• Sunday | 08 February 2026
Socionext Advances 3DIC Innovation with TSMC SoIC-X Tape-Out for AI and HPC Applications

Socionext, the Solution SoC company, announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of complete solutions for consumer, AI, and HPC data center applications that include chiplets, 2.5D, 3D, and 5.5D packaging. Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality sol...

28 Sep 2025 | Sunday | NEWS
ROHM Unveils World’s Lowest Power Ultra-Compact CMOS Op Amp for Space-Constrained Sensing Applications

ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...

27 Sep 2025 | Saturday | NEWS
Lam Research and JSR/Inpria Form Strategic Collaboration to Accelerate Next-Gen Semiconductor Patterning

Lam Research Corp. a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration...

27 Sep 2025 | Saturday | NEWS

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