• Thursday | 14 May 2026
L Squared Launches Continuation Fund to Accelerate BTX Precision Growth

L Squared Capital Partners (“L Squared”) is pleased to announce the successful closing of a single-asset continuation fund for BTX Precision (“BTX” or the “Company”), a leading high-precision manufacturer of mission-critical components and assemblies. The platform’s unmatched breadth of additive and subtractive manufacturing capabilities – including ...

3 Apr 2026 | Friday | NEWS
Corning and Meta Expand Manufacturing to Support AI Infrastructure Growth

Corning and Meta have commenced construction on an expanded cable manufacturing facility in North Carolina to support the growing demand for artificial intelligence (AI) infrastructure. The project is part of a broader multi-year partnership between the two companies, under which Corning will provide advanced optical fibre, cable and connectivity solutions for Meta’s data centres. The agree...

3 Apr 2026 | Friday | NEWS
AMD Foundation Backs Semiconductor Talent Pipeline with New Investment

As the United States races to secure its semiconductor future, Last Mile Education Fund announces that the AMD Foundation has joined its Semiconductor Pathways Fund with a $500,000 philanthropic investment over the next three years. The Semiconductor Pathways Fund is a national industry coalition ensuring that the engineers and technicians already enrolled in STEM programs...

2 Apr 2026 | Thursday | NEWS
Molex Completes Landmark Acquisition of Smiths Interconnect

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in Molex's vision to enable technology that is transforming the future and improving people's lives. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities ...

2 Apr 2026 | Thursday | NEWS
IOWN Global Forum Showcases Open AI Networking Vision at OFC 2026

At OFC 2026, the Innovative Optical and Wireless Network Global Forum (IOWN Global Forum), comprised of over 180 member organisations, highlighted its vision for the future of open AI networking through an interactive booth and dedicated panel session. These platforms enabled the Forum to demonstrate the power of interoperable technologies and engage industry leaders on how collabor...

2 Apr 2026 | Thursday | NEWS
OMNIVISION and ATL Medical Partner to Accelerate Medical Imaging Solutions

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog, and display solutions, and ATL Medical, Inc., a designer, developer and manufacturer of innovative medical devices, announced that ATL is using the OVMed® OH0131 image signal processor (ISP) in its PREVOYANCE® Complete Imaging System with Chip-on-Tip® technolog...

2 Apr 2026 | Thursday | NEWS
Mount Hydrogen: A 3GW AI, Robotics and Semiconductor Campus Redefining US Tech Infrastructure

MacroValor Corporation and Favis Advanced Robotics announced plans for Mount Hydrogen, a 3,000-megawatt AI, robotics, and semiconductor mega campus to be developed in Austin, Texas. The facility will draw exclusively on MacroValor's natural hydrogen energy network to power continuous, zero-emission operations at a scale no The announcement comes as American technology companies face a conver...

1 May 2026 | Friday | NEWS
Pacific Defence Launches AI-Enabled DSP3100VP for Edge Intelligence Applications

Pacific Defence announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge. Built on the AMD Versal™ AI Edge Series Gen 2 adaptive SoC, the DSP3100VP combines heterogeneous compute, adaptive acceleration, and deterministic real-time control to meet th...

26 Mar 2026 | Thursday | NEWS
OKI Launches Comprehensive EMS for AI Server Manufacturing

OKI (TOKYO: 6703) will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to c...

26 Mar 2026 | Thursday | NEWS
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Siemens Launches Autonomous Artificial Intelligence Agent for Semiconductor Design Automation

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...

19 Mar 2026 | Thursday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...

17 Mar 2026 | Tuesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
New Phosphorus-Doped Diamond Semiconductor Targets High-Power Applications

"We thought there should be a way to fabricate N-type phosphorus-doped diamond semiconductors for high temperature and high power applications," said one of two inventors, from Cowan Heights, Calif., "so we invented the N-TYPE P D D SEMI CONDUCTOR. Our design would not have the same thermal and power handling limitations as existing silicon, gallium nitride and other N-type semiconductor subs...

13 Mar 2026 | Friday | NEWS
SK keyfoundry Develops SiC Planar MOSFET Process Platform

SK KeyFoundry, an 8-inch pure-play foundry in Korea, announced that it has recently completed the development of its SiC (Silicon Carbide) Planar MOSFET process platform, which is gaining traction in the next-generation compound power semiconductor market. The company also revealed that it has secured an order for the development of a 1200V SiC MOSFET product from a new customer, marking its full-...

13 Mar 2026 | Friday | NEWS
Amber Semiconductor Raises $30m Series C to Advance AI Data Centre Power Technology

Amber Semiconductor, a fabless semiconductor company pioneering the next generation power management for AI data centres, announced the initial closing of its $30 million Series C financing round from new and existing investors.   The funding will be used to scale product development, expand customer engagements, and accelerate the commercialisation of Amber's breakthrough vertical powe...

13 Mar 2026 | Friday | NEWS
IBM and Lam Research Partner on Sub-1nm Logic Scaling

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and high-NA EUV lithography processes to advance IBM's logic scaling ro...

12 Mar 2026 | Thursday | NEWS
Gateworks Corporation Expands Catalina SBC Family with NXP Semiconductors i.MX 95 Processor

Gateworks Corporation, a leader in industrial embedded technology, announced the expansion of its Catalina Single Board Computer (SBC) family. Engineered around the high-performance NXP® Semiconductors i.MX 95 applications processor, the Catalina platform is designed to bring transformative Edge AI, machine vision and autonomous capabilities to the harshest industrial environments. NXP w...

12 Mar 2026 | Thursday | NEWS

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