• Monday | 09 February 2026
Tachyum begins action to defend TPU trademark against Google filing

-Tachyum® announced that it is beginning to take steps to defend the use of its registered TPU® trademark. Tachyum initially applied for trademark status in September 2015 and has held the rights to TPU (for its AI Tachyum Processing Unit) since October 2020. Google recently filed for similar trademark protection of Google TPU for its Tensor Processing Unit on November 21st of this ...

10 Dec 2025 | Wednesday | NEWS
Dai Nippon Printing unveils 10nm NIL template for 1.4nm generation logic semiconductors

-Dai Nippon Printing Co., Ltd. announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4nm generation and meets the miniaturization needs of cutting-edge logic semiconductors. Background and Aims In line with the shift to more sophisti...

10 Dec 2025 | Wednesday | NEWS
Toshiba adds 40V TCKE6 series eFuse ICs with advanced protection features

-Toshiba Electronic Devices & Storage Corporation (”Toshiba”) has added the 40V "TCKE6 series" products to its range of electronic fuses (eFuse ICs) that support multiple functions required for power line circuit protection. The five new products joining the lineup are “TCKE601RA,” “TCKE601RL,” “TCKE602RM,” “TCKE603RA,” and “T...

10 Dec 2025 | Wednesday | NEWS
UMC Secures Imec Silicon Photonics Technology To Accelerate 12 Inch Optical Chip Platform

  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s ...

9 Dec 2025 | Tuesday | NEWS
AWS Unveils Graviton5-Powered EC2 M9g Instances With Up to 25% Higher Performance

At AWS re:Invent, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), today announced Amazon EC2 M9g instances powered by the new Graviton5 chip.   Key takeaways New AWS Graviton5-based Amazon EC2 M9g instances deliver up to 25% higher performance than the previous generation. With 192 cores per chip and 5x larger cache, customers can scale...

8 Dec 2025 | Monday | NEWS
Rigaku Launches XTRAIA MF-3400 to Enable Nanoscale Film Measurement for Next-Generation Semiconductor Manufacturing

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhan...

8 Dec 2025 | Monday | NEWS
Linear Integrated Systems Launches LSBF862 to Replace and Outperform Discontinued NXP BF862

Linear Integrated Systems, Inc., a designer and manufacturer of precision discrete semiconductors, announces the release of the LSBF862, a low noise N-channel JFET engineered to replace and outperform the discontinued NXP BF862. When NXP discontinued the BF862, a popular low-noise N-channel JFET, customers faced lost support for legacy systems, the need to requalify new components, and unplan...

8 Dec 2025 | Monday | NEWS
Mitsubishi Electric Develops World’s First Microbubble-Driven Millimeter-Scale Flow Technology for Next-Generation Electronic Cooling

Mitsubishi Electric Corporation (TOKYO: 6503) announced  that it has developed the world’s first technology to generate millimeter-scale flow within a channel by using microbubbles with a diameter of 10μm as the driving source. Developed through joint research with Suzuki & Namura Laboratory at Faculty of Engineering and Graduate School of Engineering, Kyoto University, this te...

5 Dec 2025 | Friday | NEWS
Murata Launches 1.25kV C0G MLCC in Compact 1210 Size for SiC-Based Power Systems

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making ...

3 Dec 2025 | Wednesday | NEWS
Kioxia, Tsubakimoto Chain and EAGLYS Partner on AI-Driven Image Recognition System for Next-Gen Logistics Automation

-Kioxia America, Inc. announced a collaboration between Kioxia Corporation, Tsubakimoto Chain Co. (Tsubakimoto Chain) and EAGLYS Inc. (EAGLYS) to develop AI-driven image recognition technology that automatically identifies products moving through logistics workflows. This system supports advanced automation and efficiency in logistics, enabling organizations to respond quickly to changing...

3 Dec 2025 | Wednesday | NEWS
Mitsubishi Electric Launches New 4.5kV/1,200A HVIGBT Modules With Enhanced Isolation and Moisture Resistance

For highly efficient, reliable inverter systems in railcars and large industrial equipment Mitsubishi Electric Corporation (TOKYO: 6503) announced that it will launch new standard-isolation (6.0kVrms) and high-isolation (10.2kVrms) modules in its 4.5kV/1,200A XB Series of high-voltage insulated-gate bipolar transistors (HVIGBTs) on December 9. These new high-capacity power semiconduct...

3 Dec 2025 | Wednesday | NEWS
STRATIO Launches LS SWIR SDK with World’s First Ge-Based SWIR Sensor

STRATIO, a deep-tech company operating between Silicon Valley and Seoul, officially launched its LS SWIR SDK with the world’s first Germanium (Ge)-based short-wave infrared (SWIR) sensor. This milestone furthers the company’s vision “Advance Vision with Infrared-AI™” — a new way of seeing beyond human and conventional visible sensor limits. Unlike traditiona...

1 Dec 2025 | Monday | NEWS
Soitec Announces Validation of Its SmartSiC Substrates for SiC Power Devices

Soitec has announced that its SmartSiC technology has successfully completed formal validation for use in next generation silicon carbide power devices, marking a major milestone for the company’s rapidly expanding power electronics business. The validation confirms that SmartSiC substrates meet strict performance, reliability and manufacturability requirements demanded by leading device m...

28 Nov 2025 | Friday | NEWS
Sony Introduces LYTIA 901, a Large Format Mobile Sensor with Two Hundred Megapixel Power

Sony Semiconductor Solutions Corporation has announced the forthcoming release of the LYTIA 901, a 1/1.12-type large-format mobile image sensor offering approximately 200 effective megapixels. The new flagship device brings together Sony’s next-generation pixel architecture, advanced HDR technologies and an industry-first AI learning-based remosaicing engine mounted directly on the sensor....

28 Nov 2025 | Friday | NEWS
Sivers Semiconductors and Doosan Partner to Develop Scalable Ka-Band ESA Technology for Korea’s SATCOM Ecosystem

Collaboration aims to advance scalable electronically steerable array (ESA) technology for Korea's strategic satellite communications ecosystem Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies,  announced a new collaboration with Doosan Corporation, a global leader in advanced materials and manufacturing solutions, to develop scalable...

26 Nov 2025 | Wednesday | NEWS
Breker Verification Systems Enables Extreme-Coverage Verification of Frontgrade Gaisler’s Fault-Tolerant NOEL-V RISC-V Processor

Breker Verification Systems, whose portfolio solves challenges across the functional verification process for large, complex semiconductors and Frontgrade™ Technologies, a leading provider of high-reliability electronic solutions for space and national security missions today confirmed its RISC-V functional verification solutions were pivotal for verification of the NOEL-V, one of Front...

21 Nov 2025 | Friday | NEWS
IBM and University of Dayton Partner to Advance Next-Generation Semiconductor Research and Workforce Development

New semiconductor nanofabrication facility will support advanced research and workforce development opportunities IBM (NYSE: IBM) and the University of Dayton announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to advance critical technologies for the age of AI including AI hardware, advanced packag...

21 Nov 2025 | Friday | NEWS
Sivers and Tachyon Partner to Deliver Breakthrough 28GHz mmWave Connectivity with TRB02801 Integrated Circuit

Strategic Collaboration Uses Sivers' TRB02801 Integrated Circuit to Power Tachyon's Innovative Millimeter-Wave Solution Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a mass-production purchase order agreement valued at approximately $3 million with Tachyon Networks Inc. ("Tachyon"), a pioneering provider of affordab...

21 Nov 2025 | Friday | NEWS
Equinix and Lenovo Power Merck KGaA’s Digital Leap: New Supercomputer Accelerates Drug Discovery and Semiconductor Innovation

Equinix and Lenovo to provide digital foundation for Merck KGaA, Darmstadt, Germany— from accelerating drug discovery to pioneering new materials for next-generation semiconductor chips Equinix, Inc. (Nasdaq: EQIX), the world's digital infrastructure company®,  announced Merck KGaA, Darmstadt, Germany, a leading science and technology company, has successfully launched a ...

21 Nov 2025 | Friday | NEWS
BAE Systems Expands RH12 Storefront to Accelerate Next Generation Radiation Hardened Chip Development

RH12™ Storefront offers a one-stop-shop for new integrated circuits that withstand the harsh space environment  BAE Systems (LON: BA) has added new capabilities to its next-generation, radiation-hardened 12 nanometer (nm) Storefront. The RH12™ Storefront is an advanced and accessible integrated circuit development capability with a vast technology library to support a wide r...

20 Nov 2025 | Thursday | NEWS

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