Manz Asia and SUSS Partner to Advance Inkjet Solutions for Semiconductor Packaging
The collaboration aims to develop scalable inkjet processes that improve material efficiency and process flexibility while accelerating high-volume manufacturing for advanced and panel-level packaging.
A leading manufacturer of advanced semiconductor packaging equipment, Manz Asia, announced a strategic collaboration with SUSS, a leading manufacturer of equipment and process solutions for the semiconductor industry, to jointly advance next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications.
As semiconductor manufacturing moves toward higher integration, more complex structures and larger-format processing, manufacturers are seeking greater process flexibility, material efficiency and manufacturing scalability. Inkjet printing is gaining increasing attention as an enabling technology to address these requirements. Compared with conventional coating approaches, inkjet technology enables precise and selective material deposition, reduces material consumption, and simplifies process flows, creating new opportunities across advanced packaging and other high-value semiconductor manufacturing applications.
A key focus of the collaboration will be to jointly explore new inkjet applications, validate materials and processes, and develop scalable manufacturing approaches. Manz Asia contributes proven inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem, supported by an end-to-end inkjet development platform and a Lab-to-Fab approach spanning material and substrate preparation, printing, curing and process characterisation. SUSS brings deep semiconductor process expertise and global customer reach. Together, these complementary capabilities enable Manz Asia and SUSS to systematically evaluate and optimise processes, accelerate development and identify solutions tailored to specific semiconductor applications. The companies aim to shorten time-to-market and accelerate the transition of inkjet technology from advanced process development toward high-volume semiconductor manufacturing.
"Successfully commercialising new semiconductor technologies requires deep process expertise, strong application know-how and close alignment with customer roadmaps. By combining SUSS' semiconductor process experience with Manz Asia's inkjet expertise, we can accelerate technology development and reduce time-to-market for future solutions. At the same time, the collaboration strengthens our access to the emerging panel-level packaging ecosystem, an area we believe will play an increasingly important role in next-generation semiconductor manufacturing. This partnership supports our Ambition 2030 strategy by strengthening our technology portfolio, expanding our capabilities in advanced packaging and increasing our exposure to attractive semiconductor growth markets", said Burkhardt Frick, CEO of SUSS.
"Panel-level packaging is entering a new phase, driven by higher integration and increasingly complex structures. These developments are creating new demands for greater process flexibility, material efficiency and manufacturing scalability. Through our collaboration with SUSS, Manz Asia is combining its inkjet printing and manufacturing expertise with SUSS' semiconductor process capabilities and global customer reach. Together, we see strong potential to accelerate the transition of inkjet technology from advanced process development toward high-volume semiconductor manufacturing. This collaboration marks an important step toward delivering scalable, next-generation solutions for advanced packaging and future semiconductor applications," said Robert Lin, CEO of Manz Asia.
