Stäubli Introduces Mini-QD Connector and Advances UQD v2 Standard for Next-Gen Liquid Cooling in High-Performance Computing
The new micro quick-disconnect Mini-QD enables liquid cooling for 1.6 Tbps optical modules, while UQD v2 enhances interoperability and testing rigor, addressing thermal challenges in AI and HPC data centers.
New Mini-QD connector enables use of next-generation optical pluggable modules; UQD v2 specification enforces greater precision
As AI workloads push thermal limits in data centers higher than ever, Stäubli is leading a new phase of standardization in liquid-cooling technology designed for the next generation of high-performance computing.
At the Open Compute Project (OCP) Global Summit in October, a new, micro quick-disconnect connector, known as the Mini-QD, developed by Staubli, was introduced by Ciena as the enabler for Ciena's liquid-cooled OSFP module. Staubli will lead the standardization initiative for the Mini-QD, helping to progress applications that compact, high-performance liquid cooling. At the same event, OCP also announced the UQD v2 update, an evolution of the original Universal Quick Disconnect (UQD) standard first developed in 2020 by a working group including Stäubli, Parker, and CPC.
Miniaturized connector design brings liquid cooling to high-performance optical modules
The new Mini-QD technology enables the liquid cooling of next-generation optical pluggable modules such as OSFP and QSFP devices that are expected to reach up to 1.6 terabits per second by 2027, requiring a shift from traditional air cooling to liquid cooling.
By integrating liquid cooling directly into the pluggable optical module, the Mini-QD removes thermal constraints that limit bandwidth expansion and system density. The Mini-QD is designed for future scalability and interchangeability, allowing other manufacturers to adopt a common interface once standardized.
"As compute densities and power levels rise, it's no longer enough to innovate in isolation," said Nicolas Monnier, Head of IT Cooling at Stäubli. "The industry depends on open standards that evolve as quickly as the technologies they enable. Our work to lead the standardization of the Mini-QD with Ciena, and to help define the next generation of the UQD specification, shows how collaboration accelerates progress in a rapidly changing ecosystem."
UQD v2 sharpens testing, geometry, and interoperability standards
The UQD v2 update introduces more rigorous testing protocols, tighter flow-performance limits, and standardized mechanical geometry for blind-mate and manual connectors, advancements that improve cross compatibility and reliability across suppliers.
Together, the Mini-QD initiative and the UQD v2 specification support the growing demand for reliable, interoperable liquid cooling components in AI and high-performance computing environments.
