• Monday | 09 November 2026
SUSS Expands into Wafer Cleaning with GreenTec Solutions and 2027 Manufacturing Roadmap

As advanced packaging and semiconductor manufacturing become increasingly complex, demand for efficient, sustainable wafer-cleaning technologies is growing. SUSS is entering this market with GreenTec Solutions, expanding its photomask cleaning expertise into wafer-level applications. Semicon Leaders Asia speaks with Yuta Nagai, Senior Vice President, Photomask Solutions at SUSS, about the company'...

22 Oct 2026 | Thursday | Interaction
Rocket One Partners with Virginia Commonwealth University to Develop Energy-Efficient Magnetic Computing Devices

Rocket One Inc. ("Rocket One" or the "Company") announced a sponsored research agreement with Virginia Commonwealth University ("VCU") to develop and demonstrate magnetic computing devices targeting a critical challenge in artificial intelligence: delivering greater computational capability while reducing energy consumption. The agreement establishes a one-year fabrication and testing progra...

21 Oct 2026 | Wednesday | NEWS
Axcelis Invests $35 Million in New Semiconductor Equipment Manufacturing Facility in South Korea

Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced that it will officially break ground on its new ion implantation equipment manufacturing facility in Pyeongtaek, Gyeonggi Province, Korea. This $35 million investment reflects Axcelis' continued commitment to strengthening its high-volume manufacturing infr...

21 Oct 2026 | Wednesday | NEWS
The AI Chip Supply Chain in 2026: 10 Pinch Points, Ranked by How Long They Will Last

SEMICON LEADERS ASIA ANALYSIS | OCTOBER 2026 Key takeaways HBM is the most severe shortage of 2026, but not the most durable. Record memory capex should bring meaningful relief by 2028, even if supply does not fully normalise in 2027. Wafers, CoWoS-class packaging and liquid cooling are cyclical constraints. Committed capacity with visible start dates should ease them from the second half of ...

21 Oct 2026 | Wednesday | NEWS
xMEMS Begins Mass Production of Solid-State Cooling Chips for AI Devices and Data Centres

Marks the first large-scale commercialization of solid-state active cooling for Edge AI Extends xMEMS’ thermal management platform across AI glasses, AI smartphones and data center infrastructure First commercial products featuring XMC-2400 expected to reach market in early 2027 xMEMS Labs, Inc., the pioneer of the world's first solid-state MEMS speakers and breakthrough &mu...

21 Oct 2026 | Wednesday | NEWS
Sivers Semiconductors Secures First Production Orders for Automotive and Industrial LiDAR Lasers

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced that its strategic LiDAR customer has initiated production orders for its automotive and industrial sensing customers. Sivers will supply the continuous-wave distributed feedback (CW DFB) lasers and optical amplifiers powering the customer's LiDAR platforms, positioning the company to support g...

21 Oct 2026 | Wednesday | NEWS
EV Group Advances Co-Packaged Optics Manufacturing with Wafer Bonding and Nanoimprint Lithography

As demand for faster, more energy-efficient AI infrastructure grows, co-packaged optics (CPO) is creating new opportunities for Asia's semiconductor foundries, packaging providers and photonics manufacturers. However, scaling production requires advances in wafer bonding, materials integration and precision manufacturing. Semicon Leaders Asia speaks with Dr Bernd Dielacher, Director of Busine...

21 Oct 2026 | Wednesday | Interaction
Nordson SonoFlex Wins 2026 Best of West Award for Advanced Semiconductor Inspection

Nordson Test & Inspection has won the 2026 Best of West Award at SEMICON West for its SonoFlex Acoustic System, an automated inspection platform designed to improve defect identification and production throughput in small panel-based semiconductor assemblies. The award was announced on 15 October 2026 by SEMI and Semiconductor Digest during SEMICON West 2026, held at the Moscone Center in San...

20 Oct 2026 | Tuesday | NEWS
indie Semiconductor Wins In-Cabin Solution of the Year Award for Driver and Occupant Monitoring

indie Semiconductor (Nasdaq: INDI), an automotive solutions innovator, announced it has been awarded “In-Cabin Solution of the Year” by AutoTech Breakthrough, a leading market intelligence organization that recognizes the top companies, technologies and products in the global automotive and transportation markets. indie’s combined driver and occupant monitoring system (DMS/OMS) ...

20 Oct 2026 | Tuesday | NEWS
Saxony and Arizona Strengthen Semiconductor Industry Cooperation

Saxony and the U.S. state of Arizona intend to further expand their ties in the semiconductor industry. Saxony Trade & Invest Corp. (WFS) and the Arizona Commerce Authority (ACA) used SEMICON West, the leading US trade fair for the semiconductor industry, which took place in San Francisco to foster closer links between companies and institutions from both semiconductor regions and to explore f...

20 Oct 2026 | Tuesday | NEWS
PUFsecurity Secures OCP S.A.F.E. Approval for PUFrt Hardware Security Solution

PUFsecurity, a subsidiary of eMemory Technology, was spotlighted at Microsoft's Caliptra Workshop on October 12, the opening day of the sold-out 2026 OCP Global Summit. The workshop drew nearly 400 attendees. In his talk, "Caliptra Specification to Silicon Reality & a Turnkey Solution for Ecosystem Integrations," PUFsecurity Principal Security Architect Kent Chuang highlighted how PUFrt helps...

20 Oct 2026 | Tuesday | NEWS
OpenLight Eyes Volume Production as AI Demand Accelerates Silicon Photonics Adoption

As AI infrastructure drives demand for higher-bandwidth, power-efficient optical connectivity, the challenge for silicon photonics companies is shifting from technological innovation to commercial-scale production. OpenLight is looking to capitalise on this transition through its heterogeneous silicon photonics platform, integrated laser technology and roadmap extending from 1.6T to 3.2T optical c...

20 Oct 2026 | Tuesday | Interaction
Wolfspeed and Infineon Expand Silicon Carbide Wafer Supply Agreement to Include 200mm Wafers

Wolfspeed, Inc (NYSE: WOLF), a global leader in silicon carbide technology, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced the expansion and extension of their existing long-term silicon carbide (SiC) wafer supply agreement. The expanded agreement adds 200 mm silicon carbide wafers to the existing 150 mm supply and builds on a supply relationship between the two companies spannin...

19 Oct 2026 | Monday | NEWS
FIC Global Opens Johor Manufacturing Facility for AI and Data Centre Technologies

PRO3C (Malaysia) Sdn. Bhd., a subsidiary of Taiwan-listed FIC Global Inc. (FICG, TWSE: 3701), officially celebrated the grand opening of its manufacturing facility located at i-Park @ Senai Airport City, Johor. The ceremony was officiated by Yang Berhormat Lee Ting Han, Johor State Executive Councillor. The event was also attended by distinguished government officials, representatives from J...

19 Oct 2026 | Monday | NEWS
Elektrobit and Microchip Partner to Simplify AUTOSAR Software Development

Elektrobit, a global expert in automotive software, and Microchip Technology Inc., a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a collaboration to simplify and accelerate AUTOSAR-based software development for automotive manufacturers and suppliers using Microchip automotive platforms. As the automotive industry move...

19 Oct 2026 | Monday | NEWS
Great Lakes Semiconductor Launches Modular Fab and Advanced Packaging Project

Great Lakes Semiconductor (GLS) has announced the first project under its Great American ChipForge platform, bringing together semiconductor design, flexible wafer manufacturing and advanced packaging technologies to support the development of intelligent sensor systems for vehicles. The project forms part of the company's Innovation Funnel initiative, which aims to move new semiconductor technol...

19 Oct 2026 | Monday | NEWS
Mach42 Appoints David Tester as Vice President of Engineering

Mach42 appoints David Tester, a semiconductor engineering leader with more than 30 years' experience, as Vice President of Engineering. The appointment comes as Mach42's engineering team doubles in size in 2026 and the company moves from product development to industry-wide adoption. Mach42's AI technology gives analog and mixed-signal designers dramatically broader verification coverage, work...

16 Oct 2026 | Friday | NEWS
Global X Launches Asia Semiconductor ETF Covering Key Regional Chip Markets

-Global X Management Company LLC (“Global X”), the New York-based provider of exchange-traded funds (ETFs), announced the launch of the Global X Asia Semiconductor ETF (ticker ACHP). ACHP (“the Fund”) seeks to invest in companies that are positioned to benefit from the growth and advancement of the Asian semiconductor ecosystem. This includes companies involved in semicond...

16 Oct 2026 | Friday | NEWS
Salience Labs Raises $125 Million to Scale Optical Switching for AI Data Centres

Salience Labs, a leader in photonic chips targeting connectivity for AI datacenter infrastructure, announced the successful completion of an oversubscribed $125 million Series B funding round. The round is led by Bullhound Capital, with Principal Callum Stewart joining the Salience Labs Board of Directors. Additional investor participation came from AMD Ventures, Intel Capital, SBI Group, Hudson R...

16 Oct 2026 | Friday | NEWS
ModelBest Launches MiniCPM-V 4.7 for On-Device Multimodal Computing

ModelBest and the OpenBMB community announced the release of MiniCPM-V 4.7, the latest addition to their open-source on-device multimodal model series. Available in 35B-A3B and 1B versions, the release brings advanced image, document and video understanding to edge devices with about 3GB of memory. ModelBest describes MiniCPM-V 4.7 35B-A3B as the first open-source MoE multimodal model built to ru...

16 Oct 2026 | Friday | NEWS

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