• Tuesday | 22 September 2026
Korean Researchers Achieve Direct Photon Interference Between Distinct Quantum Light Sources

Large-scale quantum communication networks require both reliable quantum memories and coherent single-photon sources for efficient quantum information exchange. While various single-photon sources have been developed recently, each has inherent limitations, making a scalable and functional quantum network challenging to achieve. Hybrid quantum architectures that combine different quantum light so...

3 Aug 2026 | Monday | NEWS
MetaOptics and Elsoft Partner to Develop 12-Inch Metalens Manufacturing and Test Equipment

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") and Elsoft Research Berhad (Bursa Malaysia: 0090) ("Elsoft") jointly announced a strategic partnership to co-develop and mass produce the next generation of 12-inch large format precision, high speed metalens laser writers and leading-edge automatic testers that could sort meta...

3 Aug 2026 | Monday | NEWS
Quectel’s Morse Micro-Based Wi-Fi HaLow Module Achieves Global Certification for Mass Production

Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale. The FGH200M, built around Morse Micro's second-generation MM8108 Wi-Fi HaLow system...

3 Aug 2026 | Monday | NEWS
Renesas Launches Third-Generation DDR5 MRDIMM Chipset for AI and Cloud Servers

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions, delivering DDR5 server-class MRDIMM speeds up to 16,000 megatransfers per second (MT/s). The new solutions are designed to address the growing demand for higher memory bandwidth drive...

31 Jul 2026 | Friday | NEWS
Kioxia Begins Sampling 9th-Generation BiCS FLASH 1Tb TLC Memory for AI Devices

Kioxia Corporation, a world leader in memory solutions, announced it has commenced sample shipments of 1Tb (terabit) Triple-Level Cell (TLC) memory devices incorporating its 9th-generation BiCS FLASH™ 3D flash memory technology. The devices are designed to support applications such as AI-enabled PCs and smartphones with low- to mid-level storage capacities that require high performance. Kio...

31 Jul 2026 | Friday | NEWS
Toshiba Begins Mass Production of TXZ+ M4L Microcontrollers for Smart Motor Control Applications

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has started mass production of TXZ+™ Family Entry‑Class M4L Group, compact microcontrollers featuring an Arm® Cortex®‑M4 core with a floating‑point unit (FPU) for next-generation home appliances, consumer products and industrial equipment. Demand is growing for energy efficiency, compact designs, IoT co...

31 Jul 2026 | Friday | NEWS
Kioxia Introduces UFS 5.0 Flash Memory to Accelerate On-Device AI Performance

Kioxia Corporation, a world leader in memory solutions, announced its UFS(1) 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices. The new solutions will be demonstrated next week at FMS: the Future of Memory and Storage and are now available as commercial samples in 1...

31 Jul 2026 | Friday | NEWS
CXMT Shares Surge 466% in Record Shanghai Debut, Cementing China's DRAM Ambitions

ChangXin Memory Technologies (CXMT), China's largest producer of dynamic random-access memory (DRAM) chips, saw its shares surge 466% in its market debut on the Shanghai Stock Exchange's STAR Market. The company raised 57.9 billion Chinese yuan ($8.6 billion) in what is Asia's biggest initial public offering (IPO) this year, according to a Russia Today (RT) report. [1] At the ...

31 Jul 2026 | Friday | NEWS
Muse Semiconductor and True Circuits Launch University IP Program for TSMC-Based Chip Design

Muse Semiconductor, a subsidiary of GS Microelectronics US, Inc. (GSME) and a leading provider of multi-project wafer (MPW) services, and True Circuits, Inc. (TCI), a leading provider of analog and mixed-signal intellectual property (IP) announced the formation of a University IP Access Program offering TCI Phased-Locked Loop (PLL) hard macros in select TSMC processes to students and research...

31 Jul 2026 | Friday | NEWS
PTSL Expands U.S. Semiconductor Test Business with Acquisition of Rucker and Kolls

Probe Test Solutions Ltd (PTSL), an established high-growth technology company and a world leader in delivering advanced Automated Test Equipment (“ATE”) test hardware solutions, announces the recent acquisition of Rucker and Kolls Inc (“R&K”), a U.S. probe card manufacturer. This represents the third acquisition by PTSL, following the earlier acquisition of Probe Techn...

30 Jul 2026 | Thursday | NEWS
AiBiz Deploys AMD EPYC CPUs to Power GPU-Free AI Defect Detection for Semiconductor Manufacturing

AiBiz, a six-year-old South Korean industrial-AI startup, is deploying AI to catch wafer defects before they cause failures — and it is doing so without the GPUs the industry has long assumed such work requires. AMD EPYC™ Server CPUs provided the performance the company needed to achieve this in a lightweight form without GPU acceleration. “We are a six-year-old startup,” ...

30 Jul 2026 | Thursday | NEWS
KIOXIA Unveils NX1 PCIe 5.0 SSDs with Direct Liquid Cooling for AI Data Centres

KIOXIA America, Inc. announced the KIOXIA NX1 Series of solid-state drives (SSDs), a new generation of E1.S PCIe® 5.0 NVMe™ data centre SSDs, and Kioxia’s first SSD with direct liquid cooling support. The KIOXIA NX1 Series features Kioxia’s next-generation, in-house developed controller architecture enabling unique capabilities today while providing a foundation for...

30 Jul 2026 | Thursday | NEWS
BrainChip Launches AKD1500 M.2 Module for Low-Power Plug-and-Play Edge AI

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a global leader in ultra-low power, fully digital, event-based neuromorphic AI, announced that its AKD1500 chip based on the Akida™ neuromorphic processor is now available in the compact M.2 form factor, enabling fanless, plug-and-play edge AI for industrial and commercial designs. The new AKD1500 M.2 module is positioned as a lo...

30 Jul 2026 | Thursday | NEWS
ScaleFlux Unveils PCIe Gen6 SSD and CXL Memory Controllers for AI and Cloud Infrastructure

ScaleFlux will introduce two next-generation PCIe® Gen6 silicon solutions at Future of Memory and Storage (FMS) 2026: the FC6116 PCIe Gen6 NVMe SSD Controller and the MC600 PCIe Gen6 CXL® 3.2 Type 3 Memory Controller. Together, these products expand ScaleFlux's portfolio of high-performance storage and memory controller technologies, enabling AI, hyperscale cl...

30 Jul 2026 | Thursday | NEWS
IonQ Receives Final Approval to Complete SkyWater Technology Acquisition

IonQ (NYSE: IONQ), the world’s leading quantum platform company, received final regulatory approval to complete its acquisition of SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based semiconductor foundry. As noted when the companies announced their definitive agreement in January 2026, this transaction is expected to enable IonQ to materially accelerate its quantum compu...

30 Jul 2026 | Thursday | NEWS
Axcelis Secures Purion XEmax Evaluation Win for Next-Generation PMIC Manufacturing

Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced the successful Purion XEmax™ high-energy implanter evaluation closure at a leading foundry. The system will be used for the production of Power Management Integrated Circuits (PMICs). President and CEO Russell Low commented, "We'r...

29 Jul 2026 | Wednesday | NEWS
Qnity Launches Advanced Thermal Interface Materials for AI and High-Power Semiconductor Applications

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the launch of two new thermal interface materials (TIM): Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler, and Tgrease™ 3000 thermal grease, both designed to help customers address increasingly complex thermal management chall...

29 Jul 2026 | Wednesday | NEWS
Micross to Acquire AEMtec to Expand Advanced Semiconductor Packaging and European Operations

Micross Components, Inc. ("Micross" or the "Company"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defence, space, medical and industrial applications and a portfolio company of Behrman Capital, announced that it has entered into a definitive agreement to acquire AEMtec GmbH ("AEMtec"). AEMtec is a leading provider of complex micro- and optoe...

29 Jul 2026 | Wednesday | NEWS
Keysight Certifies RFPro EM Design Software for Intel 14A and 18A-P Process Technologies

Keysight Technologies, Inc. (NYSE: KEYS) announced certification of its RFPro electromagnetic (EM) design software, part of the Keysight EDA Advanced Design System (ADS), for Intel 14A and Intel 18A-P process technologies. The certification gives radio frequency integrated circuit (RFIC) and mixed-signal designers confidence that their electromagnetic simulations accurately reflect Intel Foun...

29 Jul 2026 | Wednesday | NEWS
Tema Memory ETF Gains Early Exposure to CXMT Following Landmark IPO

Tema ETFs has strengthened the portfolio of its Tema Memory ETF (DISK) by adding shares of ChangXin Memory Technologies (CXMT) as one of its largest holdings immediately following the company's initial public offering (IPO). The addition gives CXMT a 10.56% portfolio weighting, making DISK the U.S.-listed ETF with the highest exposure to the Chinese memory chip manufacturer. The investment reflec...

29 Jul 2026 | Wednesday | NEWS

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