• Tuesday | 12 May 2026
Renesas Electronics Corporation Unveils 3nm TCAM for Automotive and High-Speed Networks

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International So...

20 Feb 2026 | Friday | NEWS
Aitech and Teledyne e2v Semiconductors Partner to Advance Space-Grade AI Computing

Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductors are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC). Designed for deployment in LEO, GEO, lunar, and deep space missions, t...

19 Feb 2026 | Thursday | NEWS
Lattice Semiconductor Launches Cyber Resilience Kit to Strengthen Industrial Edge Security

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiP...

19 Feb 2026 | Thursday | NEWS
Keysight Technologies, Inc. Launches 3D Interconnect Designer to Accelerate AI Chip and Chiplet Development

Keysight Technologies, Inc. (NYSE: KEYS) introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face compl...

19 Feb 2026 | Thursday | NEWS
Efinix, Inc. Appoints Semiconductor Veteran BC Ooi to Board to Support Edge AI Growth

Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced that Boon Chye (BC) Ooi has joined its Board of Directors. Ooi, a semiconductor industry veteran with more than 45 years of operational leadership experience, will provide strategic guidance as Efinix scales its business and expands its market presence in FPGA and edge AI applications. Ooi brings unparalleled expertise...

19 Feb 2026 | Thursday | NEWS
ChipAgents Raises $50 Million to Scale AI Platform for Semiconductor Design

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. ...

19 Feb 2026 | Thursday | NEWS
Lam Research Corp. Opens New Boise Office to Strengthen U.S. Memory Chip Manufacturing

 Lam Research Corp. (NASDAQ: LRCX) commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders. The new office will initially support approximately 150 Lam personnel from the greater Boise area focused on collaborative research, devel...

19 Feb 2026 | Thursday | NEWS
Ambiq Micro, Inc. Launches Open-Source AI Development Kit to Accelerate Edge Audio Innovation

Ambiq Micro, Inc. (“Ambiq®”)— Ambiq, a leader in ultra-low-power semiconductor solutions, announced soundKIT, its fourth open-source AI Development Kit (ADK), designed to accelerate the adoption of always-on, real-time, on-device audio and speech intelligence for power-constrained edge devices. Built for Ambiq’s ultra-low-power system-on-chips (SoCs), soundKIT ena...

18 Feb 2026 | Wednesday | NEWS
TOTO Ltd. Faces Pressure from Palliser Capital to Unlock $3.6 Billion Shareholder Value

Palliser Capital (“Palliser”), a top 20 shareholder of TOTO Ltd. (“TOTO”), today published a comprehensive presentation outlining the opportunities available to unlock significant value at TOTO. To promote market transparency and respond to growing interest from shareholders and other stakeholders, Palliser has made public a detailed presentation titled “Maximizing th...

18 Feb 2026 | Wednesday | NEWS
Wolfspeed, Inc. Appoints Stefan Steyerl to Lead EMEA Sales and Expand Market Growth

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology and manufacturing, announced the appointment of Stefan Steyerl as vice president of sales, EMEA. Effective March 1, 2026, Steyerl will develop and execute Wolfspeed’s regional sales strategy, driving adoption of silicon carbide solutions across automotive, industrial, and energy markets as Wolfspeed accelerates the a...

18 Feb 2026 | Wednesday | NEWS
GlobalFoundries and Renesas Electronics Corporation Sign Multi-Billion-Dollar Chip Manufacturing Partnership

GlobalFoundries (Nasdaq: GFS) (GF) and Renesas Electronics Corporation (TSE: 6723) (Renesas)  announced an expanded strategic collaboration through a multi‑billion-dollar manufacturing partnership that broadens Renesas' access to GF technologies including its differentiated technology platforms. This agreement reflects a shared commitment to secure, resilient supply chains and aligns with U...

18 Feb 2026 | Wednesday | NEWS
Mouser Electronics Showcases Latest Semiconductor Solutions at DesignCon 2026

Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, invites electronic design engineers to visit its exhibit at DesignCon 2026, February 24 – 26, at the Santa Clara Convention Center in Santa Clara, California. Mouser representatives will be at Booth 1139 in the exhibit hall to present the newest and widest selection of semiconductors and t...

18 Feb 2026 | Wednesday | NEWS
Ceva, Inc. Reports Breakthrough Year as AI Licensing Surpasses 20% of Revenue

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the smart edge, announced that 2025 marked a breakthrough year for its artificial intelligence ("AI") licensing business, with 10 NeuPro™ neural processing unit ("NPU") agreements signed and with AI contributing more than 20% of annual licensing revenue in 2025. As AI expands beyond the cloud into real-...

18 Feb 2026 | Wednesday | NEWS
Microchip Technology Sees Demand Recovery as Semiconductor Orders Exceed Shipments

Microchip Technology has reported signs of strengthening demand as semiconductor distribution channels return to more balanced levels, enabling the company to prioritise debt reduction and improve its financial position. According to company leadership, customer orders have begun to exceed shipments, signalling a gradual recovery in market activity and renewed customer confidence. The company exp...

17 Feb 2026 | Tuesday | NEWS
European Union Invests €700 Million in NanoIC Pilot Line to Strengthen Semiconductor Independence

The European Union has committed €700 million to support a new pilot line dedicated to nano-integrated circuit (NanoIC) technologies, marking a major step in strengthening Europe’s semiconductor capabilities. The investment forms part of the EU’s wider Chips Act initiative, which seeks to reinforce the region’s technological independence and competitiveness in the global chi...

17 Feb 2026 | Tuesday | NEWS
Texas Instruments Launches New Automotive Chips to Support Autonomous Driving and Vehicle Safety

Texas Instruments has introduced a new range of automotive semiconductor solutions designed to enhance vehicle safety and enable higher levels of driving automation. The latest portfolio reflects the company’s ongoing efforts to support the automotive industry’s transition towards more intelligent, connected and software-defined vehicles. A key component of the annou...

17 Feb 2026 | Tuesday | NEWS
IObundle Launches Open-Source Ethernet IP Core to Accelerate Industrial Chip Development

Portugal-based semiconductor IP company IObundle has unveiled IOb-Eth, a professional-grade open-source Ethernet IP core developed to meet the demands of industrial applications. Released under the permissive MIT licence, the solution enables unrestricted commercial use and offers organisations a modern alternative to legacy Ethernet IP designs. The IOb-Eth core has been rebuilt using contemporar...

17 Feb 2026 | Tuesday | NEWS
SkyWater Technology Appoints Christine Dunbar to Lead Sales and Drive Foundry Expansion

SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based pure-play semiconductor foundry, announced the appointment of Christine Dunbar as senior vice president of sales and solutions engineering, reporting directly to President and COO John Sakamoto. In her role, Dunbar will focus on accelerating customer acquisition and scaling growth across the company’s core platforms....

17 Feb 2026 | Tuesday | NEWS
15 Major Tech Companies Partner to Strengthen Global Trust in AI and Cloud Technologies

Munich Security Conference, 15 companies from Africa, Asia, Europe, and North America announced the launch of the Trusted Tech Alliance (TTA), a group of likeminded global technology providers coming together to work across borders, and based on a shared set of principles for a trusted technology stack – from connectivity, cloud infrastructure, and semiconductors to software and AI. &nb...

17 Feb 2026 | Tuesday | NEWS
ITRI Starts Work on New Semiconductor Research Centre

The Industrial Technology Research Institute (ITRI) has commenced construction of a new advanced semiconductor research and development facility in Hsinchu County, Taiwan. The project represents a total investment of NT$3.772 billion and is scheduled for completion by December 2027, with phased operations expected to begin in the first quarter of 2028. The ground-breaking ceremony was attended by...

13 Feb 2026 | Friday | NEWS

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