Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications
The company expands its SoC portfolio with 3D, 2.5D, and 5.5D packaging solutions, achieving a key milestone by taping out a high-performance device using N3 and N5 dies in a face-to-face configuration—reducing latency and power while accelerating next-gen computing.
Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality solutions that accelerate innovation and success.
As a key milestone, Socionext has successfully taped out a complete packaged device leveraging TSMC's SoIC-X 3D stacking. The design combines an N3 compute die and an N5 I/O die in a face-to-face (F2F) configuration. The F2F 3D stacking approach minimizes interconnect distance, significantly reduces signal latency and power consumption compared to traditional 2D and 2.5D designs.
