• Friday | 13 March 2026
LG Innotek Unveils Eco-Friendly Smart IC Substrate

LG Innotek (CEO Moon Hyuksoo) announced on that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) Substrate' featuring enhanced performance and reducing carbon emissions generated in its production by half.The smart IC substrate is an essential component for mounting IC chips that store information on smart cards, such as those in credit cards, electronic pass...

23 Dec 2025 | Tuesday | NEWS
JBD Launches “Roadrunner I” Full-Color Micro LED Projector

Global Micro LED microdisplay technology leader JBD has officially launched the "Roadrunner I" polychrome projector. As the inaugural product of the new "Roadrunner" series, "Roadrunner I" not only achieves breakthroughs in pixel size and optical efficiency, translating into a substantial advantage in overall form factor, but also elevates the visual experience to a new level and accelerates the p...

23 Dec 2025 | Tuesday | NEWS
Quick Logic Expands U.S. Government FPGA Contract

QuickLogic Corporation (NASDAQ: QUIK), a leading developer of embedded FPGA (eFPGA) Hard IP and User Tools, ruggedized FPGAs, and Endpoint AI/ML solutions, announces the scope of its Prime U.S. government contract for the development of Strategic Radiation Hardened (SRH), high reliability Field Programmable Gate Array (FPGA) technology to support identified and future Department of Defense (DoD) s...

23 Dec 2025 | Tuesday | NEWS
Zetta Joule Receives Aramco Support for Advanced High-Temperature SMR Project

Zetta Joule, Inc., an advanced small modular reactor company,  announced it has received formal support for its ZJ high-temperature gas-cooled reactor (HTGR) project from Aramco Services Company, an affiliate of Motiva Enterprises, LLC, which operates the largest refinery by throughput in the United States. Zetta Joule’s proposed ZJ research reactor is designed with the unique ability ...

22 Dec 2025 | Monday | NEWS
Lattice Semiconductor Releases Latest Sens AI™ Suite to Advance Low-Power Edge AI

Lattice Semiconductor (NASDAQ: LSCC), a leader in low-power programmable products, announced the release of the latest version of its sensAI™ solution suite, offering expanded support models, enhanced AI performance, and greater flexibility in deploying to a broader range of edge applications. With new purpose-built models, updated tools, and improved compatibility, sensAI by Lattice enables...

22 Dec 2025 | Monday | NEWS
Magic Eye Introduces Next-Generation ILT™ Evaluation Platform for Real-Time 3D Depth Sensing

Magic Eye a developer of advanced 3D depth sensing technology based on ILT™ (Invertible Light Technology) , will unveil a new high-resolution, real-time ILT evaluation system at the upcoming Consumer Electronics Show (CES) designed to enable customers to evaluate ILT performance, validate configurations and begin application development for robotics, low-cost LiDAR-class replacement and auto...

22 Dec 2025 | Monday | NEWS
MemryX Partners with Macnica to Expand Edge-AI Accelerator Adoption in Japan

MemryX Inc., a leading provider of high-performance AI accelerators for edge devices, announced a distribution and solutions partnership with Macnica, Inc., one of Japan's largest semiconductor distributors. The agreement builds on more than a year of collaboration supporting customer engagements across Japan's growing edge-AI markets and strengthens both companies' ability to scale deployments a...

22 Dec 2025 | Monday | NEWS
Open POWER Foundation Announces Winners of Microwatt Design Challenge

Open POWER Foundation, an open developer community for the POWER ISA, announces the winners of the Microwatt Design Challenge (Microwatt Momentum Hackathon), in collaboration with ChipFoundry. The challenge was open to a broad range of participants including hardware engineers, students, researchers, and developers within the Open POWER ecosystem. The Open POWER Foundation, in collaboration with ...

22 Dec 2025 | Monday | NEWS
AP Memory Advances S-SiCap™ Silicon Capacitor Portfolio for AI Servers and HPC Systems

AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories —discrete silicon capacitors and interposers with silicon...

19 Dec 2025 | Friday | NEWS
Meridian Innovation Launches Cheetah™ 50×50 LWIR Thermal Imaging Sensor for Mass-Market Adoption

Meridian Innovation, a global leader in CMOS-based thermal imaging solutions, is excited to announce the launch of Cheetah, a breakthrough 50×50 LWIR thermal imaging sensor engineered to deliver a new level of performance, compactness, and affordability for mass-market applications. Built on Meridian's proven SenXor® technology platform, Cheetah offers unrivalled price-performance, enab...

19 Dec 2025 | Friday | NEWS
Qualcomm Finalizes Alphawave Semi Acquisition to Accelerate Data Center Expansion

Qualcomm Incorporated (NASDAQ: QCOM) announced that it has completed its acquisition of Alphawave IP Group plc (AWE.L) (“Alphawave Semi”), approximately one quarter ahead of schedule. The acquisition of Alphawave Semi aims to further accelerate and provide key assets for Qualcomm's expansion into the data center. Tony Pialis, CEO and co-founder of Alphawave Semi, will lead the Qualcomm...

19 Dec 2025 | Friday | NEWS
Rigaku Introduces ONYX™ 3200 for High-Precision Semiconductor Bump and BEOL Metrology

Rigaku Corporation, a global partner in X-ray analytical systems solutions and a Rigaku Holdings Corporation company (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), announced the launch of the ONYX 3200, a new semiconductor metrology system for measuring the thickness, composition, and bump structures* in wafer-level processes. The system is designed to help m...

19 Dec 2025 | Friday | NEWS
SEMIFIVE Details IPO and Growth Strategy as Demand Accelerates for Custom AI ASICs

As demand shifts from general-purpose semiconductors toward AI ASICs, SEMIFIVE provides customized chip development solutions to fabless companies and device manufacturers. New orders have increased from KRW 57.2 billion in 2022 to KRW 123.9 billion in 2024, driven by Big-Tech-Ready high-performance AI ASIC technologies, a highly efficient and scalable design platform, and turnkey services. ...

18 Dec 2025 | Thursday | NEWS
GIBO Holdings Partners With E Total Technology to Develop AI Compute Centers in Malaysia

GIBO Holdings Ltd. announced a strategic collaboration with Malaysia-based technology and infrastructure solutions provider E Total Technology Sdn Bhd, under which the parties will work together on the planning, site sourcing, feasibility studies, and deployment of next-generation artificial intelligence compute centers in Malaysia. The project is expected to incorporate NVIDIA's most advanced h...

17 Dec 2025 | Wednesday | NEWS
AI Boom Powers Three-Year Surge in Semiconductor Equipment Spending Through 2027

Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing 13.7% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective...

17 Dec 2025 | Wednesday | NEWS
Quantum Computing Inc. to Acquire Luminar Semiconductor Unit for $110M in Cash

Luminar Technologies, Inc. a leading global technology company, announced that it has entered into an agreement with Quantum Computing Inc. (“QCi”) pursuant to which QCi will acquire Luminar Semiconductor, Inc. (“LSI”), a wholly owned subsidiary of Luminar, in an all-cash transaction valued at $110 million. QCi is an integrated photonics and quantum optics technology com...

17 Dec 2025 | Wednesday | NEWS
India Broadens Chip Incentives, Targeting Compound Semiconductors and Advanced Packaging Capabilities

Government of India has approved an expanded set of incentives aimed at accelerating domestic manufacturing of compound semiconductors and advanced packaging, marking a significant step in building strategic depth across critical technology supply chains. The enhanced support framework is designed to attract investment into high value segments such as compound semiconductors, wh...

16 Dec 2025 | Tuesday | NEWS
SK Hynix Reinforces Long-Term Semiconductor Strategy With Expanded Yongin Investment

SK Hynix has reaffirmed its long term commitment to semiconductor manufacturing with an expanded investment plan in the Yongin chip cluster, underlining confidence in the future trajectory of the global semiconductor industry. The move strengthens Yongin’s position as a strategic semiconductor hub, with the expanded footprint expected to support advanced memory production,...

16 Dec 2025 | Tuesday | NEWS
Taiwan Strengthens Semiconductor Leadership While Opening Doors to Global Capital

  Taiwan is reinforcing its position at the centre of the global semiconductor industry, combining deep rooted technological expertise with a renewed openness to foreign investment as demand for advanced chips continues to accelerate worldwide. The island’s semiconductor ecosystem is entering a new phase of expansion, marked by sustained capital inflows, capacity upgra...

16 Dec 2025 | Tuesday | NEWS
SEMIFIVE Secures Multiple AI Chip Design Wins in Japan, Establishes Tokyo Subsidiary

  - Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC- Establishes a subsidiary in Japan to strengthen global reach SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan. ...

15 Dec 2025 | Monday | NEWS

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