of LiDAR Commercialisation

RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary...

22 Apr 2026 | Wednesday | NEWS
DEEPX and Hyundai Motor Group Forge Strategic Partnership to Commercialise Next-Gen Robotics AI

DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to jointly develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic sy...

22 Apr 2026 | Wednesday | NEWS
Roundhill Memory ETF (DRAM) Crosses $1 Billion Milestone Shortly After Launch

Roundhill Investments, an ETF sponsor focused on innovative financial products, announced that the Roundhill Memory ETF (Cboe BZX: DRAM) has surpassed $1 billion in assets under management (AUM) only 10 trading days after its April 2, 2026, launch.² DRAM is the first U.S.-listed ETF to offer targeted exposure to global memory semiconductor companies and has emerged as the most successful ETF...

21 Apr 2026 | Tuesday | NEWS
InPHRED Expands into Data Centre Optical Interconnect Market

InPHRED, a developer of next-generation photonics solutions for consumer sensing and digital health, announced its formal expansion into the data centre optical interconnect market, extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure. As demand for AI infrastructure surges and hyperscalers push for higher bandwidth density, lower power co...

21 Apr 2026 | Tuesday | NEWS
LG Innotek Wins Major Automotive Wi-Fi 7 Deal to Accelerate Connected Car Strategy

LG Innotek (CEO Moon Hyuksoo) announced this month that it will supply its Automotive Wi-Fi 7 Communication Module, featuring cutting-edge Wi-Fi technology, to a leading European automotive parts company. The order is worth approximately USD 68M. Mass production of the module will begin in 2027. LG Innotek's Automotive Wi-Fi 7 Communication Module will be integrated into Audio, Video, and Navigat...

21 Apr 2026 | Tuesday | NEWS
Mitate Zepto Technica, Inc. Partners in National AI Semiconductor Initiative to Advance Genome Analysis

Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST). MZT participates as a designated social implementation and commercialisation partner for the research theme "Accelerating ...

21 Apr 2026 | Tuesday | NEWS
SK hynix Inc. Begins Mass Production of 192GB SOCAMM2 for AI Servers

SK hynix Inc. (or "the company", www.skhynix.com) announced that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM. SOCAMM2[1] is a module that adapts low-power memory – previously used mainly in mobile products like smartphones - for server ...

21 Apr 2026 | Tuesday | NEWS
Global AMOLED Display Market Faces 7% Contraction in 2026, Says Omdia

AMOLED smartphone display shipments are expected to decline sharply in 2026 amid rising memory prices and increasing market uncertainty, according to Omdia’s latest OLED Display Market Tracker. A surge in memory prices since the second half of 2025 has significantly increased component costs for smartphones, putting pressure on pricing for new models in 2026. Chinese smartphone brands,...

21 Apr 2026 | Tuesday | NEWS
Cirrus Logic Expands Industrial Portfolio with New Imaging IC Family

Cirrus Logic (NASDAQ: CRUS) announced the launch of a new family of industrial imaging integrated circuits (ICs) designed for high-precision scanning systems. This expands Cirrus Logic’s industrial portfolio and delivers a high-performance, highly integrated analogue front-end solution for multi-function printers, scanners, and advanced industrial imaging platforms. Designed for applic...

20 Apr 2026 | Monday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches SmartMCD Motor Control Device for Automotive Electrification

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has begun shipping engineering samples of “TB9M030FG,” the latest addition to its “SmartMCD™”[1] series of motor control devices. The new device integrates a microcontroller (MCU) and a motor driver, and incorporates sensorless control technology for low‑speed operation of three...

20 Apr 2026 | Monday | NEWS

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