• Thursday | 26 March 2026
Pacific Defence Launches AI-Enabled DSP3100VP for Edge Intelligence Applications

Pacific Defence announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge. Built on the AMD Versal™ AI Edge Series Gen 2 adaptive SoC, the DSP3100VP combines heterogeneous compute, adaptive acceleration, and deterministic real-time control to meet th...

26 Mar 2026 | Thursday | NEWS
OKI Launches Comprehensive EMS for AI Server Manufacturing

OKI (TOKYO: 6703) will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to c...

26 Mar 2026 | Thursday | NEWS
HyperLight Corporation Launches 400G-per-Lane Photonic Integrated Circuits for Artificial Intelligence Networking

HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...

20 Mar 2026 | Friday | NEWS
Siemens Launches Autonomous Artificial Intelligence Agent for Semiconductor Design Automation

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...

19 Mar 2026 | Thursday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...

17 Mar 2026 | Tuesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
KIOXIA America, Inc. Showcases AI-Optimised Flash and SSD Solutions at NVIDIA GTC 2026

Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...

17 Mar 2026 | Tuesday | NEWS
New Phosphorus-Doped Diamond Semiconductor Targets High-Power Applications

"We thought there should be a way to fabricate N-type phosphorus-doped diamond semiconductors for high temperature and high power applications," said one of two inventors, from Cowan Heights, Calif., "so we invented the N-TYPE P D D SEMI CONDUCTOR. Our design would not have the same thermal and power handling limitations as existing silicon, gallium nitride and other N-type semiconductor subs...

13 Mar 2026 | Friday | NEWS
SK keyfoundry Develops SiC Planar MOSFET Process Platform

SK KeyFoundry, an 8-inch pure-play foundry in Korea, announced that it has recently completed the development of its SiC (Silicon Carbide) Planar MOSFET process platform, which is gaining traction in the next-generation compound power semiconductor market. The company also revealed that it has secured an order for the development of a 1200V SiC MOSFET product from a new customer, marking its full-...

13 Mar 2026 | Friday | NEWS
Amber Semiconductor Raises $30m Series C to Advance AI Data Centre Power Technology

Amber Semiconductor, a fabless semiconductor company pioneering the next generation power management for AI data centres, announced the initial closing of its $30 million Series C financing round from new and existing investors.   The funding will be used to scale product development, expand customer engagements, and accelerate the commercialisation of Amber's breakthrough vertical powe...

13 Mar 2026 | Friday | NEWS
IBM and Lam Research Partner on Sub-1nm Logic Scaling

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and high-NA EUV lithography processes to advance IBM's logic scaling ro...

12 Mar 2026 | Thursday | NEWS
Gateworks Corporation Expands Catalina SBC Family with NXP Semiconductors i.MX 95 Processor

Gateworks Corporation, a leader in industrial embedded technology, announced the expansion of its Catalina Single Board Computer (SBC) family. Engineered around the high-performance NXP® Semiconductors i.MX 95 applications processor, the Catalina platform is designed to bring transformative Edge AI, machine vision and autonomous capabilities to the harshest industrial environments. NXP w...

12 Mar 2026 | Thursday | NEWS
Nanopower Semiconductor Begins Volume Production of nPZero Power-Saving IC

Nanopower Semiconductor, a European fabless semiconductor manufacturer, announces that its award-winning nPZero power-saving integrated circuit (PSIC) is now in volume production, enabling original equipment manufacturers (OEMs) to move from evaluation to high-volume deployment in power-constrained Internet of Things (IoT) products. Nanopower's nPZero is a power-saving integrated circuit (PSIC) de...

12 Mar 2026 | Thursday | NEWS
Nordic Semiconductor Launches Fuel Gauge v2.0 for IoT Battery Management

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces Nordic Fuel Gauge v2.0, a major upgrade of its highly accurate software-based fuel gauge solution for the award-winning nPM1300 and nPM1304 Power Management ICS, at Embedded World 2026. The release adds sophisticated State-of-Health estimation, adaptive battery modelling, and long-term fleet analytics cap...

12 Mar 2026 | Thursday | NEWS
ISLE 2026 Highlights Nanchang’s Optoelectronic Industry Cluster

ISLE 2026, Asia's largest exhibition for smart display and integrated systems, held in Shenzhen World Exhibition & Convention Centre (Shenzhen World) from March 5-7, demonstrated more than thousands of new products and solutions for diverse application scenarios in display and AV integration. In this year's ISLE, the Nanchang Optoelectronic Industry Cluster made a collective appearance u...

12 Mar 2026 | Thursday | NEWS
Texas Instruments Introduces Edge AI Microcontrollers with Integrated NPU

Texas Instruments (TI) (Nasdaq: TXN) introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate TI's TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimises deep l...

12 Mar 2026 | Thursday | NEWS
Semtech Corporation, Digital Barriers Partner on AI Video Compression for Cellular Surveillance

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a partnership with Digital Barriers to deliver a fully integrated device-to-cloud cellular video solution, Semtech Video Compression, purpose-built for critical video surveillance and analytics. The turnkey solution int...

11 Mar 2026 | Wednesday | NEWS
Everspin Technologies Qualifies 64Mb xSPI STT-MRAM for High-Reliability Applications

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced continued progress across its high-reliability (HR) PERSYST xSPI STT-MRAM portfolio, including the completion of full production qualification for its 64Mb MRAM and the expansion of the family to a new 256M...

6 Mar 2026 | Friday | NEWS
Rambus Inc. Launches Industry-Leading HBM4E Memory Controller IP for AI Accelerators

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, announced the industry’s leading HBM4E Memory Controller IP, extending its market leadership in HBM IP. This new solution delivers breakthrough performance with advanced reliability features, enabling designers to address the demanding memory bandwidth requirements of next-gen...

6 Mar 2026 | Friday | NEWS

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