• Tuesday | 12 May 2026
KIOXIA America, Inc. Begins Shipping UFS 5.0 Evaluation Samples

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2. UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equip...

25 Feb 2026 | Wednesday | NEWS
proteanTecs and Gubo Technologies Partner to Enhance AI Chip Visibility

proteanTecs®, a leading provider of deep data health and performance monitoring solutions for advanced electronics, and Gubo Technologies Co., Ltd., China’s first post silicon workflow automation solution provider, today announced a collaboration to deliver combined semiconductor analytics solutions. The collaboration is intended to provide broad, actionable insights into yield, quality,...

25 Feb 2026 | Wednesday | NEWS
Fractilia Secures First Production Deployment of FAME 300 System

Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...

25 Feb 2026 | Wednesday | NEWS
Vanguard Group Inc. Increases Stake in Lattice Semiconductor Corporation

Vanguard Group Inc. has boosted its holdings in Lattice Semiconductor Corporation, purchasing an additional 189,147 shares of the company. The transaction reflects continued institutional interest in the US-based developer of low-power field-programmable gate array (FPGA) technology. The latest filing reveals that Vanguard acquired the shares at prevailing market prices during the reporting perio...

24 Feb 2026 | Tuesday | NEWS
Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS
Powerchip Semiconductor Manufacturing Company Partners with Intel and SoftBank to Develop AI Memory Alternative

Powerchip Semiconductor Manufacturing Company (PSMC) has joined forces with major technology players, including Intel and SoftBank, in a collaborative effort to develop an alternative memory solution to high-bandwidth memory (HBM) for artificial intelligence applications. The initiative aims to reduce reliance on existing memory technologies and strengthen supply chain resilience for next-generati...

24 Feb 2026 | Tuesday | NEWS
Meta Expands AI Data Center Infrastructure with NVIDIA Technology

Meta is significantly increasing its investment in artificial intelligence infrastructure by deploying a new generation of data centre systems powered by NVIDIA technologies. The expanded collaboration aims to support Meta’s advanced AI workloads and to enhance the performance and efficiency of its underlying compute platforms. The social media and technology company has continued to adopt ...

24 Feb 2026 | Tuesday | NEWS
SEALSQ Corp Expands Quantum Strategy with New Investment in EeroQ

SEALSQ Corp has reinforced its quantum technology strategy through an additional strategic investment in US-based quantum hardware developer EeroQ. The move forms part of the company’s broader “Quantum Made in USA” initiative, aimed at accelerating domestic innovation and building secure, sovereign quantum computing capabilities. The follow-on investment, made via SEALSQ’s...

24 Feb 2026 | Tuesday | NEWS
INCERGO S.A. Expands Share Capital to Advance Merger with Visual Semiconductor Inc.

INCERGO S.A. (Symbol: ICG) announces that, effective February 19, 2026, its issued share capital has increased from 5,060,000 to 151,283,387 registered ordinary shares. The issuance of 146,223,387 new shares has been duly registered and is effective on the Vienna Stock Exchange as of today. The company announced further progress in its merger with Visual Semiconductor Inc. (VSI). The newly issued...

24 Feb 2026 | Tuesday | NEWS
SPIE and Cadence Design Systems, Inc. Establish Ya-Chieh Lai Memorial Scholarship

SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...

23 Feb 2026 | Monday | NEWS
Asahi Kasei Microdevices Corporation Thin-Film Hall Technology Earns Institute of Electrical and Electronics Engineers Milestone Recognition

Asahi Kasei Microdevices Corporation (AKM) has announced that its commercialization of thin-film Hall elements, initiated in 1983, has been recognized as an IEEE Milestone by the Institute of Electrical and Electronics Engineers (IEEE). The IEEE Milestone program honors historic achievements that represent groundbreaking innovations in electrical and electronic engineering. To be recognized, at le...

23 Feb 2026 | Monday | NEWS
Teledyne HiRel Semiconductors Launches Ultra-Low-Power 4 GHz Wideband LNA

Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5-volt supply. With a typical gain of 29 dB and a typical noise figure of 1.5 dB across 0.3–4...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS
Draper and Northeast Microelectronics Coalition Partner to Accelerate Lab-to-Fab Transitions

Draper and the Northeast Microelectronics Coalition (NEMC) announced that Draper will provide advisory services and support to startups and small companies within NEMC's membership to de-risk and accelerate lab-to-fab technology transition. The formal introduction will be made at the 2026 Microelectronics Commons Annual Meeting in Washington, D.C. These services build upon the NEMC's Po...

23 Feb 2026 | Monday | NEWS
AI Trading Agents Post 108% Gains in Semiconductor Rally

Tickeron has reported notable outperformance from its artificial intelligence trading agents focused on the semiconductor sector, with certain strategies generating returns exceeding 100 per cent. The results reflect heightened investor interest in chipmakers and equipment suppliers amid continued momentum in AI-driven technologies. According to the company, its AI-based trading models achieved s...

23 Feb 2026 | Monday | NEWS
Datasea Inc. Announces Ultrasonic Precision Control Breakthrough for Semiconductor Manufacturing

Datasea Inc. (NASDAQ: DTSS) ("Datasea" or the "Company"), a Nevada-based technology company specializing in acoustic high-tech solutions and 5G+AI multimodal digitalization, announced that it has achieved a foundational research breakthrough in its ultrasonic-enhanced nanoscale precision control technology, representing a step-change in the Company's technical architecture and under...

20 Feb 2026 | Friday | NEWS
EV Group Launches Next-Generation EVG120 Resist Processing System

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation EVG®120 automated resist processing system — a major update to one of the company's leading coater/developer platforms. Incorporating a new compact architecture, breakthrough capabilities, and des...

20 Feb 2026 | Friday | NEWS
Valens Semiconductor and MCNEX Launch QHD Automotive Cameras Using MIPI A-PHY Connectivity

MCNEX and Valens Semiconductor (NYSE: VLN) announced the joint development and availability of a new family of high–resolution front and rear automotive cameras that deliver QHD (2560×1440) video over unshielded twisted pair (UTP) or low-cost Coax channels, powered by Valens' VA7000 A–PHY chipsets. The cameras enable OEMs to significantly reduce the cost and complexity ...

20 Feb 2026 | Friday | NEWS
Chiplet Summit Announces 2026 Best of Show Winners Highlighting Packaging and Connectivity Innovation

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consort...

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Develops Next-Gen Automotive SoC Platform for Software-Defined Vehicles

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures....

20 Feb 2026 | Friday | NEWS

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