OpenLight has reported further progress in its collaboration with Suzhou TFC Optical Communication, aimed at advancing back-end integration and manufacturing processes for silicon photonics. The partnership reflects increasing industry demand for scalable optical solutions to support next-generation data infrastructure.
The companies have jointly developed a 400G test platform to evaluate high-speed electro-absorption modulator (EAM) performance. The solution combines a photonic integrated circuit with a high-speed driver on a through-glass-via (TGV)-based substrate, along with a fibre-attachment unit, creating a complete optical sub-assembly.
TFC has led the design and production of the sub-assembly, including advanced packaging and integration processes. This work highlights a more mature approach to assembling complex photonic systems, addressing key challenges in scaling silicon photonics for commercial use.
As demand rises across data centres, artificial intelligence and high-speed networking, the ability to deliver reliable, high-performance optical engines at scale has become increasingly critical. The collaboration has progressed from supporting 100G and 200G per-lane devices to enabling 400G performance, in line with growing bandwidth requirements.
From a commercial perspective, the joint effort strengthens the silicon photonics supply chain by providing a more integrated pathway from wafer fabrication to fully packaged optical engines. This is expected to reduce manufacturing complexity, enhance scalability and accelerate time-to-market for customers developing advanced optical communication systems.
Strategically, the partnership underscores the importance of robust back-end capabilities in driving the adoption of silicon photonics. By advancing packaging, assembly and integration technologies, OpenLight and TFC are positioning themselves to meet the evolving performance and scalability demands of next-generation optical networks.