SEMIFIVE and FotoNation Partner on Ultra-Low-Power Edge AI SoCs
The collaboration will see SEMIFIVE lead turnkey development of FotoNation’s TriSilica perceptual AI chip family, strengthening both companies’ position in the fast-growing multimodal edge AI and sensor-fusion market.
FotoNation Ltd., a European-based Perception-Recognition company, and SEMIFIVE Inc., a leading global provider of custom AI semiconductor solutions, today announced a strategic collaboration agreement under which SEMIFIVE will lead turnkey development for TriSilica, FotoNation's ultra-low-power perceptual AI chip family.
TriSilica is an ultra-low-power, compact-footprint perceptual AI silicon platform designed to support multimodal sensor inputs, including audio, mmWave, spectral, infrared, and RGB.
"FotoNation is a pioneer in in-device computational imaging solutions, and its Vision AI technology is redefining what is possible at the edge," said Brandon Cho, CEO and co-founder of SEMIFIVE. "We are excited to help bring FotoNation's sophisticated TriSense IP Core solutions into high-performance silicon. This partnership reinforces SEMIFIVE's technical leadership and serves as a strategic anchor for our expansion across the European semiconductor landscape."
The collaboration marks SEMIFIVE's first European deal, expanding its presence in the European market and building on its track record in the United States, China, Japan, and India. By leveraging its advanced semiconductor platforms, SEMIFIVE continues to strengthen its position as a global partner of choice for innovators seeking high-performance, custom AI ASIC solutions.
A decisive factor in securing this project was SEMIFIVE's expertise in high-complexity, low-power IC design and integrated packaging technologies, which the company has proactively developed.
"Our partnership with SEMIFIVE and its custom semiconductor capabilities will be a core driver for commercialising FotoNation's next-generation, ultra-high-performance, low-power sensor-fusion SoCs," said Petronel Bigioi, CEO of FotoNation. "We expect this collaboration to become a major turning point in advancing image processing and sensor-fusion technology to meet the demands of the rapidly growing edge AI market."
The initial product, the TS-210, is planned for a Multi-Project Wafer (MPW) shuttle scheduled for the end of this year. The target foundry process is Samsung Foundry's 8nm Low Power Ultimate (8LPU) process.
