Rigaku Introduces ONYX™ 3200 for High-Precision Semiconductor Bump and BEOL Metrology
Single-platform solution combines 3D confocal scanning and advanced X-ray analysis to measure ultra-fine metal layers and interconnect structures
Rigaku Corporation, a global partner in X-ray analytical systems solutions and a Rigaku Holdings Corporation company (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), announced the launch of the ONYX 3200, a new semiconductor metrology system for measuring the thickness, composition, and bump structures* in wafer-level processes. The system is designed to help manufacturers stabilize quality and increase yield in back-end-of-line (BEOL) and semiconductor chip packaging processes.
Due to the increasing demands for AI, high-performance computing, data centers, mobile devices, and other devices, the wiring and interconnection structures of chips have become increasingly delicate and complex. Consequently, the ability to accurately and without damage measure metallic layers thinner than a human hair and protrusions less than 10 µm, especially in BEOL and encapsulation processes, has become crucial, since reliability and uniformity directly influence the final performance of the device.
The ONYX 3200 meets these requirements and offers another significant advantage: it allows the measurement of complex metal layers in bumps, something that previously required multiple instruments, using a single platform.
* Microscopic raised metal regions used to connect semiconductor chips to printed circuit boards.
Features of the ONYX 3200
High-precision metrology of protrusions using a 3D confocal scanner.
The ONYX 3200 can inspect the shape and height of microscopic protrusions and electroconductive metallic patterns in 3D with high precision. Protrusions consist of lower layers of copper, nickel, or similar materials beneath an upper layer of tin and silver. Conventional metrology methods result in absorption by the upper layer, making simultaneous measurement of the upper and lower layers impossible. The ONYX 3200 integrates an optical scanner to capture the overall shape and total height of the protrusion and a fluorescent X-ray detector, used to measure the thickness of the upper metallic layer. Subtracting these values allows for the precise calculation of the lower metallic layers, establishing a basis for ensuring the reliability of interconnections.
Original dual-head microfocus X-ray source.
The material ratio in a tin-to-silver (SnAg) component has a significant impact on the reliability of package connections. Rigaku has developed a unique and dedicated X-ray head capable of detecting silver contents as low as 2% in SnAg components with exceptional accuracy of 4 parts per 100,000, providing tight control of material ratios to optimize package yield. Furthermore, the dual-head architecture allows simultaneous measurements of a wide range of metallic features around chip interconnects, improving productivity and analytical flexibility.
Market Outlook
: Rigaku has already shipped an initial ONYX 3200 system to a major global foundry for deployment in an advanced packaging line and is currently receiving strong interest from leading semiconductor manufacturers worldwide. The company projects sales of 1.5 billion yen in 2026 with the ONYX 3200, with plans to double that to 3 billion yen in 2027 as adoption expands to packaging and BEOL applications.
