Fabric8Labs, the company pioneering Electrochemical Additive Manufacturing, announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronic...
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...
New Framework outlines OIF’s vision for 448 Gbps interconnects, setting the stage for future Implementation Agreements that will power AI, HPC and communications systems OIF convened its Q4 2025 Technical and MA&E Committees Meeting in Busan, South Korea, Nov. 3–7, where global members gathered to advance the organization’s work across optical, electrical, manage...
400G/Lane, TFLN modulator-based innovation to play a key role in the future of computing POET Technologies Inc.a leader in the design and implementation of highly-integrated optical engines and light sources for artificial intelligence networks, and Quantum Computing Inc. (QCi) (NASDAQ: QUBT), an innovative integrated photonics and quantum optics technology company, today an...
New platform provides a Kubernetes-native foundation for running AI workloads on NVIDIA AI infrastructure, combining advanced isolation, dynamic scaling, and hybrid networking. (KubeCon + CloudNativeCon North America 2025, ) —vCluster Labs, the company pioneering Kubernetes virtualization, today announced its Infrastructure Tenancy Platform for AI to help organizations build and...
New Mini-QD connector enables use of next-generation optical pluggable modules; UQD v2 specification enforces greater precision As AI workloads push thermal limits in data centers higher than ever, Stäubli is leading a new phase of standardization in liquid-cooling technology designed for the next generation of high-performance computing. At the Open Compute Project (O...
Distributed Rendering Solution Unlocks a New Visual Experience with Low Power Consumption and High Image Quality Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of visual processing solutions, announced that it offers an advanced distributed rendering solution for the R1 gaming chip equipped in the realme GT8 series smartphones. By integrating ultra-low latency MotionEngi...
INNIO Group has signed a contract with KMW (Kraftwerke Mainz-Wiesbaden AG) for a new 54-MW peaking power plant. A total of twelve modular energy systems from INNIO are intended to be operated at the site. Part of the plant’s capacity is expected to be available for the “Green Rocks” data center, which is being built by KMW and Norwegian data center operator Green Mountain. INNIO&...
Strengthening strategic cooperation for next-generation semiconductor package core material 'Glass Core' Aiming to lead the glass substrate market by combining strengths in preparation for the AI era Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to establish a joint venture (JV) for man...
Strategic Collaboration Combines Sivers' Lasers With POET's Optical Interposer™ to Deliver Scalable, Energy-Efficient Light Sources Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced additional details on the strategic partnership with POET Technologies Inc. (NASDAQ: POET), a leader in the design and implementation of highly integr...
-Cornelis, a leading provider of intelligent, high-performance networking solutions, announced the successful qualification and integration of its CN5000 Omni-Path® networking solution across Lenovo’s ThinkSystem V3 and V4 servers. The CN5000 is now a fully supported networking fabric in Lenovo’s EveryScale Solution, empowering customers to deploy tightly integrated, high-perform...
Growth in 300 mm Shipments Fueled by AI to Support Advanced Logic, Cloud Computing and Memory Applications The SEMI Silicon Manufacturers Group (SMG) reported , in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024. Sequent...
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a long-term partnership with Microchip Technology Inc. (NASDAQ: MCHP), a broadline supplier of semiconductors committed to making innovative design easier through total system solutions. This collaboration will embed Ceva's NeuPro™ family of Neural Processing Units (NPUs) in Microchip's...
Jabil Inc. (NYSE: JBL) announced that it has signed a definitive agreement to acquire Hanley Energy Group, a provider of energy management and critical power solutions serving the data center infrastructure market, for approximately $725 million plus contingent consideration up to $58 million, subject to achieving future revenue thresholds, in an all-cash transaction. The transaction is expected...
-ANAFLASH, an edge AI processor startup, has developed an AI MCU with its proprietary standard logic compatible embedded flash technology using Samsung Foundry’s 28 nm process. This breakthrough enables the integration of zero-standby-power weight memory based on ANAFLASH’s Logic-EFLASH technology, utilizing only standard logic devices. The result is a cost-effective and energy-effic...
The new high-capacity, high-performance storage is purpose-built for the demands of modern AI-enabled surveillance systems Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced S300 AI, a new generation of surveillance hard disk drives (HDDs) engineered for the requirements of modern artificial intelligence (AI) driven video applications. Purpose-built for high...
-Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced platform integrates artificial intelligence (AI) to enable faster design iterations, optimize chip-package interaction (CPI) analysis, and accelerate time-to-market for complex A...
Global technology corporation FPT has entered a strategic partnership with LAPI ITB, a consulting and professional services provider owned by Institut Teknologi Bandung (ITB), and digital transformation consulting firm Digital Utama Lestari (DUL) to jointly accelerate Indonesia’s National Digital Transformation agenda for a competitive digital economy through joint innovation, technology d...
-Palladyne AI Corp. (NASDAQ: PDYN and PDYNW) (“Palladyne AI”), a developer of artificial intelligence software for robotic platforms in the defense and commercial sectors, announced that the United States Patent and Trademark Office has issued the Company U.S. Patent No. 12,452,957 B2, titled “Closed Loop Tasking and Control of Heterogeneous Sensor Networks.” The patent p...
Nvidia Corporation has entered into a landmark agreement with several of South Korea’s largest technology and manufacturing companies to co-develop and supply AI-optimised semiconductor systems, signalling an accelerated regional expansion for the world’s leading AI-chipmaker. The partnership underscores Nvidia’s strategic intent to anchor itself more firmly in the Asi...