Amtech Raises $60 Million to Expand Semiconductor Packaging and Wafer Substrate Business

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication, announced the closing of its oversubscribed underwritten public offering of 2,926,829 shares of common stock, at a public offering price of $20.50 per share, for total gross proceeds of $60 million before deducting underwriting discounts, commissions, and offering expenses. The closing of the offering occurred today, June 3, 2026. The Company intends to use the net proceeds from the offering to accelerate growth across its semiconductor packaging and advanced wafer substrate fabrication platforms, accretive merger and acquisition opportunities, working capital and general corporate purposes.

Titan Partners, a division of American Capital Partners, acted as the sole bookrunner for the offering.

The offering was made pursuant to a shelf registration statement on Form S-3 (File No. 333-294296) filed with the Securities and Exchange Commission (“SEC”) on March 13, 2026, and declared effective by the SEC on March 23, 2026. A prospectus supplement and accompanying prospectus relating to the offering are available on the SEC’s website at www.sec.gov. Copies of the prospectus supplement and accompanying prospectus relating to the offering may also be obtained by contacting Titan Partners Group LLC, a division of American Capital Partners, LLC, 4 World Trade Centre, 49th Floor, New York, NY 10007.

This press release shall not constitute an offer to sell or the solicitation of an offer to buy any securities, nor will there be any sale of these securities in any state or other jurisdiction in which such offer, solicitation or sale would be unlawful before registration or qualification under the securities laws of any such state or other jurisdiction.