BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), a leading developer of ultra-low-power, fully digital, event-based neuromorphic AI, announced a strategic collaboration with ForwardEdge ASIC, a wholly owned subsidiary of Lockheed Martin (NYSE: LMT) specialising in advanced ASIC architecture and microelectronics development. Together, the companies are combining best-in-class AI ...
HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energ...
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials res...
At Embedded World 2026, branded semiconductor memory enterprise Longsys (301308.SZ) demonstrated its integrated storage innovation capabilities and dual business-model value under the theme "AI Storage for Embedded World". Automotive-grade Portfolio Powers Intelligent Vehicles With seven years of expertise in automotive-grade storage, Longsys has built comprehensive capabilities across chi...
Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...
Semiconductor equipment supplier E&R Engineering Corp. (8027.TW) announced its new office in Hillsboro, Portland. Following the establishment of its Phoenix, Arizona site, this second North American hub marks a milestone in providing localized support within the U.S. semiconductor ecosystem. Closer to Key Customers, with Order Visibility Extending to 2027 Driven by surging de...
Innatera, a specialist in neuromorphic computing for ultra-low-power edge AI, has partnered with Joya Design to deliver a commercially viable consumer audio solution powered by its Pulsar chip. The collaboration marks a significant step in transitioning brain-inspired computing from development into real-world product deployment. Joya Design has successfully integrated Innatera’s Pulsar mic...
Kinaxis® Inc. (TSX: KXS), a global leader in supply chain orchestration, announced a new milestone in advancing large-scale supply chain optimisation within the Kinaxis Maestro™ platform. Maestro already delivers high-performance optimisation across complex global supply chains, and Kinaxis is now extending that leadership by leveraging GPU acceleration powered by NVIDIA cuOpt&...
Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...
Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming launch of the IMX908, a 4K CMOS image sensor for security cameras featuring the industry's smallest 1.45 µm LOFIC pixels. * The new sensor utilises newly developed LOFIC pixels to achieve 96dB high dynamic range images with a single exposure at 4K resolution. This results in improved low-light performance...
At GTC 2026, Synopsys presented the outcomes of its ongoing collaboration with NVIDIA, highlighting how the integration of AI and accelerated computing is reshaping modern engineering and design processes. By combining its expertise in electronic design automation (EDA) and simulation with NVIDIA’s high-performance computing technologies, Synopsys is enabling organisations to tackle increas...
Tower Semiconductor has announced a strategic collaboration with Oriole Networks to accelerate the development of next-generation AI infrastructure, leveraging nanosecond optical circuit switching technology. The partnership brings together Oriole’s advanced networking architecture with Tower’s high-volume silicon photonics manufacturing platform. The objective is to commercialise opt...
Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...
Recent progress in fabrication tools and processing techniques is accelerating the development of gallium oxide (Ga₂O₃) as a promising material for next-generation power semiconductors. Researchers, including teams from leading academic and industrial institutions, have reported important breakthroughs that enhance how this material is grown and adapted for practical device applications. Gall...
Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs. Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platfo...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a family of 224Gbps per lane Transimpedance Amplifiers (TIAs) and Mach-Zehnder Modulator (MZM) drivers for half retimed (LRO), LPO, XPO, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) interconnect applications. ...
HyperLight Corporation (“HyperLight”) announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ Platform. The reference module was demonstrated with engineering and manufacturing support from Suzhou TFC Optical Communication Co., Ltd. (SZSE: 300394, or "TFC"). The reference des...
HyperLight Corporation, creator of the TFLN Chiplet™ platform, announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The new device is designed for ultra-wide modulation bandwidth, high signal fidelity, and stable operation control, enabling 448 Gbps per lane intensity-modulated-direct-detection (IMDD)...
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...
Next week at NVIDIA GTC 2026, KIOXIA America, Inc. will showcase its latest high-performance memory and solid-state drive (SSD) solutions designed to meet the growing demands of artificial intelligence (AI) workloads. As the premier global AI conference, GTC brings together developers, researchers, and business leaders to explore advances in accelerated computing and AI. At this ye...