• Wednesday | 13 May 2026
Samsung Electronics Standardises Global Software Development on Oracle Java SE Universal Subscription

Oracle announced that the Oracle Java SE Universal Subscription will help standardise global software development at Samsung Electronics, a world leader in advanced semiconductor technology. With the Oracle Java SE Universal Subscription, Samsung can simplify IT operations and strengthen security by consolidating its global internal application development on Oracle Java. To continue to expa...

13 May 2026 | Wednesday | NEWS
Kingston Digital, Inc. Surpasses 100 Million Shipments of A400 SATA SSD

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has shipped more than 100 million units of the Kingston A400 SATA solid-state drive. Launched in 2017, the Kingston A400 quickly gained recognition for its impressive performance in terms of booting, loading, and transferr...

13 May 2026 | Wednesday | NEWS
Cyient Semiconductors Private Limited Launches First GaN Power IC Portfolio for India in Partnership with Navitas Semiconductor

Cyient Semiconductors Private Limited announced the launch of seven new gallium nitride (GaN) power devices for the Indian market, developed using Navitas Semiconductor's (Nasdaq: NVTS) industry-leading GaN technology.   The launch marks Cyient Semiconductors' first commercial GaN product family and a major milestone in advancing India's domestic power semiconductor ecosystem. The new p...

12 May 2026 | Tuesday | NEWS
Infineon Technologies AG Launches Global Startup Challenge to Accelerate Humanoid Robotics Innovation

Infineon's Startup Challenge brings together promising founder teams and young high-tech companies from across the globe to work jointly on a highly relevant topic: humanoid robotics. The Challenge is a structured innovation program designed to develop technological concepts into market-ready applications. It is part of Infineon's global Co–Innovation Program, in which Infineon drives innova...

12 May 2026 | Tuesday | NEWS
Ceva Secures Major Bluetooth HDT Design Win with Integrated RF Platform

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a major customer win for its Bluetooth® High Data Throughput (HDT) solution, including Ceva's internally developed RF technology, a significant commercial milestone validating the company's strategy to expand its wireless offering and deliver comprehensive, system-level solutions to it...

12 May 2026 | Tuesday | NEWS
SEMIFIVE and FotoNation Partner on Ultra-Low-Power Edge AI SoCs

FotoNation Ltd., a European-based Perception-Recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE will lead turnkey development for TriSilica, FotoNation's ultra-low-power perceptual AI chip family. TriSilica is an ultra-low-power, compact-footprint perceptual AI silicon pla...

12 May 2026 | Tuesday | NEWS
MICROIP Positions Poland as Strategic Edge AI Hub at Europe-Taiwan Forum

 At the 2026 European Economic Congress (EEC 2026), MICROIP Chairman Dr James Yang participated in a high-level dialogue at the "Poland-Taiwan Economic Cooperation Forum." Joined by Ambassador Liu Yong-jian and HCG Vice Chairman Michael Chiu, Dr Yang advocated leveraging Taiwan's semiconductor prowess to propel Poland into a strategic hub for European Edge AI. Addressing the "Last Mile" of A...

12 May 2026 | Tuesday | NEWS
yieldWerx and WATS Partner to Unify Semiconductor and PCBA Test Analytics

Board-level and semiconductor test data are often analysed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments. yieldWerx and WATS announce a partners...

11 May 2026 | Monday | NEWS
Nota AI and Mobilint Partner to Accelerate Commercialisation of Edge AI Solutions

Nota AI (CEO Myung-su Chae), a specialist in AI model compression and optimisation, announced that it has signed an agreement with Mobilint, a high-performance AI semiconductor (NPU) company, to supply AI optimisation technology and establish a strategic partnership. This agreement was pursued to combine Nota AI's proprietary AI model compression and optimisation software capabilities with M...

11 May 2026 | Monday | NEWS
SEMIFIVE and ICY Tech Achieve 8nm eMRAM Edge AI SoC Tape-Out with Samsung Foundry

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, announced the successful tape-out of next-generation Edge AI SoC jointly developed utilising Samsung Foundry's 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. This marks a significant milestone toward the first commercial deployment of 8...

11 May 2026 | Monday | NEWS
TuringEra Expands Central Asia Push with AI Appliance Launches and Kazakhstan Partnerships

TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio at GITEX AI Kazakhstan 2026, the company solidified its Central Asian expansion through strategic dialogues with regional industrial leaders and stakeholders...

11 May 2026 | Monday | NEWS
Amtech Systems, Inc. Appoints Guy Shechter as President and COO to Drive AI Packaging Growth

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, announced the appointment of Mr Guy Shechter as the Company’s President and Chief Operating Officer, reporting to the Chief Executive Officer of the Company. “I am pleased to announce that Guy Shecter will be joining...

11 May 2026 | Monday | NEWS
Health Impact Alliance Partners with Infineon Technologies AG to Advance Connected Senior Care Solutions

The Health Impact Alliance (HIA) announced it has partnered with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, to develop advanced connectivity solutions for the rapidly growing senior care market. This collaboration leverages Infineon’s cutting-edge semiconductor technology to create a comprehensive ecosystem of connected healthcare devices. ...

11 May 2026 | Monday | NEWS
Charlene Wan of Ambiq Micro on Advancing Data-Efficient Edge AI with compressionKIT™

In this interview with Semicon Leaders Asia, Charlene Wan, VP of Corporate Marketing & IR at Ambiq Micro, highlights how compressionKIT™ is extending ultra-low-power AI beyond inference to fundamentally rethink how data is captured, stored, and utilised at the edge. By enabling intelligent AI-based compression for continuous sensor streams, the platform helps developers reduce transmissi...

8 May 2026 | Friday | Interaction
Liftr Insights Launches Predictive AI Scorecard for Hedge Funds and Semiconductor Markets

Liftr Insights announces the release of the Liftr® Indicator Scorecard™, a next-generation market intelligence index. This unique tool will fundamentally change how hedge funds and financial services firms identify, evaluate, and act on emerging signals across semiconductors, cloud providers, and AI infrastructure. The Indicator Scorecard introduces a scoring-based framew...

8 May 2026 | Friday | NEWS
SPARK Microsystems Wins Semiconductor Innovation Award for LE-UWB Transceiver

SPARK Microsystems, a Canadian fabless semiconductor company specialising in next-generation short-range wireless communications, announced that its SR1120 LE-UWB™ wireless transceiver has been honoured as a recipient of the Product Innovation Award in conjunction with the Semiconductor Achievement Awards hosted by Canada's Semiconductor Council (CSC). Presented last night at the&...

8 May 2026 | Friday | NEWS
Gemtek Technology Company Ltd Launches 1.6T AiPhoton OSFP Transceiver for AI Data Centres

Gemtek Technology Company Ltd, a global leader in advanced networking solutions, announced the AiPhoton 1.6T OSFP transceiver. Built in collaboration with NewPhotonics®, a pioneer in photonic integrated circuits, the module features the NPG10204 DR8 PIC transmitter-on-chip. This latest PIC-based pluggable enables simplified manufacturing of photonic ICs delivering advanced DSP functionality in...

7 May 2026 | Thursday | NEWS
UST Acquires Taciti to Strengthen SAP Transformation Capabilities

UST, a leading AI and technology transformation solutions company, has acquired Taciti Consulting, a boutique SAP Silver Partner specialising in strategic, large-scale ERP transformation projects. This strategic move will boost UST’s presence in highly complex fields where Taciti has established itself as a leading global provider of bespoke ERP solutions, including Hi-Tech, semiconduct...

6 May 2026 | Wednesday | NEWS
GigaDevice Showcases MCU Solutions for Smart Appliances

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, will showcase its latest MCU-based smart appliance solutions for consumer and edge IoT applications at Sensors Converge 2026 At the show, GigaDevice will present a series of live demonstrations with a focus on complete system-level designs for...

5 May 2026 | Tuesday | NEWS
Intel Strengthens Leadership to Drive AI and Innovation

Intel Corporation (NASDAQ: INTC) announced two key leadership appointments to strengthen its core product business and advance the company’s innovation agenda. Alex Katouzian Appointed to Lead Client Computing & Physical AI Group Alex Katouzian will join Intel as executive vice president and general manager of the Client Computing and Physical AI Group. In this role, Katouzian will ali...

5 May 2026 | Tuesday | NEWS

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